component
SMBJ58CA-TP
Public Made by Adomby adom
MCC(Micro Commercial Components) TVS, SMB(DO-214AA). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSMBJ58CA-TP
MCC(Micro Commercial Components) · TVS · SMB(DO-214AA)
SMBJ58CA-TP from MCC(Micro Commercial Components), in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Bi-directional terminal 1 of the SMBJ58CA (VWM 58V, VBR 64.4-71.2V at 1mA, VC 93.6V at 6.4A IPP); no polarity, interchangeable with the other terminal. |
| 2 | A2 | passive | Bi-directional terminal 2 of the SMBJ58CA (VWM 58V, VBR 64.4-71.2V at 1mA, VC 93.6V at 6.4A IPP); no polarity, interchangeable with the other terminal. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VWM | 58 | V | SMBJ58CA | 5 | ||
| Breakdown Voltage | V(BR) | 64.4 | 71.2 | V | @ IT = 1 mA | 5 | |
| Maximum Clamping Voltage | VC | 93.6 | V | @ IPP | 5 | ||
| Peak Pulse Current | IPP | 6.4 | A | 10/1000us waveform | 5 | ||
| Maximum Reverse Leakage | ID | 1 | µA | @ VWM | 5 | ||
| Peak Pulse Power Dissipation | PPP | 600 | W | Note 2,3,4 | 1 | ||
| Steady State Power Dissipation | PM(AV) | 5 | W | Note 5, TL=75°C | 1 | ||
| Operating Junction Temperature Range | TJ | -55 | 175 | °C | 1 | ||
| Storage Temperature Range | TSTG | -55 | 175 | °C | 1 | ||
| Thermal Resistance Junction to Lead | 20 | °C/W | Junction to Lead | 1 | |||
| Thermal Resistance Junction to Case | 25 | °C/W | Junction to Case | 1 | |||
| Maximum Soldering Temperature | 260 | °C | 10 seconds | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | copper pads to each terminal. | 1 |
CAD (KiCad official)
- Symbol:
SMBJ58CA-TP - Footprint:
Diode_SMD:D_SMB - 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files:
smbj58ca-tp-etched.step/smbj58ca-tp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbj58ca-tp.step/smbj58ca-tp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MCC(Micro Commercial Components) datasheet (8 pp, sha256
01214abe0af87258, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).