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Contents

README

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MC74HC175ADR2G

onsemi · Flip Flops · SOIC-16

MC74HC175ADR2G from onsemi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RESET input Active-low asynchronous reset input that clears all four flip-flops when a low level is applied, independent of the clock.
2 Q0 output Data output of flip-flop 0, which follows the D0 input on the next positive clock edge.
3 Q0 output Complementary (inverted) output of flip-flop 0, driving CMOS, NMOS or TTL loads (10 LSTTL loads).
4 D0 input Data input of flip-flop 0, transferred to Q0 on the next positive-going clock edge.
5 D1 input Data input of flip-flop 1, transferred to Q1 on the next positive-going clock edge.
6 Q1 output Complementary (inverted) output of flip-flop 1, driving CMOS, NMOS or TTL loads (10 LSTTL loads).
7 Q1 output Data output of flip-flop 1, which follows the D1 input on the next positive clock edge.
8 GND power_in Ground reference pin for the device, with all voltages referenced to GND.
9 CLOCK input Common clock input; data at each D input is latched on the positive-going edge, with minimum pulse width of 80 ns at 2.0 V.
10 Q2 output Data output of flip-flop 2, which follows the D2 input on the next positive clock edge.
11 Q2 output Complementary (inverted) output of flip-flop 2, driving CMOS, NMOS or TTL loads (10 LSTTL loads).
12 D2 input Data input of flip-flop 2, transferred to Q2 on the next positive-going clock edge.
13 D3 input Data input of flip-flop 3, transferred to Q3 on the next positive-going clock edge.
14 Q3 output Complementary (inverted) output of flip-flop 3, driving CMOS, NMOS or TTL loads (10 LSTTL loads).
15 Q3 output Data output of flip-flop 3, which follows the D3 input on the next positive clock edge.
16 VCC power_in Positive supply pin, specified for 2.0 V to 6.0 V with respect to GND (absolute maximum 7.0 V).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-16
Category Logic
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC Supply Voltage VCC -0.5 7 V Referenced to GND 3
DC Input Voltage Vin -0.5 V Referenced to GND; max VCC + 0.5 3
DC Output Voltage Vout -0.5 V Referenced to GND; max VCC + 0.5 3
DC Input Current, per Pin Iin -20 20 mA 3
DC Output Current, per Pin Iout -25 25 mA 3
DC Supply Current, VCC and GND Pins ICC -50 50 mA 3
Power Dissipation in Still Air, SOIC Package PD 500 mW Derating -7 mW/C from 65 to 125C 3
Storage Temperature Tstg -65 150 C 3
Lead Temperature TL 260 C 1 mm from case for 10 seconds 3
DC Supply Voltage VCC 2 6 V Referenced to GND 3
DC Input/Output Voltage Vin, Vout 0 V Referenced to GND; max VCC 3
Operating Temperature TA -55 125 C All package types 3
Input Rise and Fall Time tr, tf 0 1000 ns VCC = 2.0 V 3
Input Rise and Fall Time tr, tf 0 600 ns VCC = 3.0 V 3
Input Rise and Fall Time tr, tf 0 500 ns VCC = 4.5 V 3
Input Rise and Fall Time tr, tf 0 400 ns VCC = 6.0 V 3
Minimum High-Level Input Voltage VIH 1.5 V VCC=2.0 V, Vout=0.1 V or VCC-0.1 V, /Iout/<=20 uA, -55 to 125C 4
Minimum High-Level Input Voltage VIH 2.1 V VCC=3.0 V, Vout=0.1 V or VCC-0.1 V, /Iout/<=20 uA, -55 to 125C 4
Minimum High-Level Input Voltage VIH 3.15 V VCC=4.5 V, Vout=0.1 V or VCC-0.1 V, /Iout/<=20 uA, -55 to 125C 4
Minimum High-Level Input Voltage VIH 4.2 V VCC=6.0 V, Vout=0.1 V or VCC-0.1 V, /Iout/<=20 uA, -55 to 125C 4
Maximum Low-Level Input Voltage VIL 0.5 V VCC=2.0 V, Vout=0.1 V or VCC-0.1 V, /Iout/<=20 uA, -55 to 125C 4
Maximum Low-Level Input Voltage VIL 0.9 V VCC=3.0 V, Vout=0.1 V or VCC-0.1 V, /Iout/<=20 uA, -55 to 125C 4
Maximum Low-Level Input Voltage VIL 1.35 V VCC=4.5 V, Vout=0.1 V or VCC-0.1 V, /Iout/<=20 uA, -55 to 125C 4
Maximum Low-Level Input Voltage VIL 1.8 V VCC=6.0 V, Vout=0.1 V or VCC-0.1 V, /Iout/<=20 uA, -55 to 125C 4
Minimum High-Level Output Voltage VOH 1.9 V VCC=2.0 V, Vin=VIH or VIL, /Iout/<=20 uA, all temps 4
Minimum High-Level Output Voltage VOH 4.4 V VCC=4.5 V, Vin=VIH or VIL, /Iout/<=20 uA, all temps 4
Minimum High-Level Output Voltage VOH 5.9 V VCC=6.0 V, Vin=VIH or VIL, /Iout/<=20 uA, all temps 4
Minimum High-Level Output Voltage VOH 2.48 V VCC=3.0 V, Vin=VIH or VIL, /Iout/<=2.4 mA, -55 to 25C 4
Minimum High-Level Output Voltage VOH 2.2 V VCC=3.0 V, Vin=VIH or VIL, /Iout/<=2.4 mA, 125C 4
Minimum High-Level Output Voltage VOH 3.98 V VCC=4.5 V, Vin=VIH or VIL, /Iout/<=4.0 mA, -55 to 25C 4
Minimum High-Level Output Voltage VOH 3.7 V VCC=4.5 V, Vin=VIH or VIL, /Iout/<=4.0 mA, 125C 4
Minimum High-Level Output Voltage VOH 5.48 V VCC=6.0 V, Vin=VIH or VIL, /Iout/<=5.2 mA, -55 to 25C 4
Minimum High-Level Output Voltage VOH 5.2 V VCC=6.0 V, Vin=VIH or VIL, /Iout/<=5.2 mA, 125C 4
Maximum Low-Level Output Voltage VOL 0.1 V VCC=2.0/4.5/6.0 V, Vin=VIH or VIL, /Iout/<=20 uA, all temps 4
Maximum Low-Level Output Voltage VOL 0.26 V VCC=3.0/4.5/6.0 V, Vin=VIH or VIL, /Iout/<=2.4/4.0/5.2 mA, -55 to 25C 4
Maximum Low-Level Output Voltage VOL 0.4 V VCC=3.0/4.5/6.0 V, Vin=VIH or VIL, /Iout/<=2.4/4.0/5.2 mA, 125C 4
Maximum Input Leakage Current Iin -0.1 0.1 µA Vin = VCC or GND, VCC=6.0 V, -55 to 25C 4
Maximum Input Leakage Current Iin -1 1 µA Vin = VCC or GND, VCC=6.0 V, 85C and 125C 4
Maximum Quiescent Supply Current (per Package) ICC 4 µA Vin = VCC or GND, Iout = 0 uA, VCC=6.0 V, -55 to 25C 4
Maximum Quiescent Supply Current (per Package) ICC 40 µA Vin = VCC or GND, Iout = 0 uA, VCC=6.0 V, 85C 4
Maximum Quiescent Supply Current (per Package) ICC 160 µA Vin = VCC or GND, Iout = 0 uA, VCC=6.0 V, 125C 4
Maximum Clock Frequency (50% Duty Cycle) fmax 6 MHz VCC=2.0 V, -55 to 25C, CL=50 pF 5
Maximum Clock Frequency (50% Duty Cycle) fmax 30 MHz VCC=4.5 V, -55 to 25C, CL=50 pF 5
Maximum Clock Frequency (50% Duty Cycle) fmax 35 MHz VCC=6.0 V, -55 to 25C, CL=50 pF 5
Maximum Propagation Delay, Clock to Q or Q̄ tPLH, tPHL 26 ns VCC=4.5 V, -55 to 25C, CL=50 pF 5
Maximum Propagation Delay, Clock to Q or Q̄ tPLH, tPHL 38 ns VCC=4.5 V, 125C, CL=50 pF 5
Maximum Propagation Delay, Reset to Q or Q̄ tPHL 22 ns VCC=4.5 V, -55 to 25C, CL=50 pF 5
Maximum Propagation Delay, Reset to Q or Q̄ tPHL 34 ns VCC=4.5 V, 125C, CL=50 pF 5
Maximum Output Transition Time, Any Output tTLH, tTHL 15 ns VCC=4.5 V, -55 to 25C, CL=50 pF 5
Maximum Output Transition Time, Any Output tTLH, tTHL 22 ns VCC=4.5 V, 125C, CL=50 pF 5
Maximum Input Capacitance Cin 10 pF 5
Minimum Setup Time, Data to Clock tsu 20 ns VCC=4.5 V, -55 to 25C 5
Minimum Setup Time, Data to Clock tsu 30 ns VCC=4.5 V, 125C 5
Minimum Hold Time, Clock to Data th 3 ns VCC=4.5 V, all temps 5
Minimum Recovery Time, Reset Inactive to Clock trec 20 ns VCC=4.5 V, -55 to 25C 5
Minimum Pulse Width, Clock tw 16 ns VCC=4.5 V, -55 to 25C 5
Minimum Pulse Width, Reset tw 16 ns VCC=4.5 V, -55 to 25C 5
Maximum Input Rise and Fall Times tr, tf 500 ns VCC=4.5 V, all temps 5
Power Dissipation Capacitance (Per Flip-Flop) CPD 35 pF Typical @ 25°C, VCC = 5.0 V 5

CAD (KiCad official)

  • Symbol: MC74HC175ADR2G
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: mc74hc175adr2g-etched.step / mc74hc175adr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc74hc175adr2g.step / mc74hc175adr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (10 pp, sha256 999c30a0b7638338, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF