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SN65HVD3085EIMM

Public Made by Adom

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HGSEMI RS-485 / RS-422 ICs, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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SN65HVD3085EIMM

HGSEMI · RS-485 / RS-422 ICs · MSOP-8

SN65HVD3085EIMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high if (A - B) is at least -50 mV and low if (A - B) is at or below -200 mV.
2 RE input Receiver output enable, active low: RO is enabled when RE is low and high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE has a hot-plug input structure.
3 DE input Driver output enable, active high: the driver outputs are enabled when DE is high and high-impedance when DE is low; DE low with RE high puts the device into low-power shutdown, and DE has a hot-plug input structure.
4 DI input Driver input: when DE is high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground reference for the device.
6 A bidirectional Receiver non-inverting input and driver non-inverting output on the bus; it is the A terminal of the RS-485 bus.
7 B bidirectional Receiver inverting input and driver inverting output on the bus; it is the B terminal of the RS-485 bus.
8 VCC power_in Positive supply: 4.5 V ≤ VCC ≤ 5.5 V; decouple with a 0.1 µF capacitor to ground.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 6 V 3
Control input voltage (RE, DE) -0.3 6 V 3
Driver input voltage (DI) -0.3 6 V 3
Driver output voltage (A,B,Y,Z) -7 12 V 3
Receiver input voltage (A,B) -7 12 V 3
Receiver output voltage (RO) -0.3 V Max printed as VCC+0.3 3
Storage temperature -65 150 ℃ 3
Operating temperature range, SN65HVD308_I (industrial) -40 85 ℃ Printed in absolute-maximum table for SN65HVD308_I 3
Supply voltage (recommended) VCC 4.5 5.5 V 4
Differential driver output, RL=100Ω (RS-422) VOD 2.7 V Fig.1, RL=100Ω (RS-422); max printed as VCC 4
Differential driver output, RL=54Ω (RS-485) VOD 2.1 V Fig.1, RL=54Ω (RS-485); max printed as VCC 4
Change in magnitude of differential driver output voltage ΔVOD 0.2 V Fig.1, RL=100Ω or RL=54Ω 4
Driver common-mode output voltage VOC 3 V Fig.1, RL=100Ω or RL=54Ω; min printed as VCC/2 4
Change in magnitude of common-mode output voltage ΔVOC 0.2 V Fig.1, RL=100Ω or RL=54Ω 4
Input high voltage VIH 2 V DE, DI, RE 4
Input low voltage VIL 0.8 V DE, DI, 4
Input hysteresis VHYS 100 mV DE, DI, RE 4
Input current IIN -1 1 μA DE, DI, RE 4
Input current (A,B), full duplex IA, IB 125 μA DE=GND, VCC=GND or VCC, VIN=12V 4
Input current (A,B), full duplex IA, IB -75 μA DE=GND, VCC=GND or VCC, VIN=-7V 4
Output leakage current (Y,Z), full duplex IO 125 μA DE=GND, VCC=GND or VCC, VIN=12V 4
Output leakage current (Y,Z), full duplex IO -100 μA DE=GND, VCC=GND or VCC, VIN=-7V 4
Driver short-circuit output current IOSD 250 mA 0≦VOUT≦12V 4
Driver short-circuit output current IOSD -250 mA -7≦VOUT≦VCC 4
Driver short-circuit foldback output current IOSDF 20 mA VCC-1V≦VOUT≦VCC+0.5V 4
Driver short-circuit foldback output current IOSDF -20 mA -0.5V≦VOUT≦+1V 4
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V≦VCM≦12V 4
Receiver input hysteresis ΔVTH 15 mV VA+VB=0 4
Receiver output low voltage VOL 0.4 V IO= 4mA, VID=-200mV 4
Receiver tri-state output current IOZR -1 1 μA 0≦VO≦VCC 4
Receiver input resistance RIN 96 kΩ -7V≦VCM≦12V 4
Supply current, no load Icc 530 900 μA No load, RE=VCC, DI=GND or VCC, DE=VCC 5
Supply current, no load Icc 475 600 μA No load, RE=VCC, DE=GND 5
Supply current, no load Icc 530 1000 μA No load, RE=GND, DI=GND or VCC, DE=VCC 5
Supply current, no load Icc 475 800 μA No load, RE=GND, DE=GND 5
Standby mode supply current ISHDN 0.05 10 μA DE=GND, RE=VCC 5
ESD, IEC 61000-4-2 air-gap discharge, RS-485 pins -16 16 kV Pins A, B, Y, Z, A/Y, B/Z; IEC61000-4-2 air-gap 5
ESD, IEC 61000-4-2 contact discharge, half-duplex -16 16 kV Half-duplex; IEC61000-4-2 contact discharge 5
ESD, HBM pin to GND, RS-485 pins -16 16 kV Pins A, B, Y, Z, A/Y, B/Z; pin to GND 5
Driver propagation delay, low to high tDPLH 200 1000 ns Fig.2 and 5, RL=54Ω, CL=50pF 7
Driver propagation delay, high to low tDPHL 200 1000 ns Fig.2 and 5, RL=54Ω, CL=50pF 7
Driver output skew tDSKEW -140 140 ns Fig.2 and 5, RL=54Ω, CL=50pF 7
Driver rise or fall time tDR, tDF 250 900 ns Fig.2 and 5, RL=54Ω, CL=50pF 7
Maximum data rate (driver table) fMAX 500 kbps 7
Driver enable to output high tDZH 2500 ns Fig.3 and 6, CL=100pF, S3 closed 7
Driver enable to output low tDZL 2500 ns Fig.3 and 6, CL=100pF, S2 closed 7
Driver low to disable time tDLZ 100 ns Fig.3 and 6, CL=15pF, S2 closed 7
Driver high to disable time tDHZ 100 ns Fig.3 and 6, CL=15pF, S3 closed 7
Driver enable from standby to output high tDZH(SHDN) 5500 ns Fig.3 and 6, CL=15pF, S3 closed 7
Driver enable from standby to output low tDZL(SHDN) 5500 ns Fig.3 and 6, CL=15pF, S2 closed 7
Standby time tSHDN 50 700 ns 7
Receiver propagation delay tRPLH, tRPHL 200 ns Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns 7
Receiver differential output skew tRSKEW -30 30 ns Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns 7
Maximum data rate (receiver table) fMAX 500 kbps 7
Receiver enable to output low tRZL 50 ns Fig.4 and 9, S1=-1.5V, S2 to VCC 7
Receiver enable to output high tRZH 50 ns Fig.4 and 9, S1=+1.5V, S2 to GND 7
Receiver low to disable time tRLZ 50 ns Fig.4 and 9, S1=-1.5V, S2 to VCC 7
Receiver high to disable time tRHZ 50 ns Fig.4 and 9, S1=+1.5V, S2 to GND 7
Thermal shutdown temperature TTS 165 ℃ 4

CAD (KiCad official)

  • Symbol: SN65HVD3085EIMM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: sn65hvd3085eimm-etched.step / sn65hvd3085eimm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn65hvd3085eimm.step / sn65hvd3085eimm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (25 pp, sha256 a90d2a5b15f5f462, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF