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Contents

README

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SE9175-HF

Seaward Elec · Battery Management ICs · SOP-8-EP

SE9175-HF from Seaward Elec, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input voltage pin; recommended range 1.3 V to VCNTL, absolute maximum 6 V.
2 GND power_in Ground pin.
3 REFEN input Reference voltage input and chip enable pin; rising above 0.65 V enables, falling below 0.2 V shuts down the output to high impedance.
4 VOUT output Output voltage pin that sinks or sources up to 2A (current limit min 2.1 A) while tracking the REFEN voltage.
5 NC unconnected No connect pin.
6 VCNTL power_in Supply input and gate drive voltage pin; recommended 5 V or 3.3 V, absolute maximum 6 V.
7 NC unconnected No connect pin.
8 NC unconnected No connect pin.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Seaward Elec
Package SOP-8-EP
Category Power Management ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate Drive Voltage Range VCNTL 3.3 5.5 V 4
POR Threshold VCNTLRTH 2.55 V 4
POR Hysteresis VCNTL 0.1 V 4
Input Voltage VIN 1.3 V max is VCNTL 4
Quiescent Current ICNTL 1 3 mA IOUT=0A 4
Standby Current ISTBY 1 10 uA IOUT=0A, VREFEN=0V 4
Output Offset Voltage VOS -20 20 mV IOUT=0A 4
Load Regulation ΔVLOAD -20 0.5 20 % IOUT=±2.0A 4
Shutdown Threshold Enable VIH 0.65 V REFEN Rising 4
Shutdown Threshold VIL 0.2 V REFEN Falling 4
Current Limit Sourcing ICL-Source 2.1 A Sourcing 4
Current Limit Sinking ICL-Sink 2.1 A Sinking 4
Soft-Start Period TSS 1.4 ms VOUT=1.25V 4
Thermal Shutdown TSD 155 ℃ 4
Thermal Shutdown Hysteresis TSDH 30 ℃ 4
VIN Supply Voltage VIN 6 V 3
Control Voltage VCNTL 6 V 3
Storage Temperature Range TST -40 150 ℃ 3
Thermal Resistance Junction to Case θJC 15 ℃/W 3
Thermal Resistance Junction to Ambient θJA 40 ℃/W PCB copper area approx 1.5 in2 connected to exposed pad 3
Input Voltage VIN 1.3 V 1.3 to VCNTL 4
Ambient Temperature TA -40 85 ℃ 4
Junction Temperature TJ -40 125 ℃ 4

CAD (KiCad official)

  • Symbol: SE9175-HF
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: se9175-hf-etched.step / se9175-hf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); se9175-hf.step / se9175-hf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Seaward Elec datasheet (10 pp, sha256 0a60142606cb6c8b, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF