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MCP3208T-CI

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Microchip Tech Analog To Digital Converters (ADC), SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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MCP3208T-CI

Microchip Tech · Analog To Digital Converters (ADC) · SOIC-16

MCP3208T-CI from Microchip Tech, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CH0 input Analog input channel 0, programmable as a single-ended input or as the IN+ or IN- side of a pseudo-differential pair.
2 CH1 input Analog input channel 1, programmable as a single-ended input or as the IN+ or IN- side of a pseudo-differential pair.
3 CH2 input Analog input channel 2, programmable as a single-ended input or as the IN+ or IN- side of a pseudo-differential pair.
4 CH3 input Analog input channel 3, programmable as a single-ended input or as the IN+ or IN- side of a pseudo-differential pair.
5 CH4 input Analog input channel 4 (MCP3208 only), programmable as a single-ended input or as one side of a pseudo-differential pair.
6 CH5 input Analog input channel 5 (MCP3208 only), programmable as a single-ended input or as one side of a pseudo-differential pair.
7 CH6 input Analog input channel 6 (MCP3208 only), programmable as a single-ended input or as one side of a pseudo-differential pair.
8 CH7 input Analog input channel 7 (MCP3208 only), programmable as a single-ended input or as one side of a pseudo-differential pair.
9 DGND power_in Digital ground connection to the internal digital circuitry; the datasheet states it should be connected to the analog ground plane when a ground plane is available.
10 CS/SHDN input Pulled low to initiate communication with the device, and pulled high to end a conversion and place the device in low-power standby; it must be pulled high between conversions.
11 DIN input SPI serial data input used to load channel configuration data into the device.
12 DOUT output SPI serial data output that shifts out the A/D conversion results; data changes on the falling edge of each clock.
13 CLK input SPI serial clock that initiates a conversion and clocks out each bit of the conversion; minimum clock speed constraints are given in Section 6.2.
14 AGND power_in Analog ground connection to the internal analog circuitry.
15 VREF power_in Reference voltage input for the A/D converter.
16 VDD power_in Power supply input, +2.7V to 5.5V.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-16
Category Data Acquisition
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Conversion Time tCONV 12 clock cycles 2
Throughput Rate fSAMPLE 100 ksps VDD = VREF = 5V 2
Throughput Rate fSAMPLE 50 ksps VDD = VREF = 2.7V 2
Integral Nonlinearity (MCP3204/3208-C) INL -2 1 2 LSB MCP3204/3208-C 2
Differential Nonlinearity DNL -1 0.5 1 LSB No missing codes over-temperature 2
Offset Error -3 1.25 3 LSB 2
Gain Error -5 1.25 5 LSB 2
Reference Input Voltage Range 0.25 V Note 2 2
Current Drain (reference input, first row) 100 150 µA 2
Current Drain (reference input, second row) 0.001 3 µA 2
Input Voltage Range for IN- in pseudo-differential Mode (relative to VSS) -100 100 mV 3
Leakage Current -1 0.001 1 µA 3
High Level Input Voltage VIH 0.7 VDD 3
Low Level Input Voltage VIL 0.3 VDD 3
High Level Output Voltage VOH 4.1 V IOH = -1 mA, VDD = 4.5V 3
Low Level Output Voltage VOL 0.4 V IOL = 1 mA, VDD = 4.5V 3
Input Leakage Current ILI -10 10 µA VIN = VSS or VDD 3
Output Leakage Current ILO -10 10 µA VOUT = VSS or VDD 3
Pin Capacitance (All Inputs/Outputs) CIN,COUT 10 pF VDD = 5.0V (Note 1); TA = 25°C, f = 1 MHz 3
Clock Frequency fCLK 2 MHz VDD = 5V (Note 3) 3
Clock Frequency fCLK 1 MHz VDD = 2.7V (Note 3) 3
Clock High Time tHI 250 ns 3
Clock Low Time tLO 250 ns 3
CS Fall To First Rising CLK Edge tSUCS 100 ns 3
Data Input Setup Time tSU 50 ns 3
Data Input Hold Time tHD 50 ns 3
CLK Fall To Output Data Valid tDO 200 ns See Figures 1-2 and 1-3 3
CLK Fall To Output Enable tEN 200 ns See Figures 1-2 and 1-3 3
CS Rise To Output Disable tDIS 100 ns See Figures 1-2 and 1-3 3
CS Disable Time tCSH 500 ns 3
DOUT Rise Time tR 100 ns See Figures 1-2 and 1-3 (Note 1) 3
DOUT Fall Time tF 100 ns See Figures 1-2 and 1-3 (Note 1) 3
Operating Voltage VDD 2.7 5.5 V 3
Operating Current IDD 320 400 µA VDD=VREF = 5V, DOUT unloaded 3
Standby Current IDDS 0.5 2 µA CS = VDD = 5.0V 3
Specified Temperature Range TA -40 125 °C 4
Operating Temperature Range TA -40 125 °C 4
Storage Temperature Range TA -65 150 °C 4
Supply voltage absolute maximum VDD 7 V 2
All inputs and outputs w.r.t. VSS -0.6 V max is VDD +0.6V 2
Storage temperature -65 150 °C 2
Ambient temperature with power applied -65 125 °C 2
Soldering temperature of leads 300 °C 10 seconds 2
ESD protection on all pins 4 kV all pins; printed as > 4 kV 2
Thermal Resistance, 16L-SOIC θJA 86.1 °C/W 16L-SOIC 4

CAD (KiCad official)

  • Symbol: MCP3208T-CI
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: mcp3208t-ci-etched.step / mcp3208t-ci-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mcp3208t-ci.step / mcp3208t-ci.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (40 pp, sha256 89bc1e17c35e2bb1, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF