component
AD7401AYRWZ-RL
Public Made by Adomby adom
Analog Devices ADCs/DACs - Special Purpose, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAD7401AYRWZ-RL
Analog Devices · ADCs/DACs - Special Purpose · SOIC-16-300mil
AD7401AYRWZ-RL from Analog Devices, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | Supply voltage for the isolated side, 4.5 V to 5.5 V, relative to GND1. |
| 2 | VIN+ | power_in | Positive analog input with a specified range of ±250 mV. |
| 3 | VIN− | power_in | Negative analog input, normally connected to GND1. |
| 4 | NC | unconnected | No connect. |
| 5 | NC | unconnected | No connect. |
| 6 | NC | unconnected | No connect. |
| 7 | VDD1/NC | power_in | Isolated-side supply voltage of 4.5 V to 5.5 V relative to GND1; the pin may be left floating but must not be tied to ground, as the device operates normally when supply is applied to pin 1. |
| 8 | GND1 | power_in | Ground reference point for all circuitry on the isolated side. |
| 9 | GND2 | power_in | Ground reference point for all circuitry on the nonisolated side. |
| 10 | NC | unconnected | No connect. |
| 11 | MDAT | output | Serial data output carrying the single-bit modulator stream, clocked out on the MCLKIN rising edge and valid on the following MCLKIN rising edge. |
| 12 | NC | unconnected | No connect. |
| 13 | MCLKIN | input | Master clock logic input, 20 MHz maximum; the modulator bit stream is valid on its rising edge. |
| 14 | VDD2 | power_in | Supply voltage for the nonisolated side, 3 V to 5.5 V, relative to GND2. |
| 15 | NC | unconnected | No connect. |
| 16 | GND2 | power_in | Ground reference point for all circuitry on the nonisolated side. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | SOIC-16-300mil |
| Category | Data Acquisition |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Integral Nonlinearity (INL) | INL | -7 | 1.5 | 7 | LSB | VIN+ = ±200 mV, TA = −40°C to +85°C, fMCLKIN = 20 MHz max | 3 |
| Integral Nonlinearity (INL) | INL | -13 | 2 | 13 | LSB | VIN+ = ±250 mV, TA = −40°C to +85°C, fMCLKIN = 20 MHz max | 3 |
| Integral Nonlinearity (INL) | INL | -11 | 1.5 | 11 | LSB | VIN+ = ±200 mV, TA = −40°C to +125°C, fMCLKIN = 20 MHz max | 3 |
| Integral Nonlinearity (INL) | INL | -46 | 2 | 46 | LSB | VIN+ = ±250 mV, TA = −40°C to +125°C, fMCLKIN = 20 MHz max | 3 |
| Offset Error | -0.5 | 0.025 | 0.5 | mV | fMCLKIN = 20 MHz max, VIN+ = −250 mV to +250 mV | 3 | |
| Offset Drift vs. Temperature | 1 | 3.5 | µV/°C | 3 | |||
| Gain Error | -1.5 | 0.07 | 1.5 | mV | 3 | ||
| Gain Error | -1 | 1 | mV | fMCLKIN = 20 MHz max, VIN+ = −250 mV to +250 mV | 3 | ||
| Input Voltage Range | -200 | 250 | 200 | mV | For specified performance; full range ±320 mV | 3 | |
| Dynamic Input Current | -18 | 13 | 18 | µA | VIN+ = 500 mV, VIN− = 0 V, fMCLKIN = 20 MHz max | 3 | |
| Dynamic Input Current | -15 | 10 | 15 | µA | VIN+ = 400 mV, VIN− = 0 V, fMCLKIN = 20 MHz max | 3 | |
| DC Leakage Current | -0.6 | 0.01 | 0.6 | µA | 3 | ||
| Input Current | IIN | -0.5 | 0.5 | µA | 3 | ||
| Signal-to-(Noise+Distortion) Ratio (SINAD) | SINAD | 76 | 82 | dB | VIN+ = ±200 mV, TA = −40°C to +85°C, fMCLKIN = 5 MHz to 20 MHz | 3 | |
| Signal-to-(Noise+Distortion) Ratio (SINAD) | SINAD | 71 | 82 | dB | VIN+ = ±250 mV, TA = −40°C to +85°C, fMCLKIN = 5 MHz to 20 MHz | 3 | |
