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SD5U100SL
Public Made by Adomby adom
LGE Schottky Barrier Diodes (SBD), TO-277. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSD5U100SL
LGE · Schottky Barrier Diodes (SBD) · TO-277
SD5U100SL from LGE, in a TO-277. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A | passive | Anode terminal, one of two left-side pads tied together internally in the pin configuration diagram; the diode is rated 5A average forward current. |
| 2 | A | passive | Anode terminal, the second left-side pad tied internally to the other anode pad in the pin configuration diagram. |
| 3 | K | passive | Cathode terminal, the single right-side pad where the diode bar points; the diode has 100V peak repetitive reverse voltage. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LGE |
| Package | TO-277 |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward Voltage | VF | 0.58 | 0.62 | V | IF = 5A @ 25°C | 2 | |
| Reverse Leakage Current | IR | 10 | 50 | μA | @ 25°C | 2 | |
| Reverse Leakage Current | IR | 8 | 20 | mA | @ 125°C | 2 | |
| Typical junction capacitance | CJ | 370 | pF | 4V,1MHz | 2 | ||
| Average Forward Current | IF(AV) | 5 | A | Tamb=25℃ | 2 | ||
| Peak Forward Surge Current | IFSM | 150 | A | 8.3ms single half sine-wave | 2 | ||
| Junction and Storage Temperature | TJ & TSTG | -55 | 150 | °C | 2 | ||
| Peak Repetitive Reverse Voltage | VRRM | 100 | V | 2 | |||
| RMS Rectified Voltage | VR(RMS) | 70 | V | 2 | |||
| Typical Thermal Resistance Junction to Ambient | RθJA | 60 | ℃/W | 2 | |||
| Typical Thermal Resistance Junction to Lead | RθJL | 3 | ℃/W | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminal: Matte tin plated, solderable per MIL-STD-750, Method 2026 | 1 |
CAD (KiCad official)
- Symbol:
SD5U100SL - Footprint:
Package_TO_SOT_SMD:TO-277A - 3D model: TO-277 (KiCad packages3D, STEP)
- 3D model files:
sd5u100sl-etched.step/sd5u100sl-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sd5u100sl.step/sd5u100sl.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: LGE datasheet (4 pp, sha256
19b5b281612863ef, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).