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MLX92211LSE-AAA-000-SP

Public Made by Adom

by adom

Melexis Hall Switches, TSOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Symbol & Footprint

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Contents

README

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MLX92211LSE-AAA-000-SP

Melexis · Hall Switches · TSOT-23

MLX92211LSE-AAA-000-SP from Melexis, in a TSOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Supply voltage pin; the device operates from 2.7 V to 24 V and has built-in reverse supply voltage protection.
2 OUT output Open-drain output pin, fully protected against short circuit by a built-in current limit with automatic output shut-off during prolonged short circuit.
3 GND power_in Ground pin.

Key specifications

Parameter Value
Manufacturer Melexis
Package TSOT-23
Category Magnetic Sensors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Temperature Range TA -40 150 °C 5
Storage Temperature Range TS -55 165 °C 5
Supply Voltage VDD 27 V fn 1,2: max 1 hour 5
Supply Voltage (Load dump) VDD 32 V fn 1,3: max 0.5 s 5
Supply Current IDD 20 mA fn 1,2,4 5
Supply Current (Load dump) IDD 50 mA fn 1,3,4 5
Reverse Supply Voltage VDDREV -24 V fn 1,2 5
Reverse Supply Voltage (Load dump) VDDREV -30 V fn 1,3 5
Reverse Supply Current IDDREV -20 mA fn 1,2,5 5
Reverse Supply Current (Load dump) IDDREV -50 mA fn 1,3,5 5
Output Voltage VOUT 27 V fn 1,2 5
Output Current IOUT 20 mA fn 1,2,5 5
Output Current IOUT 75 mA fn 1,3,6,10 (valid for AAA/ACA) 5
Reverse Output Voltage VOUTREV -0.5 V fn 1 5
Reverse Output Current IOUTREV -50 mA fn 1,2 5
Maximum Junction Temperature TJ 165 °C fn 7: 1000 hours 5
ESD Sensitivity, HBM 4000 V AEC-Q100-002; valid for AAA/ACA 5
ESD Sensitivity, CDM 1000 V AEC-Q100-011 5
Supply Voltage VDD 2.7 24 V Operating 6
Supply Current IDD 1.5 3 4.5 mA 6
Reverse Supply Current IDDREV -1 mA VDD = -18V 6
Output Leakage Current IOFF 0.1 10 µA VOUT = 12V, VDD = 12V, B < Brp 6
Output Saturation Voltage VDSon 0.2 0.5 V B > BOP, VDD = 3.8 to 18V, IOUT = 20mA 6
Output Rise Time (RPU dependent) tR 0.1 0.3 1 µs VDD = 12V, VPU = 5V, RPU = 1kΩ, CLOAD = 50pF to GND 6
Output Fall Time (on-chip controlled) tF 0.1 0.3 1 µs VDD = 12V, VPU = 5V, RPU = 1kΩ, CLOAD = 50pF to GND 6
Output Current Limit ICL 22 40 70 mA B > BOP, VDD = 3.8 to 18V, VOUT = 12V; valid for AAA 6
Output ON Time under Current Limit conditions tCLON 150 240 µs B > BOP, VPU = 12V, RPU = 100Ω 6
Output OFF Time under Current Limit conditions tCLOFF 3.5 ms B > BOP, VPU = 12V, RPU = 100Ω 6
Chopping Frequency fCHOP 340 kHz 6
Output Refresh Period tPER 6 µs 6
Delay time tD 6 µs Average over 1000 successive switching events @10kHz, square wave with B≥30mT, tRISE=tFALL≤20μs 6
Output Jitter (p-p) tJITTER -3 3 µs Over 1000 successive switching events @1kHz, square wave with B≥30mT, tRISE=tFALL≤100μs 6
Maximum Switching Frequency fSW 30 50 kHz B≥30mT and square wave magnetic field 6
Power-On Time tON 16 35 µs VDD = 5V, dVDD/dt > 2V/us 7
Under-voltage Lockout Threshold VUVL 2.2 2.4 2.7 V 7
Under-voltage Lockout Reaction time tUVL 1 µs 7
Thermal Protection Threshold TPROT 185 °C Junction temperature 7
Thermal Protection Release TREL 170 °C Junction temperature 7
SE Package Thermal Resistance RTH 300 °C/W Single layer (1S) JEDEC board 7
Operating Point (TA = -40°C) BOP 1.4 3.2 4.7 mT TA = -40°C; VDD = 3.8 to 24V 8
Release Point (TA = -40°C) BRP -4.7 -3.2 -1.4 mT TA = -40°C; VDD = 3.8 to 24V 8
Operating Point (TA = 25°C) BOP 1.4 3 4.7 mT TA = 25°C; VDD = 3.8 to 24V 8
Release Point (TA = 25°C) BRP -4.7 -3 -1.4 mT TA = 25°C; VDD = 3.8 to 24V 8
Operating Point (TA = 150°C) BOP 0.7 2.6 5 mT TA = 150°C; VDD = 3.8 to 24V 8
Release Point (TA = 150°C) BRP -5 -2.6 -0.7 mT TA = 150°C; VDD = 3.8 to 24V 8
Temperature Coefficient of BOP/BRP TC -1100 ppm/°C TA = -40°C to 150°C; guaranteed by design, not production tested 8

CAD (KiCad official)

  • Symbol: MLX92211LSE-AAA-000-SP
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: TSOT-23 (KiCad packages3D, STEP)
  • 3D model files: mlx92211lse-aaa-000-sp-etched.step / mlx92211lse-aaa-000-sp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mlx92211lse-aaa-000-sp.step / mlx92211lse-aaa-000-sp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Melexis datasheet (16 pp, sha256 bdd1b6b7efdcb261, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF