component
SMD24PLHE3-TP
Public Made by Adomby adom
MCC Micro Commercial Components Schottky Diodes, SOD-123FL. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSMD24PLHE3-TP
MCC Micro Commercial Components · Schottky Diodes · SOD-123FL
SMD24PLHE3-TP from MCC Micro Commercial Components, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MCC Micro Commercial Components |
| Package | SOD-123FL |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | 40 | V | 1 | ||||
| Maximum RMS Voltage | 28 | V | 1 | ||||
| Maximum DC Blocking Voltage | 40 | V | 1 | ||||
| Average Forward Current | IF(AV) | 2 | A | TL=90°C | 1 | ||
| Power Dissipation | PD | 1.68 | W | 1 | |||
| Surge Forward Current | IFSM | 50 | A | 8.3ms, Half Sine; TJ=25°C | 1 | ||
| Maximum Forward Voltage | VF | 0.55 | V | IFM=2.0A; TJ=25°C | 1 | ||
| Maximum DC Reverse Current | IR | 0.1 | mA | TJ=25°C | 1 | ||
| Typical Junction Capacitance | CJ | 115 | pF | f=1.0MHz, VR=4V | 1 | ||
| Operating Junction Temperature Range | -55 | 150 | °C | SMD22PLHE3~SMD26PLHE3 group | 1 | ||
| Storage Temperature Range | -55 | 150 | °C | 1 | |||
| Typical Thermal Resistance Junction to Ambient | 60 | °C/W | PC board mounted on 0.20.2in (55mm) copper pad area (Note 3) | 1 | |||
| Typical Thermal Resistance Junction to Case | 30 | °C/W | PC board mounted on 0.20.2in (55mm) copper pad area (Note 3) | 1 | |||
| Typical Thermal Resistance Junction to Lead | 21 | °C/W | PC board mounted on 0.20.2in (55mm) copper pad area (Note 3) | 1 |
CAD (KiCad official)
- Symbol:
SMD24PLHE3-TP - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files:
smd24plhe3-tp-etched.step/smd24plhe3-tp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smd24plhe3-tp.step/smd24plhe3-tp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MCC Micro Commercial Components datasheet (4 pp, sha256
ac817a07d13eb288, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).