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JSMD0805-300L
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Shenzhen Jinkaisheng Elec Resettable Fuses, 0805. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownJSMD0805-300L
Shenzhen Jinkaisheng Elec · Resettable Fuses · 0805
JSMD0805-300L from Shenzhen Jinkaisheng Elec, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of the non-polarized PTC device (JSMD0805-300L: Vmax 6.0 V dc, Imax 50 A, Ihold 3.0 A, Itrip 6.0 A at 25°C), interchangeable with terminal 2. |
| 2 | 2 | passive | Terminal 2 of the non-polarized PTC device (JSMD0805-300L: Vmax 6.0 V dc, Imax 50 A, Ihold 3.0 A, Itrip 6.0 A at 25°C), interchangeable with terminal 1. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen Jinkaisheng Elec |
| Package | 0805 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Minimum device resistance prior to tripping | Ri min | 0.004 | Ω | 25°C, prior to tripping | 1 | ||
| Maximum device resistance one hour post reflow | R1max | 0.03 | Ω | Measured one hour post reflow | 1 | ||
| Maximum operating voltage | Vmax | 6 | V dc | Maximum operating voltage device can withstand without damage at rated current (Imax) | 1 | ||
| Maximum fault current | Imax | 50 | A | Maximum fault current device can withstand without damage at rated voltage (Vmax) | 1 | ||
| Hold current | I hold | 3 | A | 25°C still air; maximum current device will not trip | 1 | ||
| Trip current | I trip | 6 | A | 25°C still air; minimum current at which device will always trip | 1 | ||
| Maximum time to trip | 5 | s | At 8.0 A current | 1 | |||
| Passive aging resistance change | -5 | 5 | % | Passive aging +85°C, 1000 hrs; typical | 1 | ||
| Humidity aging resistance change | -5 | 5 | % | Humidity aging +85°C, 85% R.H., 168 hours; typical | 1 | ||
| Thermal shock resistance change | -33 | 33 | % | Thermal shock +85°C to -40°C, 20 times; typical | 1 | ||
| Recommended hold current at ambient -40°C | 4.29 | A | Thermal derating chart, ambient -40°C | 2 | |||
| Recommended hold current at ambient -20°C | 3.75 | A | Thermal derating chart, ambient -20°C | 2 | |||
| Recommended hold current at ambient 0°C | 3.53 | A | Thermal derating chart, ambient 0°C | 2 | |||
| Recommended hold current at ambient 25°C | 3 | A | Thermal derating chart, ambient 25°C | 2 | |||
| Recommended hold current at ambient 40°C | 2.65 | A | Thermal derating chart, ambient 40°C | 2 | |||
| Recommended hold current at ambient 50°C | 2.5 | A | Thermal derating chart, ambient 50°C | 2 | |||
| Recommended hold current at ambient 60°C | 2.4 | A | Thermal derating chart, ambient 60°C | 2 | |||
| Recommended hold current at ambient 70°C | 1.94 | A | Thermal derating chart, ambient 70°C | 2 | |||
| Recommended hold current at ambient 85°C | 1.36 | A | Thermal derating chart, ambient 85°C | 2 | |||
| Ambient operating temperature | -40 | 85 | °C | Ambient operating conditions | 2 | ||
| Maximum surface temperature in tripped state | 125 | °C | Device in the tripped state | 2 | |||
| Power dissipation in tripped state | Pd | 1.2 | W | Tripped state, 25°C still air, at rated voltage | 1 | ||
| Storage temperature | 0 | 35 | °C | Storage, ≤70% RH | 3 | ||
| Peak reflow temperature | Tp | 260 | °C | Pb-free reflow profile | 3 | ||
| Average ramp-up rate (Ts max to Tp) | 3 | °C/second | Pb-free reflow profile | 3 | |||
| Ramp-down rate | 6 | °C/second | Pb-free reflow profile | 3 | |||
| Time 25°C to peak temperature | 8 | minutes | Pb-free reflow profile | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal pad materials：Tin-plated Nickel-Copper | 4 |
CAD (KiCad official)
- Symbol:
JSMD0805-300L - Footprint:
Fuse:Fuse_0805_2012Metric - 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files:
jsmd0805-300l-etched.step/jsmd0805-300l-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);jsmd0805-300l.step/jsmd0805-300l.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen Jinkaisheng Elec datasheet (7 pp, sha256
ac0966d3ccc20817, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).