Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

MAX20087ATPA

Analog Devices Inc Maxim Integrated · Power Distribution Switches · TQFN-20-EP(4x4)

MAX20087ATPA from Analog Devices Inc Maxim Integrated, in a TQFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PGND power_in Power ground; connect GND and PGND together to the exposed pad (EP).
2 IN power_in Camera supply input; connect to the output of the DC-DC converter feeding the cameras (3V to 15V input supply per features, IN to PGND absolute maximum -0.3V to +20V).
3 IN power_in Camera supply input; connect to the output of the DC-DC converter feeding the cameras (3V to 15V input supply per features, IN to PGND absolute maximum -0.3V to +20V).
4 IN power_in Camera supply input; connect to the output of the DC-DC converter feeding the cameras (3V to 15V input supply per features, IN to PGND absolute maximum -0.3V to +20V).
5 PGND power_in Power ground; connect GND and PGND together to the exposed pad (EP).
6 OUT1 power_out Protected camera supply output 1; connect a 1µF or larger ceramic capacitor from OUT1 to PGND.
7 OUT3 power_out Protected camera supply output 3; connect a 1µF or larger ceramic capacitor from OUT3 to PGND.
8 N.C. unconnected Not connected; leave unconnected or connect to ground.
9 GND power_in Analog ground; connect GND and PGND together to the exposed pad (EP).
10 ISET passive Output current-limit setting; connect a resistor from ISET to GND to set the per-channel current limit (adjustable 100mA to 600mA).
11 VDD power_in Device input supply (3.0V to 5.5V supply voltage range); connect a 100nF or larger ceramic capacitor from VDD to GND.
12 GND power_in Analog ground; connect GND and PGND together to the exposed pad (EP).
13 SDA bidirectional I2C data I/O.
14 SCL input I2C clock input.
15 EN input Active-high enable input; drive EN high for normal operation, where the rising edge starts soft-start on enabled channels and the falling edge turns them off.
16 ADDR input I2C address select; connect to ground or VDD to select between two different I2C addresses.
17 INT output Active-low, open-drain interrupt output; an external pullup resistor is required if used.
18 N.C. unconnected Not connected; leave unconnected or connect to ground.
19 OUT4 power_out Protected camera supply output 4; connect a 1µF or larger ceramic capacitor from OUT4 to PGND.
20 OUT2 power_out Protected camera supply output 2; connect a 1µF or larger ceramic capacitor from OUT2 to PGND.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Analog Devices Inc Maxim Integrated
Package TQFN-20-EP(4x4)
Category Power Management (PMIC)
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage Range VDD 3 5.5 V 2
Input Voltage Range VIN 3 15 V 3
VDD Undervoltage Lockout VUVLO 2.5 2.7 2.9 V Falling 2
VDD Overvoltage Lockout VOVLO 5.5 5.7 5.9 V Rising 2
Input Undervoltage Lockout VINUVLO 2.5 2.7 2.9 V Falling 3
Input Overvoltage Threshold VINOV 15.8 16.5 17.1 V Rising 3
Shutdown Supply Current ISHDN 3 6.5 µA VEN = 0V, TA = +25°C 2
Supply Current IVDD 2 mA VEN = 5V 2
Input Current IIN 0.4 µA VEN = 0V, TA = +25°C 3
On-Resistance 400 700 mΩ 3
Overvoltage Threshold 0.09 0.15 0.25 V VOUT rising, output disabled 3
Undervoltage Threshold 0.45 0.55 0.65 V VOUT falling 3
ISET Operating Range 72 672 mA 3
ISET Pullup Current 11.9 12.5 13.1 µA VISET = 1.25V 3
Forward Current Limit ILIM 150 mA RISET = 25kΩ 3
Forward Current Limit ILIM 300 mA RISET = 50kΩ, VIN - VOUT = 2V 3
Forward Current Limit tolerance ILIM -8 8 % RISET = 50kΩ, VIN - VOUT = 2V 3
Forward Current Limit ILIM 600 mA RISET = 100kΩ 3
OUT_ Default Current 600 mA ISET out of operating range 3
Hard Short-Detection Comparator Threshold 1.8 1.9 2 V 3
Hard Short-Detection Time 10 ms Output in current limit, hard short detected 3
Shorted Output-Detection Time 20 ms Output in current limit, UV detected 3
Shorted Output-Retry Time 225 250 275 ms 4
VIN Divide Ratio 14.328 V/V 4
VIN Divide Ratio tolerance -2 2 % 4
VDD Divide Ratio 5.1 V/V 4
VDD Divide Ratio tolerance -2 2 % 4
VISET Divide Ratio 1.02 V/V 4
VISET Divide Ratio tolerance -2 2 % 4
VOUT Divide Ratio 14.328 V/V VIN - VOUT = 200mV, excluding ADC error 4
VOUT Divide Ratio tolerance -5 5 % VIN - VOUT = 200mV, excluding ADC error 4
Output-Current Reading 0.616 A/V IOUT = 300mA, excluding ADC error 4
Output-Current Reading tolerance -9 9 % IOUT = 300mA, excluding ADC error 4
Relative Accuracy INL INL -1.5 1.5 Bits 4
Differential Accuracy DNL DNL -1 1 Bits 4
Offset Error -2.2 2.2 Bits 4
Reference 1.23 1.25 1.27 V Full-scale reading 4
Digital Output Low Level 0.2 V VDD = 3.0V, ISINK = -2mA 4
SDA Output Low VOL_SDA 0.4 V ISINK = 13mA 4
Input High Level 1.3 V Rising 4
Input Low Level 0.5 V Falling 4
Clock Frequency fSCL 1.1 MHz 4
Setup Time (Repeated) START tSU:STA 260 ns 4
Hold Time (Repeated) START tHD:STA 260 ns 5
SCL Low Time tLOW 350 ns 5
SCL High Time tHIGH 260 ns 5
Data Setup Time tSU:DAT 50 ns 5
Data Hold Time tHD:DAT 0 ns 5
Setup Time for STOP Condition tSU:STO 260 ns 5
IN to PGND -0.3 20 V 2
OUT_ to IN -20 26 V 2
VDD to GND -0.3 6 V 2
SDA, SCL, ADDR, INT to GND -0.3 6 V 2
Maximum Continuous Output Current 1 A 2
Operating Temperature -40 125 °C 2
Junction Temperature TJ 150 °C 2
Storage Temperature Range -65 150 °C 2
Junction to Ambient (θJA), four-layer board θJA 33 °C/W JESD51-7, four-layer board 2
Junction to Case (θJC) θJC 2 °C/W 2

CAD (KiCad official)

  • Symbol: MAX20087ATPA
  • Footprint: Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
  • 3D model: TQFN-20-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: max20087atpa-etched.step / max20087atpa-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max20087atpa.step / max20087atpa.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices Inc Maxim Integrated datasheet (22 pp, sha256 0b3034bf08dd6b23, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF