component
MURA260T3G
Public Made by Adomby adom
onsemi Diodes - General Purpose, SMA(DO-214AC). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMURA260T3G
onsemi · Diodes - General Purpose · SMA(DO-214AC)
MURA260T3G from onsemi, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SMA(DO-214AC) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Repetitive Reverse Voltage | VRRM | 600 | V | 2 | |||
| Working Peak Reverse Voltage | VRWM | 600 | V | 2 | |||
| DC Blocking Voltage | VR | 600 | V | 2 | |||
| Average Rectified Forward Current | IF(AV) | 1 | A | TL = 145°C | 2 | ||
| Average Rectified Forward Current | IF(AV) | 2 | A | TL = 110°C | 2 | ||
| Non-Repetitive Peak Surge Current | IFSM | 30 | A | Surge at rated load, halfwave, single phase, 60 Hz | 2 | ||
| Operating Junction Temperature Range | TJ | -65 | 175 | °C | 2 | ||
| Maximum Instantaneous Forward Voltage | vF | 1.45 | V | iF = 2.0 A, TJ = 25°C | 2 | ||
| Maximum Instantaneous Forward Voltage | vF | 1.2 | V | iF = 2.0 A, TJ = 150°C | 2 | ||
| Maximum Instantaneous Reverse Current | iR | 5 | µA | Rated DC voltage, TJ = 25°C | 2 | ||
| Maximum Instantaneous Reverse Current | iR | 150 | µA | Rated DC voltage, TJ = 150°C | 2 | ||
| Maximum Reverse Recovery Time | trr | 75 | ns | iF = 1.0 A, di/dt = 50 A/µs | 2 | ||
| Thermal Resistance, Junction-to-Lead | PsiJL | 24 | °C/W | TL = 25°C (Note 1) | 2 | ||
| Thermal Resistance, Junction-to-Ambient | RJA | 216 | °C/W | Note 1: surface mounted on minimum pad size, PC board FR-4 | 2 |
CAD (KiCad official)
- Symbol:
MURA260T3G - Footprint:
Diode_SMD:D_SMA - 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files:
mura260t3g-etched.step/mura260t3g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mura260t3g.step/mura260t3g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (5 pp, sha256
b53657a358c11a57, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).