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README

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TPS65263RHBT

Texas Instruments · DC-DC Converters · VQFN-32-EP(5x5)

TPS65263RHBT from Texas Instruments, in a VQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN3 input Enable for buck3; float to enable, and a resistor divider on this pin can set the buck3 input UVLO.
2 SDA bidirectional I2C interface data pin; absolute maximum is 7 V and recommended operating range is -0.1 V to 6.3 V.
3 SCL input I2C interface clock pin; absolute maximum is 7 V and recommended operating range is -0.1 V to 6.3 V.
4 AGND power_in Analog ground shared by the buck controllers and analog circuits, routed separately from high-current power grounds to the (-) terminal of the VIN bypass capacitor.
5 VOUT2 input Buck2 output voltage sense pin; absolute maximum is 7 V.
6 FB2 input Kelvin feedback sense pin for buck2 that connects to the buck2 resistor divider; recommended range is -0.1 V to 3 V.
7 COMP2 passive Buck2 error amplifier output and loop compensation pin, compensated with a series resistor and capacitor in peak current PWM mode.
8 SS2 passive Buck2 soft-start and tracking input with an internal 5 µA pullup; soft-start time is set by a capacitor to ground.
9 BST2 passive Bootstrap supply for the buck2 high-side gate driver; a 47 nF capacitor (recommended) connects from BST2 to LX2.
10 LX2 passive Buck2 switching node to the inductor and bootstrap capacitor, swinging from a diode drop below ground up to the PVIN2 voltage.
11 PGND2 power_in Buck2 power ground, to be placed as close as practical to the (-) terminal of the PVIN2 input ceramic capacitor.
12 PVIN2 power_in Buck2 input power supply, placed close to the input ceramic capacitor (suggested 10 µF); recommended input range is 4.5 V to 18 V.
13 PVIN3 power_in Buck3 input power supply, placed close to the input ceramic capacitor (suggested 10 µF); recommended input range is 4.5 V to 18 V.
14 PGND3 power_in Buck3 power ground, to be placed as close as practical to the (-) terminal of the PVIN3 input ceramic capacitor.
15 LX3 passive Buck3 switching node to the inductor and bootstrap capacitor, swinging from a diode drop below ground up to the PVIN3 voltage.
16 BST3 passive Bootstrap supply for the buck3 high-side gate driver; a 47 nF capacitor (recommended) connects from BST3 to LX3.
17 SS3 passive Buck3 soft-start and tracking input with an internal 5 µA pullup; soft-start time is set by a capacitor to ground.
18 COMP3 passive Buck3 error amplifier output and loop compensation pin, compensated with a series resistor and capacitor in peak current PWM mode.
19 FB3 input Kelvin feedback sense pin for buck3 that connects to the buck3 resistor divider; recommended range is -0.1 V to 3 V.
20 VOUT3 input Buck3 output voltage sense pin; absolute maximum is 7 V.
21 VOUT1 input Buck1 output voltage sense pin; absolute maximum is 7 V.
22 FB1 input Kelvin feedback sense pin for buck1 that connects to the buck1 resistor divider; recommended range is -0.1 V to 3 V.
23 COMP1 passive Buck1 error amplifier output and loop compensation pin, compensated with a series resistor and capacitor in peak current PWM mode.
24 SS1 passive Buck1 soft-start and tracking input with an internal 5 µA pullup; soft-start time is set by a capacitor to ground.
25 BST1 passive Bootstrap supply for the buck1 high-side gate driver; a 47 nF capacitor (recommended) connects from BST1 to LX1.
26 LX1 passive Buck1 switching node to the inductor and bootstrap capacitor, swinging from a diode drop below ground up to the PVIN1 voltage.
27 PGND1 power_in Buck1 power ground, to be placed as close as practical to the (-) terminal of the PVIN1 input ceramic capacitor.
28 PVIN1 power_in Buck1 input power supply, placed close to the input ceramic capacitor (suggested 10 µF); recommended input range is 4.5 V to 18 V.
29 VIN power_in Buck controller power supply; recommended input range is 4.5 V to 18 V.
