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MD52E36QA3

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Shanghai Mingda Microelectronics Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOT-23-3L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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MD52E36QA3

Shanghai Mingda Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-3L

MD52E36QA3 from Shanghai Mingda Microelectronics, in a SOT-23-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin; the internal COUT auto-discharge switch connects between VOUT and GND.
2 VOUT power_out Regulated output delivering up to 500mA (450mA min); VOUT must not exceed VIN+0.3V, and a 1.0µF or larger low-ESR ceramic output capacitor is recommended.
3 VIN power_in Power input accepting 2.2V to 7V (absolute maximum -0.3 to 8V), with a 1.0µF or larger input capacitor placed close to the IC.

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package SOT-23-3L
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage tolerance (VOUT(S), 3.6 V part) VOUT(S) -2 2 % VIN=VOUT(S)+1.0V, IOUT=10mA, VOUT(S)≥2.0V 4
Line regulation 0.05 0.1 %/V VOUT(S)+0.5V≤VIN=VEN≤7V, IOUT=10mA 4
Load regulation VOUT2 50 90 mV VIN=VEN=VOUT(S)+1.0V, 1mA≤IOUT≤500mA 4
Temperature stability -50 50 ppm/℃ VIN=VEN=VOUT(S)+1.0V, IOUT=1mA, -40℃≤Ta≤125℃ 4
GND current (no load) IGND 0.6 0.9 μA VEN=VIN, no load 4
Shutdown current ISHUT 0.01 0.1 μA VIN=7.0V, VEN=0 4
Input voltage VIN 2.2 7 V 4
Maximum output current IOUTMAX 450 500 mA 4
COUT auto discharge resistance RDCHG 280 450 640 Ω VEN=0, VOUT=VOUT(S) 4
EN 'H' level voltage VENH 1 7 V 4
EN 'L' level voltage VENL 0 0.38 V 4
EN 'H' level current IENH -0.1 0.1 μA VIN=7.0V, VEN=VIN 4
EN 'L' level current IENL -0.1 0.1 μA VIN=7.0V, VEN=0 4
Input voltage (absolute maximum) VIN -0.3 8 V 3
Power dissipation PD 250 mW SOT23-3 package 3
ESD protection HBM ESD HBM 6000 V HBM 3
Storage temperature Tstg -40 125 ℃ 3
Operating ambient temperature Topr -40 85 ℃ 3
Thermal resistance junction-to-board RθJB 200 ℃/W SOT23-3; mounted on JEDEC standard 4-layer (2s2p) PCB (note 1) 3

CAD (KiCad official)

  • Symbol: MD52E36QA3
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3L (KiCad packages3D, STEP)
  • 3D model files: md52e36qa3-etched.step / md52e36qa3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md52e36qa3.step / md52e36qa3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (14 pp, sha256 4168b8cf3e52f15f, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF