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ESP32-C3-MINI-1-H4
Public Made by Adomby adom
Espressif Systems WiFi Modules, ESP32-C3-MINI-1. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownESP32-C3-MINI-1-H4
Espressif Systems · WiFi Modules · ESP32-C3-MINI-1
ESP32-C3-MINI-1-H4 from Espressif Systems, in a ESP32-C3-MINI-1. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground (GND) connection of the module. |
| 2 | GND | power_in | Ground (GND) connection of the module. |
| 3 | 3V3 | power_in | Power supply pin of the module; recommended supply is 3.0-3.6 V with 3.3 V typical. |
| 4 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 5 | IO2 | bidirectional | GPIO2 general-purpose I/O, also ADC1_CH2 and FSPIQ. |
| 6 | IO3 | bidirectional | GPIO3 general-purpose I/O, also ADC1_CH3. |
| 7 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 8 | EN | input | Chip enable: High turns the chip on, Low turns it off; do not leave this pin floating. |
| 9 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 10 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 11 | GND | power_in | Ground (GND) connection of the module. |
| 12 | IO0 | bidirectional | GPIO0 general-purpose I/O, also ADC1_CH0 and XTAL_32K_P. |
| 13 | IO1 | bidirectional | GPIO1 general-purpose I/O, also ADC1_CH1 and XTAL_32K_N. |
| 14 | GND | power_in | Ground (GND) connection of the module. |
| 15 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 16 | IO10 | bidirectional | GPIO10 general-purpose I/O, also FSPICS0. |
| 17 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 18 | IO4 | bidirectional | GPIO4 general-purpose I/O, also ADC1_CH4, FSPIHD and MTMS. |
| 19 | IO5 | bidirectional | GPIO5 general-purpose I/O, also ADC2_CH0, FSPIWP and MTDI. |
| 20 | IO6 | bidirectional | GPIO6 general-purpose I/O, also FSPICLK and MTCK. |
| 21 | IO7 | bidirectional | GPIO7 general-purpose I/O, also FSPID and MTDO. |
| 22 | IO8 | bidirectional | GPIO8 general-purpose I/O. |
| 23 | IO9 | bidirectional | GPIO9 general-purpose I/O. |
| 24 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 25 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 26 | IO18 | bidirectional | GPIO18 general-purpose I/O, also USB_D-. |
| 27 | IO19 | bidirectional | GPIO19 general-purpose I/O, also USB_D+. |
| 28 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 29 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 30 | RXD0 | bidirectional | GPIO20 general-purpose I/O, also UART0 receive (U0RXD). |
| 31 | TXD0 | bidirectional | GPIO21 general-purpose I/O, also UART0 transmit (U0TXD). |
| 32 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 33 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 34 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 35 | NC | unconnected | Not connected; no function is assigned to this pin. |
| 36 | GND | power_in | Ground (GND) connection of the module. |
| 37 | GND | power_in | Ground (GND) connection of the module. |
| 38 | GND | power_in | Ground (GND) connection of the module. |
| 39 | GND | power_in | Ground (GND) connection of the module. |
| 40 | GND | power_in | Ground (GND) connection of the module. |
| 41 | GND | power_in | Ground (GND) connection of the module. |
| 42 | GND | power_in | Ground (GND) connection of the module. |
| 43 | GND | power_in | Ground (GND) connection of the module. |
| 44 | GND | power_in | Ground (GND) connection of the module. |
| 45 | GND | power_in | Ground (GND) connection of the module. |
| 46 | GND | power_in | Ground (GND) connection of the module. |
| 47 | GND | power_in | Ground (GND) connection of the module. |
| 48 | GND | power_in | Ground (GND) connection of the module. |
| 49 | GND | power_in | Ground (GND) connection of the module; this is the exposed thermal pad (EPAD). |
| 50 | GND | power_in | Ground (GND) connection of the module. |
| 51 | GND | power_in | Ground (GND) connection of the module. |
| 52 | GND | power_in | Ground (GND) connection of the module. |
| 53 | GND | power_in | Ground (GND) connection of the module. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | ESP32-C3-MINI-1 |
| Category | IoT/Communication Modules |
| Pins | 53 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | 3.6 | V | 21 | ||
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | 21 | |
| Current delivered by external power supply | IVDD | 0.5 | A | 21 | |||
| Operating ambient temperature | TA | -40 | 105 | °C | 105 °C version module | 21 | |
| High-level input current | IIH | 50 | nA | 21 | |||
| Low-level input current | IIL | 50 | nA | 21 | |||
| Power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | Flash, power supply voltage (3.3 V) | 23 |
| Maximum clock frequency | FC | 80 | MHz | Flash | 23 | ||
| Program/erase cycles | 100000 | cycles | Flash | 23 | |||
| Data retention time | TRET | 20 | years | Flash | 23 | ||
| Page program time | TPP | 5 | ms | Flash | 23 | ||
| Sector erase time (4 KB) | TSE | 500 | ms | Flash | 23 | ||
| Block erase time (32 KB) | TBE1 | 2 | s | Flash | 23 | ||
| Block erase time (64 KB) | TBE2 | 3 | s | Flash | 23 | ||
| Chip erase time (32 Mb) | TCE | 60 | s | Flash | 24 | ||
| Center frequency range of operating channel (Wi-Fi) | 2412 | 2484 | MHz | 25 | |||
| Center frequency range of operating channel (Bluetooth LE) | 2402 | 2480 | MHz | 27 | |||
| RF transmit power range | -24 | 20 | dBm | Bluetooth LE | 27 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | THERMOPLASTIC | HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; | 36 | |
| contacts | COPPER ALLOY | gold | CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
| shell | COPPER ALLOY | gold | SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 36 |
CAD (KiCad official)
- Symbol:
ESP32-C3-MINI-1-H4 - Footprint:
PCM_Espressif:ESP32-C3-MINI-1 - 3D model: ESP32-C3-MINI-1 (KiCad packages3D, STEP)
- 3D model files:
esp32-c3-mini-1-h4-etched.step/esp32-c3-mini-1-h4-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esp32-c3-mini-1-h4.step/esp32-c3-mini-1-h4.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Espressif Systems datasheet (48 pp, sha256
de7361381348d82a, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).