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Contents

README

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KBU806

MDD Microdiode Semiconductor · Bridge Rectifiers · KBU

KBU806 from MDD Microdiode Semiconductor, in a KBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 + power_out Positive DC output of the bridge rectifier (pin 1, marked + on the package drawing).
2 AC1 passive AC input terminal (marked ~ on the drawing); the bridge is rated for 600 V repetitive peak reverse voltage (VRRM) on the KBU806.
3 AC2 passive AC input terminal (marked ~ on the drawing); the bridge is rated for 420 V RMS (VRMS) on the KBU806.
4 - power_in Negative DC output of the bridge rectifier (pin 4, marked − on the package drawing), the DC return.

Key specifications

Parameter Value
Manufacturer MDD Microdiode Semiconductor
Package KBU
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 600 V 1
Maximum RMS voltage VRMS 420 V 1
Maximum DC blocking voltage VDC 600 V 1
Maximum average forward output rectified current I(AV) 8 A at TA=50 ℃ 1
Peak forward surge current IFSM 300 A 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) 1
Maximum instantaneous forward voltage drop per bridge element VF 1.1 V per bridge element at 8.0A 1
Maximum DC reverse current IR 10 μA TA=25°C at rated DC blocking voltage 1
Maximum DC reverse current IR 0.5 mA TA=125°C at rated DC blocking voltage 1
Operating junction temperature range TJ -55 150 °C 1
Storage temperature range TSTG -55 150 °C 1
Typical Junction Capacitance CJ 200 pF Note 1 1
Typical Thermal Resistance RθJA 2.7 °C/W Note 2 1

CAD (KiCad official)

  • Symbol: KBU806
  • Footprint: Diode_THT:Diode_Bridge_Vishay_KBU
  • 3D model: KBU (KiCad packages3D, STEP)
  • 3D model files: kbu806-etched.step / kbu806-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); kbu806.step / kbu806.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MDD Microdiode Semiconductor datasheet (2 pp, sha256 71c9e8b3a1c01d94, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF