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Contents

README

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PMEG040V030EPEZ

Nexperia · Schottky Diodes · TO-277

PMEG040V030EPEZ from Nexperia, in a TO-277. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the Schottky barrier diode, one of two anode leads; the device is rated for a reverse voltage VR of 40 V and an average forward current IF(AV) of 3 A.
2 A passive Anode of the Schottky barrier diode, the second anode lead; the device is rated for a reverse voltage VR of 40 V and an average forward current IF(AV) of 3 A.
3 K passive Cathode of the Schottky barrier diode; the datasheet identifies the soldering point of the cathode tab as the reference for the junction-to-solder-point thermal resistance Rth(j-sp) of 3 K/W maximum.

Key specifications

Parameter Value
Manufacturer Nexperia
Package TO-277
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
reverse breakdown voltage V(BR)R 40 V IR = 3 mA; pulsed; Tj = 25 °C [1] 4
forward voltage VF 360 420 mV IF = 1 A; pulsed; Tj = 25 °C [1] 4
forward voltage VF 425 490 mV IF = 3 A; pulsed; Tj = 25 °C [1] 4
forward voltage VF 490 580 mV IF = 3 A; pulsed; Tj = -40 °C [1] 4
forward voltage VF 340 420 mV IF = 3 A; pulsed; Tj = 125 °C [1] 4
reverse current IR 30 120 µA VR = 40 V; pulsed; Tj = 25 °C [1] 4
reverse voltage VR 40 V Tj = 25 °C 2
forward current IF 4.2 A δ = 1; Tsp ≤ 172 °C 2
average forward current IF(AV) 3 A square-wave pulse; δ = 0.5; f = 20 kHz; Tsp ≤ 173 °C 2
non-repetitive peak forward current IFSM 120 A half sine-wave pulse; tp = 8.3 ms; Tj(init) = 25 °C 2
total power dissipation Ptot 1.66 W Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated and standard footprint [1] 2
total power dissipation Ptot 2.15 W FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 [2] 2
junction temperature Tj 175 °C 2
ambient temperature Tamb -55 175 °C 2
storage temperature Tstg -65 175 °C 2
thermal resistance from junction to ambient Rth(j-a) 90 K/W in free air; FR4 PCB, single-sided copper, tin-plated and standard footprint [2] 3
thermal resistance from junction to ambient Rth(j-a) 70 K/W in free air; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 [3] 3
thermal resistance from junction to solder point Rth(j-sp) 3 K/W soldering point of cathode tab [4] 3

CAD (KiCad official)

  • Symbol: PMEG040V030EPEZ
  • Footprint: Package_TO_SOT_SMD:TO-277A
  • 3D model: TO-277 (KiCad packages3D, STEP)
  • 3D model files: pmeg040v030epez-etched.step / pmeg040v030epez-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg040v030epez.step / pmeg040v030epez.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (11 pp, sha256 d1bdfcef31d1a78d, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF