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Contents

README

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TLV76701DGNR

Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · HVSSOP-8

TLV76701DGNR from Texas Instruments, in a HVSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT output Output pin. Use the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the output capacitor as close to the OUT and GND pins of the device as possible.
2 FB input Feedback pin. Input to the control-loop error amplifier. This pin is used to set the output voltage of the device with the use of external resistors. Do not float this pin. For adjustable-voltage version devices only.
3 NC unconnected Do not connect to a biased voltage. Tie this pin to ground or leave floating.
4 GND power_in Ground pin. All ground pins must be grounded.
5 EN input Enable pin. Driving the enable pin high enables the device. Driving this pin low disables the device. High and low thresholds are listed in the Electrical Characteristics table. This pin has an internal pullup and can be left floating to enable the device or the pin can be connected to the input pin.
6 GND power_in Ground pin. All ground pins must be grounded.
7 NC unconnected Do not connect to a biased voltage. Tie this pin to ground or leave floating.
8 IN input Input pin. Use the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the input capacitor as close to the IN and GND pins of the device as possible.
9 Thermal pad passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HVSSOP-8
Category Power Management (PMIC)
Pins 9

CAD (KiCad official)

  • Symbol: TLV76701DGNR
  • Footprint: Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
  • 3D model: HVSSOP-8, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tlv76701dgnr-etched.step / tlv76701dgnr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv76701dgnr.step / tlv76701dgnr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (45 pp, sha256 c631d45696a7ef20, retrieved 2026-10-01, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF