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Contents

README

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SGM2203-3.3YK3G

SGMICRO · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89-3

SGM2203-3.3YK3G from SGMICRO, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Regulator output; the recommended output capacitor range is 1μF to 10μF.
2 GND power_in Ground reference pin.
3 VIN power_in Regulator input accepting up to 36V, with at least a 1μF supply bypass capacitor recommended.

Key specifications

Parameter Value
Manufacturer SGMICRO
Package SOT-89-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage (VOUT ≥ 3.3V) VIN 2.7 36 V VOUT ≥ 3.3V, Full (-40℃ to +85℃) 5
Output Voltage Accuracy -3 3 % IOUT = 1mA, +25℃ 5
Ground Pin Current 4.2 5.5 μA No load, +25℃ 5
Ground Pin Current 6.5 μA No load, Full 5
Dropout Voltage VDROP 1300 1850 mV IOUT = 150mA, VOUT ≥ 2.5V, +25℃ 5
Dropout Voltage VDROP 2400 mV IOUT = 150mA, VOUT ≥ 2.5V, Full 5
Line Regulation (VOUT ≥ 3.3V) 0.005 0.012 %/V VIN = VOUT + 2V to 36V, IOUT = 1mA, +25℃ 5
Load Regulation ΔVOUT 10 25 mV VIN = VOUT + 2V or 4V, IOUT = 1mA to 150mA, +25℃ 5
VIN to GND VIN -0.3 44 V 3
VOUT to GND (VOUT ≤ 5.0V) VOUT -0.3 V VOUT ≤ 5.0V; upper limit printed as Min(VIN + 0.3V, 6V) 3
Power Dissipation, SOT-89-3 PD 1.923 W TA = +25℃ 3
Junction Temperature TJ 150 ℃ 3
Storage Temperature Range TSTG -65 150 ℃ 3
Lead Temperature (Soldering) 260 ℃ Soldering, 10s 3
ESD Susceptibility HBM 4000 V HBM 3
ESD Susceptibility MM 200 V MM 3
ESD Susceptibility CDM 1000 V CDM 3
Operating Temperature Range TA -40 85 ℃ 3
Output Capacitor (COUT) range COUT 1 10 μF Recommended output capacitor range (ceramic) 4
Input Capacitor (CIN) range CIN 1 10 μF Ceramic capacitor between input pin and ground 8
Thermal Resistance, SOT-89-3 θJA 65 ℃/W Package thermal resistance, junction to ambient; column not labelled in datasheet text 3

CAD (KiCad official)

  • Symbol: SGM2203-3.3YK3G
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: sgm2203-3-3yk3g-etched.step / sgm2203-3-3yk3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sgm2203-3-3yk3g.step / sgm2203-3-3yk3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SGMICRO datasheet (13 pp, sha256 281efe1f77233635, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF