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SZP6SMB16AT3G
Public Made by Adomby adom
Littelfuse TVS, SMB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSZP6SMB16AT3G
Littelfuse · TVS · SMB
SZP6SMB16AT3G from Littelfuse, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode of the unidirectional TVS diode, marked by the color band/cathode mark, connected to the protected positive line (VRWM 13.6 V, VBR 15.2 to 16.8 V for the 16A device). |
| 2 | Anode | passive | Anode of the unidirectional TVS diode, connected to ground/return, with clamping voltage of 22.5 V max at IPP 27 A for the 16A device. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Littelfuse |
| Package | SMB |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 15.2 | 16 | 16.8 | V | @ IT = 1 mA | 3 |
| Reverse Leakage Current | IR | 5 | µA | @ VRWM | 3 | ||
| Clamping Voltage | VC | 22.5 | V | @ IPP = 27 A | 3 | ||
| Forward Voltage | VF | 3.5 | V | IF = 30 A, TA = 25°C | 2 | ||
| Peak Power Dissipation | PPK | 600 | W | TL = 25°C, Pulse Width = 1 ms | 1 | ||
| DC Power Dissipation (lead) | PD | 3 | W | TL = 75°C, zero lead length | 1 | ||
| DC Power Dissipation (ambient) | PD | 0.55 | W | TA = 25°C, FR-4 board, minimum footprint | 1 | ||
| Forward Surge Current | IFSM | 100 | A | TA = 25°C, 8.3 ms half sine, unidirectional only | 1 | ||
| Operating and Storage Temperature Range | TJ, Tstg | -65 | 150 | °C | 1 | ||
| Working Peak Reverse Voltage | VRWM | 13.6 | V | 3 | |||
| Thermal Resistance Junction-to-Lead | RθJL | 25 | °C/W | 1 | |||
| Thermal Resistance Junction-to-Ambient | RθJA | 226 | °C/W | 1 | |||
| Breakdown Voltage Temperature Coefficient | 0.086 | %/°C | 3 | ||||
| Typical Capacitance | C | 1110 | pF | Bias Voltage = 0 V, F = 1 MHz, TJ = 25°C | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | and the terminal finish material is tin(Sn) (IPC/ | 1 |
CAD (KiCad official)
- Symbol:
SZP6SMB16AT3G - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
szp6smb16at3g-etched.step/szp6smb16at3g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);szp6smb16at3g.step/szp6smb16at3g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Littelfuse datasheet (7 pp, sha256
baf561fbcd6cd66c, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).