component
HSMQ-C170
Public Made by Adomby adom
Broadcom Limited LED Indication - Discrete, 0805. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHSMQ-C170
Broadcom Limited · LED Indication - Discrete · 0805
HSMQ-C170 from Broadcom Limited, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode terminal, identified by the cathode line/mark on the package; reverse voltage rating is 5 V (IR = 100 µA). |
| 2 | A | passive | Anode terminal; DC forward current is 20 mA max with typical VF of 3.4 V (3.9 V max) at IF = 20 mA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Broadcom Limited |
| Package | 0805 |
| Category | Optoelectronics |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VF tolerance | VF | -0.1 | 0.1 | V | 5 | ||
| Forward Voltage | VF | 3.4 | 3.9 | V | IF = 20 mA | 5 | |
| Reverse Breakdown Voltage | VR | 5 | V | IR = 100 µA | 5 | ||
| Luminous Intensity (green) | IV | 45 | 145 | mcd | at 20 mA | 6 | |
| DC Forward Current | IF | 20 | mA | Derate linearly as shown in Figure 4 | 5 | ||
| Power Dissipation | PD | 78 | mW | 5 | |||
| Reverse Voltage | VR | 5 | V | IR = 100 µA | 5 | ||
| LED Junction Temperature | 95 | °C | 5 | ||||
| Operating Temperature Range | -40 | 85 | °C | 5 | |||
| Storage Temperature Range | -40 | 85 | °C | 5 | |||
| Capacitance | C | 110 | pF | VF = 0, f = 1 MHz | 5 | ||
| Thermal Resistance, junction to pin | RJ-PIN | 300 | °C/W | 5 |
CAD (KiCad official)
- Symbol:
HSMQ-C170 - Footprint:
LED_SMD:LED_0805_2012Metric - 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files:
hsmq-c170-etched.step/hsmq-c170-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hsmq-c170.step/hsmq-c170.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Broadcom Limited datasheet (16 pp, sha256
e0534713026f1dc0, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).