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Contents

README

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H11D1

Vishay Intertech · Transistor, Photovoltaic Output Optoisolators · DIP-6

H11D1 from Vishay Intertech, in a DIP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the GaAs infrared emitting diode; forward current max 60 mA, forward voltage 1.2 V typ at IF = 10 mA, reverse voltage max 6 V.
2 C passive Cathode of the infrared emitting diode (input side).
3 NC unconnected No internal connection.
4 E passive Phototransistor emitter; emitter base voltage max 7 V.
5 C passive Phototransistor collector; VCEO max 300 V (H11D1/H11D2) or 200 V (H11D3), collector current max 50 mA.
6 B passive Phototransistor base connection; collector base voltage max 300 V (H11D1/H11D2) or 200 V (H11D3), tested with RBE = 1 MΩ.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package DIP-6
Category Optoisolators
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward voltage VF 1.2 1.5 V IF = 10 mA 2
Reverse voltage VR 6 V IR = 10 μA 2
Reverse current IR 0.01 10 μA VR = 6 V 2
Collector emitter breakdown voltage BVCEO 300 V ICE = 1 mA, RBE = 1 MΩ 2
Emitter base breakdown voltage BVEBO 7 V IEB = 10 μA 2
Collector emitter saturation voltage VCEsat 0.25 0.4 V IF = 10 mA, IC = 0.5 mA, RBE = 1 MΩ 3
Collector emitter leakage current ICEO 100 nA VCE = 200 V, RBE = 1 MΩ 3
Current transfer ratio CTR 20 % IF = 10 mA, VCE = 10 V 3
Reverse voltage VR 6 V Tamb = 25 °C 2
Input forward current IF 60 mA Tamb = 25 °C 2
Input power dissipation Pdiss 100 mW Tamb = 25 °C 2
Collector emitter voltage VCEO 300 V H11D1, Tamb = 25 °C 2
Collector base voltage VCBO 300 V H11D1, Tamb = 25 °C 2
Emitter base voltage VEBO 7 V Tamb = 25 °C 2
Collector current IC 50 mA Tamb = 25 °C 2
Output power dissipation Pdiss 150 mW Tamb = 25 °C 2
Storage temperature range Tstg -55 125 °C 2
Operating temperature range Tamb -55 100 °C 2
Soldering temperature Tsld 260 °C t = 10 s 2
Maximum rated withstanding isolation voltage VISO 5000 VRMS According to UL1577, t = 1 min 3
Input capacitance CI 30 pF VR = 0 V, f = 1 kHz 2
Coupling capacitance CIO 0.6 pF V = 0 V, f = 1 MHz 3
Turn-on time ton 4 μs IC = 2 mA, RL = 100 Ω, VCC = 5 V 3
Turn-off time toff 5 μs IC = 2 mA, RL = 100 Ω, VCC = 5 V 3

CAD (KiCad official)

  • Symbol: H11D1
  • Footprint: Package_DIP:DIP-6_W7.62mm
  • 3D model: DIP-6 (KiCad packages3D, STEP)
  • 3D model files: h11d1-etched.step / h11d1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); h11d1.step / h11d1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (10 pp, sha256 febde76e66614e10, retrieved 2026-10-26, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF