component
ES1CL
Public Made by Adomby adom
Changjing Fast Recovery/High Efficiency Diode, SOD-123FL. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownES1CL
Changjing · Fast Recovery/High Efficiency Diode · SOD-123FL
ES1CL from Changjing, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, marked by the color band on the package; connects to the positive side of the rectifier when conducting forward current (IF(AV) 1.0 A, VRRM 150 V for ES1CL). |
| 2 | A | passive | Anode, the end opposite the cathode band; forward current flows from anode to cathode (VF 0.95 V typ at IF=1.0A, max 1.25 V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Changjing |
| Package | SOD-123FL |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive Peak Reverse Voltage | VRRM | 150 | V | ES1CL column | 1 | ||
| Maximum RMS Voltage | VRMS | 105 | V | ES1CL column | 1 | ||
| Average Forward Current | IF(AV) | 1 | A | 60Hz Half-sine wave, Resistance load, Ta=90℃ | 1 | ||
| Surge (Non-repetitive) Forward Current | IFSM | 30 | A | 60Hz Half-sine wave, 1 cycle, Ta=25℃ | 1 | ||
| Peak Forward Voltage | VF | 0.95 | V | IF=1.0A | 1 | ||
| Maximum reverse recovery time | trr | 35 | ns | IF=0.5A,IR=1.0A,Irr=0.25A | 1 | ||
| Peak Reverse Current | IRRM1 | 5 | A | VRM=VRRM, Ta=25 | 1 | ||
| Peak Reverse Current | IRRM2 | 100 | A | VRM=VRRM, Ta=100 | 1 | ||
| Thermal Resistance junction to ambient | RθJ-A | 70 | ℃/W | Between junction and ambient, P.C.B. 5.0mm x 5.0mm copper pad | 1 | ||
| Thermal Resistance junction to lead | RθJ-L | 25 | ℃/W | Between junction and terminal, P.C.B. 5.0mm x 5.0mm copper pad | 1 | ||
| Operation Junction and Storage Temperature Range | TJ,TSTG | -55 | 150 | ℃ | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper | 1 |
CAD (KiCad official)
- Symbol:
ES1CL - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files:
es1cl-etched.step/es1cl-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);es1cl.step/es1cl.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Changjing datasheet (4 pp, sha256
a545381e33f91bf9, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).