Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

GBI1633SMAR

GOSEMICON · DC-DC Converters · ESOP-8

GBI1633SMAR from GOSEMICON, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT input Power supply for the high-side power MOSFET gate driver; must connect a 0.1uF or greater ceramic capacitor between the BOOT and SW pins.
2 VIN power_in Power supply input for the device (4.5V to 60V operating range), which must be locally bypassed.
3 EN input Enable logic input that supports voltages up to the VIN supply, with precision thresholds of 1.21V rising and 1.05V falling; floating the pin enables the device.
4 RT input Resistor timing pin that sets the switching frequency through a resistor to GND, and must not be left floating or shorted to GND.
5 FB input Buck converter feedback sense input; a resistor divider from VOUT to FB and from FB to GND sets the output, regulating FB to the internal 0.75V reference.
6 SS input Soft-start time pin; a capacitor to GND sets the soft-start time, and the pin may be left floating for a default soft-start time of about 5ms.
7 GND power_in Ground reference for the device.
8 SW output Switching node of the buck converter, rated up to 65V (SW to GND) per the absolute maximum ratings.
9 Thermal Pad power_in Exposed thermal pad that must be grounded in the PCB layout.

Key specifications

Parameter Value
Manufacturer GOSEMICON
Package ESOP-8
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage VIN, EN to GND -0.3 65 V 3
FB to GND -0.3 6.5 V 3
SS to GND -0.3 6.5 V 3
RT to GND -0.3 6.5 V 3
SW to GND -0.6 65 V 3
SW to GND (20ns transient) -3 65 V 20ns transient 3
BOOT to SW 6.5 V 3
Junction temperature TJ -40 150 °C 3
Storage temperature TSTG -65 150 °C 3
VIN Supply voltage range VIN 4.5 60 V 3
BOOT to SW 0 6 V 3
FB, EN, PG 0 6 V 3
EN EN 0 60 V 3
Switching frequency range at RT mode fSW 200 2000 kHz 3
Operating junction temperature TJ -40 125 °C 3
Junction to ambient thermal resistance (eSOP-8L) RθJA 42.5 °C/W 4
Junction to case thermal resistance (eSOP-8L) RθJC 56.1 °C/W 4
Junction to board characterization parameter (eSOP-8L) ψJB 25.4 °C/W 4
Junction to top characterization parameter (eSOP-8L) ψJT 10 °C/W 4
Operating input voltage VIN 4.5 60 V 4
Input UVLO (VIN rising) VIN_UVLO 4.2 4.4 V VIN rising 4
Input UVLO hysteresis 350 mV 4
Shutdown current ISHDN 1 uA EN=0, No load, 4.5V≤VIN≤60V 4
Quiescent current IQ 100 uA EN=floating, No load, No switch, 4.5V≤VIN≤60V, BOOT-SW=5V 4
Enable high threshold VEN_H 1.17 1.21 1.25 V 4
Enable low threshold VEN_L 1.05 V 4
Feedback voltage VFB 0.742 0.75 0.758 V 4
High side FET on-resistance RDSON_H 100 150 235 mΩ 4
Switching frequency fSW 410 470 520 KHz RT=50k 4
Maximum switching frequency 2 MHz 4
Minimum on-time tON_MIN 100 ns 4
Maximum duty cycle DMAX 95 % fSW=500kHz 4
Internal soft-start time tSS 1.8 5 7.8 ms SS pin floating 4
Soft start current ISS 4 uA 4
HSD peak current limit ILIM_HSD 4.45 4.75 5.05 A VIN=24V 5
Thermal shutdown threshold TSD 170 °C 5
Thermal shutdown hysteresis 30 °C 5
Output over voltage protection rising VOVP_H 108 % 5
Output over voltage protection falling VOVP_L 103 % 5
Output under voltage protection falling VUVP_L 92 % 5
Output under voltage protection rising VUVP_H 97 % 5

CAD (KiCad official)

  • Symbol: GBI1633SMAR
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: gbi1633smar-etched.step / gbi1633smar-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbi1633smar.step / gbi1633smar.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GOSEMICON datasheet (19 pp, sha256 3c112b7acfbd9ef8, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF