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Contents

README

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HCB1608KF-000T40

TAI TECH · Ferrite Beads · 0603

HCB1608KF-000T40 from TAI TECH, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised inductor or ferrite bead; either orientation.
2 2 passive Terminal 2 of an unpolarised inductor or ferrite bead; either orientation.

Key specifications

Parameter Value
Manufacturer TAI TECH
Package 0603
Category Filters
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Impedance Z 12.5 Ω Test frequency printed as 60mV/100M 1
DC resistance RDC 0.03 Ω 1
Rated current 4000 mA Based on temperature rise test 1
Operating temperature -55 125 °C Including self-temperature rise 1
Storage temperature -55 125 °C On board; long storage see Application Notice 2
Temperature rise ΔT 40 °C Rated current ≥ 1A; applied DC current, measured by digital surface thermometer 2
Impedance change after life test Z -15 15 % Life test at 125±2℃, rated current, 1000±12 hrs 2
DC resistance change after life test RDC -15 15 % Life test at 125±2℃, rated current, 1000±12 hrs; must also not exceed spec value 2
Impedance change after thermal shock Z -15 15 % -55±2℃ to 125±2℃, 500 cycles 2
Impedance change after vibration Z -15 15 % 10Hz-2kHz-10Hz, 20 min per cycle, 12 cycles in each of 3 orientations 2
Impedance change after bending Z -10 10 % Bending depth 0.8mm (<0805 inch size), 10 s 2
Impedance change after shock Z -10 10 % Half-sine, 50 g peak, 11 ms, SMD 2
Impedance change after resistance to soldering heat Z -15 15 % Number of heat cycles: 1 3
Classification reflow temperature Tc 260 °C PB-free assembly, package thickness <1.6mm, volume <350 mm3; reflow 3 times max 4
Soldering iron tip temperature 350 °C 20 W iron, 1.0mm tip diameter max, 4-5 s limit 4

CAD (KiCad official)

  • Symbol: HCB1608KF-000T40
  • Footprint: Inductor_SMD:L_0603_1608Metric
  • 3D model: 0603 (KiCad packages3D, STEP)
  • 3D model files: hcb1608kf-000t40-etched.step / hcb1608kf-000t40-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hcb1608kf-000t40.step / hcb1608kf-000t40.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TAI TECH datasheet (6 pp, sha256 f352d622353ebc74, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF