TS3USB221DRCR from Texas Instruments, in a VSON-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	1D+	bidirectional	USB port 1, positive differential data line. Switched to/from the common D+ pin when S selects port 1 and OE is asserted low. 5.5V tolerant, high bandwidth (1GHz typ), RON = 6Ω max.
2	1D-	bidirectional	USB port 1, negative differential data line. Switched to/from the common D- pin when S selects port 1 and OE is asserted low. 5.5V tolerant, RON = 6Ω max.
3	2D+	bidirectional	USB port 2, positive differential data line. Switched to/from the common D+ pin when S selects port 2 and OE is asserted low. 5.5V tolerant, RON = 6Ω max.
4	2D-	bidirectional	USB port 2, negative differential data line. Switched to/from the common D- pin when S selects port 2 and OE is asserted low. 5.5V tolerant, RON = 6Ω max.
5	GND	power_in	Ground return for the device. Also the thermal pad reference on the DRC (VSON) package.
6	OE	input	Active-low bus-switch enable (OE, overbar). When low, the selected USB switch is enabled; when high, all switches are disabled and the device enters low-power mode (ICC = 1µA typ). 1.8V-compatible CMOS input; VIH = 0.46VCC min, VIL = 0.25VCC max.
7	D-	bidirectional	Common USB port, negative differential data line. Connects to either 1D- or 2D- based on the S select input while OE is asserted low. 5.5V tolerant, RON = 6Ω max.
8	D+	bidirectional	Common USB port, positive differential data line. Connects to either 1D+ or 2D+ based on the S select input while OE is asserted low. 5.5V tolerant, RON = 6Ω max.
9	S	input	Port select input. S=Low routes common D+/D- to 1D+/1D-; S=High routes common D+/D- to 2D+/2D- (when OE is low). 1.8V-compatible CMOS input; VIH = 0.46VCC min, VIL = 0.25VCC max.
10	VCC	power_in	Supply voltage input. Recommended operating range 2.3V to 3.6V (absolute max 4.6V). Bypass with a local decoupling capacitor to GND.
11	Thermal Pad	power_in	Exposed thermal pad on the underside of the DRC (VSON) package. Recommended to be soldered to the PCB GND plane for thermal dissipation and mechanical stability.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	VSON-10-EP(3x3)
Category	Interface
Pins	11

Ordering variants

Same part, different packaging or reel option.

TS3USB221DRCR
TS3USB221DRCRDRCT
TS3USB221DRCRRSE
TS3USB221DRCRRSER
TS3USB221DRCRRSET

CAD (KiCad official)

Symbol: TS3USB221DRCR
Footprint: Package_SON:VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm
3D model: VSON-10-EP(3x3) (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (30 pp, sha256 d9a67a66485573ed, retrieved 2026-08-17, tier: manufacturer)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF