component
BZX8450-C3V9-QR
Public Made by Adomby adom
Nexperia Zener Diodes, TO-236AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownBZX8450-C3V9-QR
Nexperia · Zener Diodes · TO-236AB
BZX8450-C3V9-QR from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A | passive | Anode of the low-current voltage regulator diode; the datasheet gives no separate electrical limit for this pin. |
| 2 | n.c. | unconnected | Pin 2 is not connected internally and is not used in the circuit. |
| 3 | K | passive | Cathode of the low-current voltage regulator diode; the cathode tab is the soldering point referenced for thermal resistance junction-to-solder point (Rth(j-sp) 330 K/W max). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | TO-236AB |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Working voltage (BZX8450-C3V9-Q) | VZ | 3.7 | 4.1 | V | Tj = 25 °C | 4 | |
| Temperature coefficient (BZX8450-C3V9-Q) | SZ | -2.7 | 2.5 | mV/K | Tj = 25 °C | 4 | |
| Differential resistance (BZX8450-C3V9-Q) | rdiff | 600 | Ω | IZ = 50 µA; Tj = 25 °C | 4 | ||
| Differential resistance (BZX8450-C3V9-Q) | rdiff | 95 | Ω | IZ = 1 mA; Tj = 25 °C | 4 | ||
| Differential resistance (BZX8450-C3V9-Q) | rdiff | 5 | Ω | IZ = 5 mA; Tj = 25 °C | 4 | ||
| Diode capacitance (BZX8450-C3V9-Q) | Cd | 150 | pF | f = 1 MHz; VR = 0 V | 4 | ||
| Forward voltage | VF | 0.9 | V | IF = 10 mA; pulse test tp ≤ 300 µs; δ ≤ 0.02 | 4 | ||
| Working voltage tolerance series (approximate) | -5 | 5 | % | approximately ±5 %, series tolerance as stated in Features | 1 | ||
| Forward current | IF | 200 | mA | 3 | |||
| Non-repetitive peak reverse power dissipation | PZSM | 40 | W | tp = 100 µs; square wave; Tj = 25 °C; prior to surge | 3 | ||
| Total power dissipation | Ptot | 250 | mW | Tamb ≤ 25 °C; device mounted on FR4 PCB, single sided copper, tin-plated, standard footprint | 3 | ||
| Junction temperature | Tj | 150 | °C | 3 | |||
| Ambient temperature | Tamb | -55 | 150 | °C | 3 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 3 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 500 | K/W | in free air; device mounted on FR4 PCB, single sided copper, tin-plated, standard footprint | 3 | ||
| Thermal resistance from junction to solder point | Rth(j-sp) | 330 | K/W | soldering point of cathode tab | 3 |
CAD (land: KiCad; 3D: generated from the datasheet)
- Symbol:
BZX8450-C3V9-QR - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: TO-236AB, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.0 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files:
bzx8450-c3v9-qr-etched.step/bzx8450-c3v9-qr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bzx8450-c3v9-qr.step/bzx8450-c3v9-qr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (10 pp, sha256
c4eaf3bb5a88aca0, retrieved 2026-11-12, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).