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DRV8824QPWPRQ1

Public Made by Adom

by adom

Texas Instruments Motor Driver ICs, HTSSOP-28. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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DRV8824QPWPRQ1

Texas Instruments · Motor Driver ICs · HTSSOP-28

DRV8824QPWPRQ1 from Texas Instruments, in a HTSSOP-28. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CP1 passive Charge pump flying capacitor terminal; connect a 0.01-µF 50-V capacitor between CP1 and CP2.
2 CP2 passive Charge pump flying capacitor terminal; connect a 0.01-µF 50-V capacitor between CP1 and CP2.
3 VCP passive High-side gate drive voltage; connect a 0.1-µF 16-V ceramic capacitor and a 1-MΩ resistor to VM.
4 VMA power_in Bridge A power supply; connect to motor supply (8.2 V - 45 V), same supply as VMB.
5 AOUT1 output Bridge A output 1; connect to bipolar stepper motor winding A (positive current is AOUT1 to AOUT2).
6 ISENA passive Bridge A ground / Isense; connect to current sense resistor for bridge A.
7 AOUT2 output Bridge A output 2; connect to bipolar stepper motor winding A (positive current is AOUT1 to AOUT2).
8 BOUT2 output Bridge B output 2; connect to bipolar stepper motor winding B (positive current is BOUT1 to BOUT2).
9 ISENB passive Bridge B ground / Isense; connect to current sense resistor for bridge B.
10 BOUT1 output Bridge B output 1; connect to bipolar stepper motor winding B (positive current is BOUT1 to BOUT2).
11 VMB power_in Bridge B power supply; connect to motor supply (8.2 V - 45 V), same supply as VMA.
12 AVREF input Bridge A current set reference input; sets winding current, normally tied to BVREF, can be connected to V3P3OUT, with a 0.01-µF bypass capacitor to GND recommended.
13 BVREF input Bridge B current set reference input; sets winding current, normally tied to AVREF, can be connected to V3P3OUT, with a 0.01-µF bypass capacitor to GND recommended.
14 GND power_in Device ground.
15 V3P3OUT power_out 3.3-V regulator output; bypass to GND with a 0.47-µF 6.3-V ceramic capacitor, can be used to supply VREF.
16 nRESET input Active-low reset input initializes the indexer logic and disables the H-bridge outputs; internal pulldown.
17 nSLEEP input Sleep mode input; logic high enables device, logic low enters low-power sleep mode; internal pulldown.
18 nFAULT output Open-drain fault status output; logic low when in fault condition (overtemp, overcurrent).
19 DECAY input Decay mode input; low = slow decay, open = mixed decay, high = fast decay; internal pulldown and pullup.
20 DIR input Direction input; level sets the direction of stepping; internal pulldown.
21 nENBL input Enable input; logic high disables device outputs and indexer operation, logic low enables; internal pulldown.
22 STEP input Step input; rising edge causes the indexer to move one step; internal pulldown.
23 NC unconnected No connect; leave this terminal unconnected.
24 MODE0 input Microstep mode 0; MODE0-MODE2 set full, 1/2, 1/4, 1/8, 1/16 or 1/32 step; internal pulldown.
25 MODE1 input Microstep mode 1; MODE0-MODE2 set full, 1/2, 1/4, 1/8, 1/16 or 1/32 step; internal pulldown.
26 MODE2 input Microstep mode 2; MODE0-MODE2 set full, 1/2, 1/4, 1/8, 1/16 or 1/32 step; internal pulldown.
27 nHOME output Open-drain home position output; logic low when at home state of step table.
28 GND power_in Device ground.
29 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-28
Category Power Supply Chip
Pins 29

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage range VMx -0.3 47 V 4
Digital terminal voltage range -0.5 7 V 4
VREF input voltage VREF -0.3 4 V 4
ISENSEx terminal voltage -0.3 0.8 V 4
Continuous motor drive output current 1.6 A Power dissipation and thermal limits must be observed 4
Operating virtual junction temperature range TJ -40 150 °C 4
Storage temperature range Tstg -60 150 °C 4
ESD HBM VESD 2000 V AEC-Q100 Classification H2 4
ESD CDM VESD 750 V AEC-Q100 Classification C4B 4
Motor power supply voltage VM 8.2 45 V All VM terminals connected to same supply 4
VREF input voltage VREF 1 3.5 V Operational at VREF between 0 V and 1 V, but accuracy is degraded 4
V3P3OUT load current IV3P3 1 mA 4
Junction-to-ambient thermal resistance RθJA 38.9 °C/W PWP 28 terminal 5
Junction-to-case (top) thermal resistance RθJC(top) 23.3 °C/W PWP 28 terminal 5
Junction-to-board thermal resistance RθJB 21.2 °C/W PWP 28 terminal 5
Junction-to-top characterization parameter ψJT 0.8 °C/W PWP 28 terminal 5
Junction-to-board characterization parameter ψJB 20.9 °C/W PWP 28 terminal 5
Junction-to-case (bottom) thermal resistance RθJC(bot) 2.6 °C/W PWP 28 terminal 5
VM operating supply current IVM 5 8 mA VM = 24 V, fPWM < 50 kHz 5
VM sleep mode supply current IVMQ 10 20 μA VM = 24 V 5
VM undervoltage lockout voltage VUVLO 7.8 8.2 V VM rising 5
V3P3OUT voltage V3P3 3.18 3.3 3.45 V IOUT = 0 to 1 mA, VM = 24 V, TJ = 25°C 5
V3P3OUT voltage V3P3 3.1 3.3 3.5 V IOUT = 0 to 1 mA 5
Input low voltage VIL 0.6 0.7 V 5
Input high voltage VIH 2 5.25 V 5
Input hysteresis VHYS 0.45 V 5
Input low current IIL -20 20 μA VIN = 0 5
Input high current IIH 100 μA VIN = 3.3 V 5
Internal pulldown resistance RPD 100 kΩ nENBL, nRESET, DIR, STEP, MODEx 5
Internal pulldown resistance RPD 1 MΩ nSLEEP 5
Output low voltage VOL 0.5 V IO = 5 mA 5
Output high leakage current IOH 1 μA VO = 3.3 V 5
Input low threshold voltage VIL 0.8 V For slow decay mode 5
Input high threshold voltage VIH 2 V For fast decay mode 5
Input current IIN -100 100 µA DECAY input 5
Internal pullup resistance RPU 130 kΩ DECAY input 5
Internal pulldown resistance RPD 80 kΩ DECAY input 5
HS FET on resistance RDS(ON) 0.63 Ω VM = 24 V, IO = 1 A, TJ = 25°C 6
HS FET on resistance RDS(ON) 0.76 0.9 Ω VM = 24 V, IO = 1 A, TJ = 85°C 6
HS FET on resistance RDS(ON) 0.85 1 Ω VM = 24 V, IO = 1 A, TJ = 125°C 6
LS FET on resistance RDS(ON) 0.65 Ω VM = 24 V, IO = 1 A, TJ = 25°C 6
LS FET on resistance RDS(ON) 0.78 0.9 Ω VM = 24 V, IO = 1 A, TJ = 85°C 6
LS FET on resistance RDS(ON) 0.85 1 Ω VM = 24 V, IO = 1 A, TJ = 125°C 6
Off-state leakage current IOFF -20 20 μA 6
Internal PWM frequency fPWM 50 kHz 6
Current sense blanking time tBLANK 3.75 μs 6
Rise time tR 100 360 ns VM = 24 V 6
Fall time tF 80 250 ns VM = 24 V 6
Dead time tDEAD 400 ns 6
Overcurrent protection trip level IOCP 1.8 5 A 6
Thermal shutdown temperature tTSD 150 160 180 °C Die temperature 6
xVREF input current IREF -3 3 μA xVREF = 3.3 V 6
xISENSE trip voltage VTRIP 635 660 685 mV xVREF = 3.3 V, 100% current setting 6
Current trip accuracy (5% setting) ΔITRIP -25 25 % xVREF = 3.3 V, 5% current setting 6
Current trip accuracy (10%-34% setting) ΔITRIP -15 15 % xVREF = 3.3 V, 10% - 34% current setting 6
Current trip accuracy (38%-67% setting) ΔITRIP -10 10 % xVREF = 3.3 V, 38% - 67% current setting 6
Current trip accuracy (71%-100% setting) ΔITRIP -5 5 % xVREF = 3.3 V, 71% - 100% current setting 6
Current sense amplifier gain AISENSE 5 V/V Reference only 6
Step frequency fSTEP 250 kHz 6
Pulse duration, STEP high tWH(STEP) 1.9 μs 6
Pulse duration, STEP low tWL(STEP) 1.9 μs 6
Setup time, command to STEP rising tSU(STEP) 200 ns 6
Hold time, command to STEP rising tH(STEP) 200 ns 6
Enable time, nENBL active to STEP tENBL 200 ns 6
Wakeup time, nSLEEP inactive to STEP tWAKE 1 ms 6

CAD (KiCad official)

  • Symbol: DRV8824QPWPRQ1
  • Footprint: Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm
  • 3D model: HTSSOP-28 (KiCad packages3D, STEP)
  • 3D model files: drv8824qpwprq1-etched.step / drv8824qpwprq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); drv8824qpwprq1.step / drv8824qpwprq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (29 pp, sha256 374d5a3b4c707fe4, retrieved 2026-10-23, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF