Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

BZX84C43-7-F

Diodes Incorporated · Zener Diodes · SOT-23

BZX84C43-7-F from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 A passive Anode of the Zener diode, connected to the bottom-left terminal in the device schematic; Zener voltage 43V nominal (40.0V to 46.0V) at IZT = 2.0mA.
2 NC unconnected Bottom-right terminal, shown in the device schematic with no internal connection to the diode.
3 K passive Cathode of the Zener diode, connected to the top terminal in the device schematic; power dissipation 350mW (Note 2) or 300mW (Note 1).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage (Nom 43 V type) VZ 40 43 46 V @ IZT = 2.0 mA 1
Typical Temperature Coefficient 10 12 mV/°C @ IZT 1
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 1
Maximum Zener Impedance ZZT 150 Ω @ IZT = 2.0 mA 1
Maximum Zener Impedance ZZK 375 Ω @ IZK = 0.5 mA 1
Maximum Reverse Current IR 0.1 μA @ VR = 30.1 V 1
Power Dissipation (Note 1) PD 300 mW Note 1: FR-4 PC board, recommended pad layout 1
Power Dissipation (Note 2) PD 350 mW Note 2: terminals kept at ambient temperature 1
Thermal Resistance, Junction to Ambient Air (Note 1) RθJA 417 °C/W Note 1: FR-4 PC board, recommended pad layout 1
Thermal Resistance, Junction to Ambient Air (Note 2) RθJA 357 °C/W Note 2: terminals kept at ambient temperature 1
Forward Voltage VF 0.9 V @ IF = 10 mA 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 1

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: BZX84C43-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.0015 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx84c43-7-f-etched.step / bzx84c43-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c43-7-f.step / bzx84c43-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (3 pp, sha256 1dd8c04537198d3c, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF