Contents

README

markdown

DP83TC812RRHARQ1

Texas Instruments · Ethernet Transceivers · VQFN-36(6x6)

DP83TC812RRHARQ1 from Texas Instruments, in a VQFN-36(6x6). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 MDC input Management Data Clock. Synchronous clock for the MDIO serial management interface, up to 20 MHz; may be asynchronous to MAC TX/RX clocks. No minimum clock rate.
2 INT_N bidirectional Active-LOW interrupt output with weak internal pull-up (open drain by default). Asserted LOW on interrupt; register access required to enable triggers and clear events. Can be configured as active-HIGH or as a power-down control input via register 0x0011.
3 RESET_N input Active-LOW reset input with internal pull-up. Asserting LOW for at least 1 µs forces a full reset; all internal registers reinitialize to defaults and bootstrap pins are resampled on deassertion.
4 XO output Reference Clock Output for crystal oscillator use only. Must be left floating when a CMOS-level oscillator is fed into XI.
5 XI input Reference Clock Input. 25 MHz crystal or CMOS oscillator for MII/RGMII/RMII Master modes; 50 MHz CMOS oscillator required in RMII Slave mode. Also supports daisy-chained clock in from another PHY/MAC.
6 LED_1/GPIO_1 bidirectional Link Status and TX/RX BLINK activity LED with 9 kΩ internal pull-down (bootstrap). Can be reprogrammed as GPIO, LED, or clock output via strap/register.
7 VSLEEP power_in 3.3 V sleep-domain supply used to keep the wake circuitry alive in TC-10 sleep. Decouple with 0.1 µF ceramic.
8 WAKE bidirectional Active-HIGH TC-10 sleep wake input/output with 455 kΩ internal pull-down. Driving HIGH wakes the PHY from TC-10 SLEEP; a 10 kΩ external pull-down is recommended when TC-10 is used. Can also emit a wake pulse to wake other PHYs.
9 NC unconnected No connection. May be left floating; connecting to any signal has no effect on PHY performance.
10 INH output Active-HIGH open-drain-capable output used to enable an external regulator. Hi-Z during TC-10 SLEEP; HIGH in all other PHY states. Use a 2 kΩ-10 kΩ pull-down when implementing TC-10 (single pull-down shared if multiple PHYs share INH).
11 VDDA power_in 3.3 V analog/core supply. Decouple with 0.47 µF and 0.01 µF ceramics; optional ferrite bead may be added.
12 TRD_P bidirectional MDI differential transmit/receive positive line. Bidirectional 100BASE-T1 (IEEE 802.3bw) single-pair signaling. Pair with TRD_M through the CMC and CM-termination network to the automotive connector.
13 TRD_M bidirectional MDI differential transmit/receive negative line. Bidirectional 100BASE-T1 (IEEE 802.3bw) single-pair signaling. Pair with TRD_P.
14 RX_ER output Receive Error output for MII and RMII modes. Asserted HIGH synchronous to RX_CLK (MII) or the reference clock (RMII) when an error symbol is detected in a received packet. Unused in RGMII and SGMII modes (PHY corrupts data on receive errors automatically).
15 RX_DV/CRS_DV/RX_CTRL output MII Receive Data Valid, RMII Carrier Sense/Data Valid, or RGMII Receive Control depending on MAC-interface mode. Combines valid + error indication in RGMII (RX_DV on rising edge of RX_CLK, RX_ER on falling edge). Unused in SGMII mode.
16 CLKOUT/GPIO_2 bidirectional 25 MHz reference clock output; also usable as LED or GPIO via strap/register. Program register 0x045F=0x000F and 0x0453=0x0003 to disable switching on this pin.
17 GND_ESC passive Optional Ground Escape. May be tied to ground to improve PCB layout, but is NOT a substitute for the DAP ground connection. Leave unconnected if unused.
18 GND_ESC passive Optional Ground Escape. May be tied to ground to improve PCB layout, but is NOT a substitute for the DAP ground connection. Leave unconnected if unused.
19 DNC unconnected Do Not Connect. Leave floating.
20 DNC unconnected Do Not Connect. Leave floating.
21 NC unconnected No connection. May be left floating; connecting to any signal has no effect on PHY performance.
22 VDDMAC power_in Optional MAC-interface supply of 1.8 V, 2.5 V, or 3.3 V; may be at a different voltage level than the other I/O pins. Decouple with 0.47 µF and 0.01 µF ceramics and a ferrite bead. When not needed separately, tie to VDDIO through a shared ferrite bead (0.47 µF must remain local to VDDMAC).
23 RX_D3 output MII Receive Data bit 3, valid on the rising edge of RX_CLK. Not used in RMII mode (unless bootstrapped to RMII Master, in which case this pin outputs a 50 MHz reference clock to the MAC). Not used in RGMII mode.
24 RX_D2 output MII Receive Data bit 2, valid on the rising edge of RX_CLK. Not used in RMII or RGMII modes.
25 RX_D1 output Receive Data bit 1, valid on the rising edge of RX_CLK in MII and RMII modes. Not used in RGMII mode.
26 RX_D0 output Receive Data bit 0, valid on the rising edge of RX_CLK in MII and RMII modes. Not used in RGMII mode.
27 RX_CLK output Receive Clock. Provides a 25 MHz reference clock in MII and RGMII modes. Unused in RMII and SGMII modes.
28 TX_CLK bidirectional Transmit Clock. In MII mode this is a 25 MHz output with a 50 Ω driver, phase-referenced to the reference clock. In RGMII mode the MAC drives a 25 MHz clock into this pin (not required to be phase-referenced unless synchronous RGMII is enabled). Unused in RMII and SGMII modes.
29 TX_EN/TX_CTRL input MII/RMII Transmit Enable or RGMII Transmit Control. In MII, indicates valid data on TX_D[3:0] prior to the rising edge of TX_CLK; in RMII, prior to the rising edge of the reference clock. In RGMII, combines TX_EN (rising edge of TX_CLK) and TX_ER (falling edge). Unused in SGMII mode.
30 TX_D3 input MII Transmit Data bit 3, sampled on the rising edge of TX_CLK. Not used in RMII or RGMII modes.
31 TX_D2 input MII Transmit Data bit 2, sampled on the rising edge of TX_CLK. Not used in RMII or RGMII modes.
32 TX_D1 input Transmit Data bit 1, sampled on the rising edge of TX_CLK (MII) or the reference clock (RMII). Not used in RGMII mode.
33 TX_D0 input Transmit Data bit 0, sampled on the rising edge of TX_CLK (MII) or the reference clock (RMII). Not used in RGMII mode.
34 VDDIO power_in Digital I/O supply of 1.8 V, 2.5 V, or 3.3 V. Decouple with a ferrite bead plus 0.47 µF and 0.01 µF ceramics.
35 LED_0/GPIO_0 bidirectional Link Status LED with 9 kΩ internal pull-down (bootstrap). Can also be used as a GPIO or clock output via register selection.
36 MDIO bidirectional Management Data Input/Output. Open-drain bidirectional serial management line sourced by the management station or the PHY. Requires an external pull-up resistor between 2.2 kΩ and 9 kΩ (single shared pull-up on a bus with multiple PHYs).
DAP GND power_in Die Attach Pad ground. Must always be connected to power ground.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-36(6x6)
Category Interface
Pins 37

Ordering variants

  • DP83TC812RRHARQ1
  • DP83TC812RRHARQ1 (S-Q1 orderable base)

CAD (KiCad official)

  • Symbol: DP83TC812RRHARQ1
  • Footprint: Package_DFN_QFN:QFN-36-1EP_6x6mm_P0.5mm_EP3.7x3.7mm
  • 3D model: VQFN-36(6x6) (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
dp83tc812rrharq1.step 396 KB You want the bare part, or you mark your own boards.
dp83tc812rrharq1-etched.step 3.6 MB You want the part with DP83TC812RRHARQ1 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 899 faces against 230 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (198 pp, sha256 e9c0b33b38d7d215, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

Symbol & Footprint

Schematic Symbol

Open full view ↗

PCB Footprint

Open full view ↗