component
WSLP20103L000FEA
Public Made by Adomby adom
Vishay Intertech Current Sense Resistors / Shunt Resistors, 2010. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownWSLP20103L000FEA
Vishay Intertech · Current Sense Resistors / Shunt Resistors · 2010
WSLP20103L000FEA from Vishay Intertech, in a 2010. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | 2010 |
| Category | Resistors |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Resistance tolerance (code F = ±1.0 %) | -1 | 1 | % | Tolerance code F | 1 | ||
| Component temperature coefficient (including terminal) | -150 | 150 | ppm/°C | TCR measured from -55 °C to 150 °C; band ± 150 for 3 mΩ to 4.9 mΩ | 2 | ||
| Element TCR (alloy only) | 20 | ppm/°C | 2 | ||||
| Operating temperature range | -65 | 170 | °C | 2 | |||
| Power rating | 2 | W | P70 °C | 1 | |||
| Resistance value range (tol. ±1.0 %) | 0.001 | 0.03 | Ω | Tol. ±1.0 %, WSLP2010 | 1 | ||
| Thermal shock: resistance change (percentage) | -0.5 | 0.5 | % | -55 °C to +150 °C, 1000 cycles, 15 min at each extreme | 3 | ||
| Thermal shock: resistance change (absolute offset) | 0.0005 | Ω | -55 °C to +150 °C, 1000 cycles, 15 min at each extreme | 3 | |||
| Low temperature operation: resistance change (percentage) | -0.5 | 0.5 | % | -65 °C for 24 h | 3 | ||
| Low temperature operation: resistance change (absolute offset) | 0.0005 | Ω | -65 °C for 24 h | 3 | |||
| High temperature exposure: resistance change (percentage) | -1 | 1 | % | 1000 h at +170 °C | 3 | ||
| High temperature exposure: resistance change (absolute offset) | 0.0005 | Ω | 1000 h at +170 °C | 3 | |||
| Bias humidity: resistance change (percentage) | -0.5 | 0.5 | % | +85 °C, 85 % RH, 10 % bias, 1000 h | 3 | ||
| Bias humidity: resistance change (absolute offset) | 0.0005 | Ω | +85 °C, 85 % RH, 10 % bias, 1000 h | 3 | |||
| Mechanical shock: resistance change (percentage) | -0.5 | 0.5 | % | 100 g's for 6 ms, 5 pulses | 3 | ||
| Mechanical shock: resistance change (absolute offset) | 0.0005 | Ω | 100 g's for 6 ms, 5 pulses | 3 | |||
| Vibration: resistance change (percentage) | -0.5 | 0.5 | % | 10 Hz to 2000 Hz in 1 min, 3 directions, 12 h | 3 | ||
| Vibration: resistance change (absolute offset) | 0.0005 | Ω | 10 Hz to 2000 Hz in 1 min, 3 directions, 12 h | 3 | |||
| Load life: resistance change (percentage) | -1 | 1 | % | 1000 h at 70 °C, 1.5 h ON, 0.5 h OFF | 3 | ||
| Load life: resistance change (absolute offset) | 0.0005 | Ω | 1000 h at 70 °C, 1.5 h ON, 0.5 h OFF | 3 | |||
| Resistance to solder heat: resistance change (percentage) | -0.5 | 0.5 | % | +260 °C solder, 10 s to 12 s dwell, 25 mm/s emergence | 3 | ||
| Resistance to solder heat: resistance change (absolute offset) | 0.0005 | Ω | +260 °C solder, 10 s to 12 s dwell, 25 mm/s emergence | 3 | |||
| Moisture resistance: resistance change (percentage) | -0.5 | 0.5 | % | MIL-STD-202, method 106, 0 % power, 7b not required | 3 | ||
| Moisture resistance: resistance change (absolute offset) | 0.0005 | Ω | MIL-STD-202, method 106, 0 % power, 7b not required | 3 | |||
| Resistance value (nominal, decoded from MPN 3L000) | 0.003 | Ω | Resistance code 3L000 (L = m Ω decade code) | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | (2) Packaging code: EB (lead (Pb)-free) and TB (tin / lead) are non-standard packaging codes that designate 1000 piece reel quantities. These non-standard packaging codes are identical to our standard | 1 |
CAD (KiCad official)
- Symbol:
WSLP20103L000FEA - Footprint:
Resistor_SMD:R_2010_5025Metric - 3D model: 2010 (KiCad packages3D, STEP)
- 3D model files:
wslp20103l000fea-etched.step/wslp20103l000fea-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);wslp20103l000fea.step/wslp20103l000fea.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (4 pp, sha256
a1f9dba57dac86f5, retrieved 2026-10-26, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).