| Signal-to-(Noise+Distortion) Ratio (SINAD) | SINAD | 72 | 82 | dB | VIN+ = ±200 mV, TA = −40°C to +125°C, fMCLKIN = 5 MHz to 20 MHz | 3 | |
| Signal-to-Noise Ratio (SNR) | SNR | 81 | 83 | dB | VIN+ = ±250 mV, TA = −40°C to +125°C, fMCLKIN = 5 MHz to 20 MHz | 3 | |
| Signal-to-Noise Ratio (SNR) | SNR | 80 | 82 | dB | VIN+ = ±200 mV, TA = −40°C to +125°C, fMCLKIN = 5 MHz to 20 MHz | 3 | |
| Effective Number of Bits (ENOB) | ENOB | 12.3 | 13.3 | Bits | 3 | ||
| Isolation Transient Immunity | 25 | 30 | kV/µs | 3 | |||
| Input-to-Output Momentary Withstand Voltage | VISO | 5000 | V | 1-minute duration | 6 | ||
| Minimum External Air Gap (Clearance) | L(I01) | 7.8 | mm | Measured from input terminals to output terminals, shortest distance through air | 6 | ||
| Minimum External Tracking (Creepage) | L(I02) | 7.8 | mm | Measured from input terminals to output terminals, shortest distance path along body | 6 | ||
| Minimum Internal Gap (Internal Clearance) | 0.017 | mm | Insulation distance through insulation | 6 | |||
| Maximum Working Voltage, AC Bipolar Waveform | 565 | V peak | 50-year minimum lifetime | 8 | |||
| Maximum Working Voltage, AC Unipolar Waveform | 891 | V peak | Maximum CSA/VDE approved working voltage | 8 | |||
| Maximum Working Voltage, DC | 891 | V | Maximum CSA/VDE approved working voltage | 8 | |||
| Case Temperature (safety-limiting) | TS | 150 | °C | Safety-limiting value, maximum allowed in event of failure | 7 | ||
| Side 1 Current (safety-limiting) | IS1 | 265 | mA | Safety-limiting value, maximum allowed in event of failure | 7 | ||
| Side 2 Current (safety-limiting) | IS2 | 335 | mA | Safety-limiting value, maximum allowed in event of failure | 7 | ||
| VDD1 to GND1 | -0.3 | 6.5 | V | TA = 25°C, unless otherwise noted | 8 | ||
| VDD2 to GND2 | -0.3 | 6.5 | V | TA = 25°C, unless otherwise noted | 8 | ||
| Analog Input Voltage to GND1 | -0.3 | V | Upper limit printed as VDD1 + 0.3 V | 8 | |||
| Digital Input Voltage to GND2 | -0.3 | V | Upper limit printed as VDD1 + 0.5 V | 8 | |||
| Output Voltage to GND2 | -0.3 | V | Upper limit printed as VDD2 + 0.3 V | 8 | |||
| Input Current to Any Pin Except Supplies | -10 | 10 | mA | 8 | |||
| Storage Temperature Range | -65 | 150 | °C | 8 | |||
| Junction Temperature | 150 | °C | 8 | ||||
| Pb-Free Temperature, Soldering Reflow | 260 | °C | Reflow | 8 | |||
| Supply Voltage VDD1 (isolated side) | VDD1 | 4.5 | 5.5 | V | Relative to GND1; supply for isolated side | 9 | |
| Supply Voltage VDD2 (nonisolated side) | VDD2 | 3 | 5.5 | V | Relative to GND2; supply for nonisolated side | 9 | |
| Operating Temperature Range | -40 | 125 | °C | 8 | |||
| Master Clock Frequency (MCLKIN) | fMCLKIN | 20 | MHz | Master clock logic input, maximum | 9 | ||
| Thermal Impedance, Junction-to-Ambient (SOIC) | θJA | 89.2 | °C/W | SOIC package; EDEC 2S2P standard board | 8 | ||
| Thermal Impedance, Junction-to-Case (SOIC) | θJC | 55.6 | °C/W | SOIC package; EDEC 2S2P standard board | 8 |
CAD (KiCad official)
- Symbol:
AD7401AYRWZ-RL - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files:
ad7401ayrwz-rl-etched.step/ad7401ayrwz-rl-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ad7401ayrwz-rl.step/ad7401ayrwz-rl.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (20 pp, sha256
9037715d2c41de7c, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).