30 V7V power_out Internal LDO output for the gate driver and internal controller; connect a 10 µF capacitor from this pin to power ground.
31 EN1 input Enable for buck1; float to enable, and a resistor divider on this pin can adjust the buck1 input UVLO.
32 EN2 input Enable for buck2; float to enable, and a resistor divider on this pin can adjust the buck2 input UVLO.
33 PAD passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-32-EP(5x5)
Category Power Management (PMIC)
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Voltage PVIN1, PVIN2, PVIN3, VIN PVIN1, PVIN2, PVIN3, VIN -0.3 20 V 6
Voltage LX1, LX2, LX3 LX1, LX2, LX3 -1 20 V maximum withstand voltage transient <20 ns 6
Voltage BST1, BST2, BST3 BST1, BST2, BST3 -0.3 7 V referenced to LX1, LX2, LX3 pins respectively 6
Voltage EN1, EN2, EN3, V7V, VOUT1, VOUT2, VOUT3, SCL, SDA EN1, EN2, EN3, V7V, VOUT1, VOUT2, VOUT3, SCL, SDA -0.3 7 V 6
Voltage FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3 FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3 -0.3 3.6 V 6
Voltage AGND, PGND1, PGND2, PGND3 AGND, PGND1, PGND2, PGND3 -0.3 0.3 V 6
Operating junction temperature TJ -40 125 °C 6
Storage temperature range Tstg -55 150 °C 6
Input voltage range PVIN1, PVIN2, PVIN3, VIN PVIN1, PVIN2, PVIN3, VIN 4.5 18 V 6
Voltage LX1, LX2, LX3 LX1, LX2, LX3 -0.8 18 V Maximum withstand voltage transient <20 ns 6
Voltage BST1, BST2, BST3 BST1, BST2, BST3 -0.1 6.8 V referenced to LX1, LX2, LX3 pins respectively 6
Voltage EN1, EN2, EN3, V7V, VOUT1, VOUT2, VOUT3, SCL, SDA EN1, EN2, EN3, V7V, VOUT1, VOUT2, VOUT3, SCL, SDA -0.1 6.3 V 6
Voltage FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3 FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3 -0.1 3 V 6
Operating ambient temperature TA -40 85 °C 6
Operating junction temperature TJ -40 125 °C 6
Junction-to-ambient thermal resistance RθJA 33.3 °C/W RHB (32 pins) package 6
Junction-to-case (top) thermal resistance RθJC(top) 25.7 °C/W RHB (32 pins) package 6
Junction-to-board thermal resistance RθJB 7.4 °C/W RHB (32 pins) package 6
Junction-to-top characterization parameter ψJT 0.3 °C/W RHB (32 pins) package 6
Junction-to-board characterization parameter ψJB 7.3 °C/W RHB (32 pins) package 6
Junction-to-case (bottom) thermal resistance RθJC(bot) 2.1 °C/W RHB (32 pins) package 6
V7V LDO output voltage V7V 6 6.3 6.6 V V7V load current = 0 A 7
VIN undervoltage lockout, rising UVLO 4 4.25 4.5 V VIN rising 7
VIN undervoltage lockout, falling UVLO 3.5 3.75 4 V VIN falling 7
Feedback voltage VFB 0.595 0.6 0.605 V VCOMP = 1.2 V, TJ = 25°C 7
Feedback voltage VFB 0.594 0.6 0.606 V VCOMP = 1.2 V, TJ = –40°C to 125°C 7
Soft start charging current ISSX 4.3 5 6 µA 7
Buck1 peak inductor current limit ILIMIT1 4.5 5.5 6.5 A 7
Buck2/3 peak inductor current limit ILIMIT2/3 2.6 3.3 4 A 7
Switching frequency FSW 550 600 650 kHz 7
Input high voltage SDA, SCL II -10 10 µA Input current SDA, SCL, VI = 0.4 to 4.5 V 8
Maximum SCL clock frequency ƒ(SCL) 400 kHz 8
Rise time of SCL signal tRCL 300 ns Capacitance of one bus line (pF) 20 + 0.1CB; not production tested 8
Rise time of SCL signal after a repeated START condition and after an acknowledge BIT tRCL1 300 ns Capacitance of one bus line (pF) 20 + 0.1CB; not production tested 8
Fall time of SCL signal tFCL 300 ns Capacitance of one bus line (pF) 20 + 0.1CB; not production tested 8
Rise time of SDA signal tRDA 300 ns Capacitance of one bus line (pF) 20 + 0.1CB; not production tested 8
Fall time of SDA signal tFDA 300 ns Capacitance of one bus line (pF) 20 + 0.1CB; not production tested 8

CAD (KiCad official)

  • Symbol: TPS65263RHBT
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: VQFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: tps65263rhbt-etched.step / tps65263rhbt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps65263rhbt.step / tps65263rhbt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (48 pp, sha256 68fb2fd65d5ab84d, retrieved 2026-10-10, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF