component
DRV8829PWPR
Public Made by Adomby adom
Texas Instruments Global Sourcing Parts, TSSOP-28-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownDRV8829PWPR
Texas Instruments · Global Sourcing Parts · TSSOP-28-EP
DRV8829PWPR from Texas Instruments, in a TSSOP-28-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CP1 | bidirectional | Charge pump flying capacitor; connect a 0.01-μF to 50-V capacitor between CP1 and CP2. |
| 2 | CP2 | bidirectional | Charge pump flying capacitor; connect a 0.01-μF to 50-V capacitor between CP1 and CP2. |
| 3 | VCP | bidirectional | High-side gate drive voltage; connect a 0.1-μF to 16-V ceramic capacitor and 1-MΩ resistor to VM. |
| 4 | VM | power_in | Bridge power supply (8.2 V to 45 V); both pins must be connected to same supply. |
| 5 | OUT1 | output | Bridge output 1; connect to motor winding; both OUT1 pins must be connected together on PCB. |
| 6 | ISEN | bidirectional | Bridge ground / current sense; connect to current sense resistor; both ISEN pins must be connected together on PCB. |
| 7 | OUT2 | output | Bridge output 2; connect to motor winding; both OUT2 pins must be connected together on PCB. |
| 8 | OUT2 | output | Bridge output 2; connect to motor winding; both OUT2 pins must be connected together on PCB. |
| 9 | ISEN | bidirectional | Bridge ground / current sense; connect to current sense resistor; both ISEN pins must be connected together on PCB. |
| 10 | OUT1 | output | Bridge output 1; connect to motor winding; both OUT1 pins must be connected together on PCB. |
| 11 | VM | power_in | Bridge power supply (8.2 V to 45 V); both pins must be connected to same supply. |
| 12 | VREF | power_in | Reference voltage for winding current set (recommended 1 V to 3.5 V); both VREF pins must be connected together on PCB. |
| 13 | VREF | power_in | Reference voltage for winding current set (recommended 1 V to 3.5 V); both VREF pins must be connected together on PCB. |
| 14 | GND | power_in | Device ground. |
| 15 | V3P3OUT | output | 3.3-V regulator output; bypass to GND with 0.47-μF to 6.3-V ceramic capacitor; can be used to supply VREF. |
| 16 | nRESET | input | Active-low reset input initializes internal logic and disables H-bridge outputs; internal pulldown. |
| 17 | nSLEEP | input | Sleep mode input; logic high to enable device, logic low to enter low-power sleep mode; internal pulldown. |
| 18 | nFAULT | output | Open-drain fault output; logic low when in fault condition (overtemperature or overcurrent). |
| 19 | DECAY | input | Decay mode select; low = slow decay, open = mixed decay, high = fast decay; internal pulldown and pullup. |
| 20 | PHASE | input | Bridge phase (direction); logic high sets OUT1 high and OUT2 low; internal pulldown. |
| 21 | ENBL | input | Bridge enable; logic high to enable H-bridge; internal pulldown. |
| 22 | NC | unconnected | Not connected. |
| 23 | I0 | input | Current set input bit 0; sets winding current as percentage of full-scale; internal pulldown. |
| 24 | I1 | input | Current set input bit 1; sets winding current as percentage of full-scale; internal pulldown. |
| 25 | I2 | input | Current set input bit 2; sets winding current as percentage of full-scale; internal pulldown. |
| 26 | I3 | input | Current set input bit 3; sets winding current as percentage of full-scale; internal pulldown. |
| 27 | I4 | input | Current set input bit 4; sets winding current as percentage of full-scale; internal pulldown. |
| 28 | GND | power_in | Device ground; PowerPAD thermal pad connection. |
| 29 | PowerPAD | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | TSSOP-28-EP |
| Category | Global Sourcing Parts |
| Pins | 29 |
CAD (KiCad official)
- Symbol:
DRV8829PWPR - Footprint:
Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm - 3D model: TSSOP-28-EP (KiCad packages3D, STEP)
- 3D model files:
drv8829pwpr-etched.step/drv8829pwpr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);drv8829pwpr.step/drv8829pwpr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (27 pp, sha256
45a3ea3b9ce39ba4, retrieved 2026-10-06, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).