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Contents

README

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1.5SMC75CA

hongjiacheng · ESD And Surge Protection (TVS/ESD) · DO-214AB(SMC)

1.5SMC75CA from hongjiacheng, in a DO-214AB(SMC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Bidirectional TVS terminal 1 (interchangeable with terminal 2, no cathode band) with VRWM 64.1V, VBR 71.3V to 78.8V at 1mA and maximum VC 103V at IPP 14.8A.
2 A2 passive Bidirectional TVS terminal 2 (interchangeable with terminal 1, no cathode band) with VRWM 64.1V, VBR 71.3V to 78.8V at 1mA and maximum VC 103V at IPP 14.8A.

Key specifications

Parameter Value
Manufacturer hongjiacheng
Package DO-214AB(SMC)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Stand-Off Voltage VRWM 64.1 V 3
Breakdown Voltage VBR 71.3 78.8 V @IT = 1 mA 3
Maximum Clamping Voltage VC 103 V @IPP = 14.8 A 3
Peak Pulse Current IPP 14.8 A 10/1000μs waveform 3
Reverse Leakage IR 1 μA @VRWM 3
Breakdown Voltage Tolerance VBR -5 5 % Suffix A denotes 5% tolerance 3
Peak Pulse Power Dissipation PPPM 1500 W 10/1000µs waveform 1
Power Dissipation on Infinite Heat Sink PM(AV) 6.5 W Ta=75°C 1
Peak Forward Surge Current IFSM 100 A 8.3ms single half sine wave 1
Operating junction and Storage Temperature Range TJ, TSTG -55 150 ℃ 1
Thermal resistance junction to lead RθJ-L 15 ℃/W Typical 1
Thermal resistance junction to ambient RθJ-A 75 ℃/W Typical 1
Breakdown voltage temperature coefficient ΔVBR 0.1 % of VBR@25℃ per ℃ Typical maximum, ΔVBR = 0.1% ×VBR@25℃ ×ΔT 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin •Matte tin lead-free Plated •Meets MSL level 1, per J-STD-020 1

CAD (KiCad official)

  • Symbol: 1.5SMC75CA
  • Footprint: Diode_SMD:D_SMC
  • 3D model: DO-214AB(SMC) (KiCad packages3D, STEP)
  • 3D model files: 1-5smc75ca-etched.step / 1-5smc75ca-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1-5smc75ca.step / 1-5smc75ca.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: hongjiacheng datasheet (5 pp, sha256 c9947330107dbeb2, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF