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AT24C512CN

Public Made by Adom

by adom

HGSEMI EEPROM, DIP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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AT24C512CN

HGSEMI · EEPROM · DIP-8

AT24C512CN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 E0 input Device address input bit 0. Hard-wired to VCC or GND to set the least-significant device address bit, allowing up to eight AT24C512C devices on one I2C bus. Internally pulled down to GND if left floating.
2 E1 input Device address input bit 1. Hard-wired to VCC or GND to set the middle device address bit. Internally pulled down to GND if left floating.
3 E2 input Device address input bit 2. Hard-wired to VCC or GND to set the most-significant device address bit. Internally pulled down to GND if left floating.
4 GND power_in Ground reference for the power supply. Must be connected to system ground.
5 SDA bidirectional I2C Serial Data. Open-drain bidirectional pin used to serially transfer data to and from the device; requires an external pull-up resistor to VCC.
6 SCL input I2C Serial Clock. Provides the clock to the device; input/command data on SDA is latched on the rising edge of SCL and output data on SDA is clocked out on the falling edge of SCL.
7 WP input Write Protect. When tied to VCC, the entire memory array is write-protected (Read-only). When tied to GND or left floating, write operations are enabled. When driven high, address bytes are ACKed but data bytes are NACKed.
8 VCC power_in Device power supply, 1.7 V to 5.5 V. Operations at invalid VCC voltages may produce spurious results and should not be attempted.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • AT24C512CN
  • AT24C512CNCM/TR
  • AT24C512CNCMM/TR
  • AT24C512CNCMT/TR
  • AT24C512CNCDQ/TR
  • AT24C512CNCDQ3/TR

CAD (KiCad official)

  • Symbol: AT24C512CN
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: at24c512cn-etched.step / at24c512cn-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at24c512cn.step / at24c512cn.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (26 pp, sha256 9b5af03846a21237, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF