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README

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TPS65263-1QRHBTQ1

Texas Instruments · DC-DC Converters · VQFN-32-EP(5x5)

TPS65263-1QRHBTQ1 from Texas Instruments, in a VQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN3 input Enable for buck3; float to enable, and a resistor divider can set the buck3 input UVLO.
2 SDA bidirectional I2C interface data pin; float or connect to GND to disable I2C communication.
3 SCL input I2C interface clock pin; float or connect to GND to disable I2C communication.
4 AGND power_in Analog ground common to the buck controllers and other analog circuits, to be routed separately from high-current power grounds to the (-) terminal of the VIN bypass capacitor.
5 VOUT2 input Buck2 output voltage sense pin; absolute maximum rating is 7 V.
6 FB2 input Feedback Kelvin sensing pin for buck2 output voltage, connected to the buck2 resistor divider; the feedback reference is 0.6 V ±1%.
7 COMP2 passive Error amplifier output and loop compensation pin for buck2; a series resistor and capacitor compensate the peak current PWM loop.
8 SS2 passive Soft-start and tracking input for buck2 with an internal 5.2 µA pullup; soft-start time is set by a capacitor to ground.
9 BST2 passive Bootstrap supply for the buck2 high-side gate driver; connect a capacitor (recommended 47 nF) from BST2 to LX2.
10 LX2 output Buck2 switching node to the inductor and bootstrap capacitor; swings from a diode drop below ground up to the PVIN2 voltage.
11 PGND2 power_in Power ground for buck2; connect as close as practical to the (-) terminal of the VIN2 input ceramic capacitor.
12 PVIN2 power_in Input power supply for buck2; connect as close as practical to the (+) terminal of an input ceramic capacitor (suggested 10 µF).
13 PVIN3 power_in Input power supply for buck3; connect as close as practical to the (+) terminal of an input ceramic capacitor (suggested 10 µF).
14 PGND3 power_in Power ground for buck3; connect as close as practical to the (-) terminal of the VIN3 input ceramic capacitor.
15 LX3 output Buck3 switching node to the inductor and bootstrap capacitor; swings from a diode drop below ground up to the PVIN3 voltage.
16 BST3 passive Bootstrap supply for the buck3 high-side gate driver; connect a capacitor (recommended 47 nF) from BST3 to LX3.
17 SS3 passive Soft-start and tracking input for buck3 with an internal 5.2 µA pullup; soft-start time is set by a capacitor to ground.
18 COMP3 passive Error amplifier output and loop compensation pin for buck3; a series resistor and capacitor compensate the peak current PWM loop.
19 FB3 input Feedback Kelvin sensing pin for buck3 output voltage, connected to the buck3 resistor divider; the feedback reference is 0.6 V ±1%.
20 PGOOD output Output voltage supervision pin; asserted high when all bucks are within the PGOOD monitor regulation range; absolute maximum rating is 7 V.
21 ROSC passive Clock frequency adjustment pin; a resistor to ground sets the switching frequency (200 kHz to 2.3 MHz), and an external clock on this pin synchronizes the internal oscillator.
22 FB1 input Feedback Kelvin sensing pin for buck1 output voltage, connected to the buck1 resistor divider; the feedback reference is 0.6 V ±1%.
23 COMP1 passive Error amplifier output and loop compensation pin for buck1; a series resistor and capacitor compensate the peak current PWM loop.
24 SS1 passive Soft-start and tracking input for buck1 with an internal 5.2 µA pullup; soft-start time is set by a capacitor to ground.
25 BST1 passive Bootstrap supply for the buck1 high-side gate driver; connect a capacitor (recommended 47 nF) from BST1 to LX1.
26 LX1 output Buck1 switching node to the inductor and bootstrap capacitor; swings from a diode drop below ground up to the PVIN1 voltage.
27 PGND1 power_in Power ground for buck1; connect as close as practical to the (-) terminal of the VIN1 input ceramic capacitor.
28 PVIN1 power_in Input power supply for buck1; connect as close as practical to the (+) terminal of an input ceramic capacitor (suggested 10 µF).
29 VIN power_in Buck controller power supply; recommended operating range is 4 V to 18 V.
30 V7V power_out Internal LDO output for the gate driver and internal controller; connect a 10 µF ceramic capacitor from this pin to power ground.
31 EN1 input Enable for buck1; float to enable, and a resistor divider can set the buck1 input UVLO.
32 EN2 input Enable for buck2; float to enable, and a resistor divider can set the buck2 input UVLO.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-32-EP(5x5)
Category Power Supply Chip
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input supply voltage, PVIN1, PVIN2, PVIN3, VIN -0.3 20 V 5
LX1, LX2, LX3 switching node voltage -1 20 V Maximum withstand voltage transient < 20 ns 5
BST1, BST2, BST3 voltage referenced to LX1, LX2, LX3 -0.3 7 V 5
EN1, EN2, EN3, V7V, VOUT2, SCL, SDA, PGOOD voltage -0.3 7 V 5
FB1, FB2, FB3, COMP1, COMP2, COMP3, ROSC, SS1, SS2, SS3 voltage -0.3 3.6 V 5
AGND, PGND1, PGND2, PGND3 voltage -0.3 0.3 V 5
Operating junction temperature TJ -40 150 °C 5
Storage temperature Tstg -55 150 °C 5
Input voltage, PVIN1, PVIN2, PVIN3, VIN 4 18 V 5
LX1, LX2, LX3 switching node voltage -0.8 18 V Maximum withstand voltage transient <20 ns 5
BST1, BST2, BST3 voltage referenced to LX1, LX2, LX3 -0.1 6.8 V 5
EN1, EN2, EN3, V7V, VOUT1, VOUT2, VOUT3, SCL, SDA voltage -0.1 6.3 V 5
FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3 voltage -0.1 3 V 5
Operating junction temperature TJ -40 125 °C 5
VIN input voltage range VIN 4 18 V 6
VIN UVLO, VIN rising 3.5 3.8 4 V VIN rising 6
VIN UVLO, VIN falling 3.1 3.3 3.5 V VIN falling 6
Shutdown supply current IDDSDN 4 9.5 18 µA EN1 = EN2 = EN3 = 0 V 6
Input quiescent current without buck1/2/3 switching IDDQ_NSW 500 750 1150 µA EN1 = EN2 = EN3 = 5 V, FB1 = FB2 = FB3 = 0.8 V 6
Input quiescent current, buck1 enabled, buck2/3 off IDDQ_NSW1 180 370 590 µA EN1 = 5 V, EN2 = EN3 = 0 V, FB1 = 0.8 V 6
Input quiescent current, buck2 enabled, buck1/3 off IDDQ_NSW2 180 370 590 µA EN2 = 5 V, EN1 = EN3 = 0 V, FB2 = 0.8V 6
Input quiescent current, buck3 enabled, buck1/2 off IDDQ_NSW3 180 370 590 µA EN3 = 5 V, EN1 = EN2 = 0 V, FB3 = 0.8 V 6
V7V LDO current limit IOCP_V7V 78 185 260 mA 6
Feedback voltage VFB 0.594 0.6 0.606 V VCOMP = 1.2 V 6
EN1/2/3 high-level input voltage VENXH 1.12 1.2 1.26 V 6
EN1/2/3 low-level input voltage VENXL 1.05 1.15 1.21 V 6
EN1/2/3 pullup current IENX1 2.5 3.9 5.9 µA ENx = 1 V 6
EN1/2/3 pullup current IENX2 5.1 6.9 9.2 µA ENx = 1.5 V 6
EN hysteresis current IENhys 2.6 3 3.3 µA 6
Soft-start charging current ISSX 3.9 5.2 6.5 µA 6
Minimum on-time tON_MIN 50 75 110 ns 6
Error amplifier transconductance Gm_EA 140 300 450 µs -2 µA < ICOMPX < 2 µA 6
Buck1 peak inductor current limit ILIMIT1 4.3 5.8 6.9 A 6
Buck1 low-side sink current limit ILIMITSINK1 0.7 1.3 1.8 A 6
Buck2/buck3 peak inductor current limit ILIMIT2/3 2.55 3.4 4.1 A 6
Buck2/buck3 low-side sink current limit ILIMITSINK2/3 0.5 1 1.4 A 6
Switching frequency FSW 430 500 560 kHz ROSC = 88.7 kΩ 7
Switching frequency range FSW_range 200 2300 kHz 7
Clock sync frequency range FSYNC 200 2300 kHz 7
Input current, SDA, SCL II -10 10 µA VI = 0.4 to 4.5 V 7
Data hold time tHD_DAT 0 0.9 µs 7
Rise time of SCL signal tRCL 300 ns Capacitance of one bus line (pF) 7
Rise time of SCL signal after a repeated START condition and after an acknowledge bit tRCL1 300 ns Capacitance of one bus line (pF) 7
Fall time of SCL signal tFCL 300 ns Capacitance of one bus line (pF) 7
Rise time of SDA signal tRDA 300 ns Capacitance of one bus line (pF) 7
Fall time of SDA signal tFDA 300 ns Capacitance of one bus line (pF) 7
Junction-to-ambient thermal resistance RθJA 33.3 °C/W 5
Junction-to-case (top) thermal resistance RθJC(top) 25.7 °C/W 5
Junction-to-board thermal resistance RθJB 7.4 °C/W 5
Junction-to-top characterization parameter ψJT 0.3 °C/W 5
Junction-to-board characterization parameter ψJB 7.3 °C/W 5
Junction-to-case (bottom) thermal resistance RθJC(bot) 2.1 °C/W 5

CAD (KiCad official)

  • Symbol: TPS65263-1QRHBTQ1
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: VQFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: tps65263-1qrhbtq1-etched.step / tps65263-1qrhbtq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps65263-1qrhbtq1.step / tps65263-1qrhbtq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (48 pp, sha256 80d3442bf670d35c, retrieved 2026-10-08, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF