component
AP2303MTR-G1
Public Made by Adomby adom
Diodes Incorporated Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAP2303MTR-G1
Diodes Incorporated · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOIC-8
AP2303MTR-G1 from Diodes Incorporated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Unregulated power input supply, with a 1.2V to 5.5V recommended operating range; a small 10µF MLCC should be connected from this pin to GND. |
| 2 | GND | power_in | Ground reference pin for the device. |
| 3 | VREFEN | input | Reference voltage input and active-low shutdown control; pulling it to ground turns the device off, and releasing it starts a soft-start of about 0.1ms, with a recommended range of 0.6V to VCNTL-2.2V. |
| 4 | VOUT | power_out | Regulated termination voltage output, which requires a minimum of 10µF ceramic capacitor to ground for stability. |
| 5 | NC | unconnected | No connection. |
| 6 | VCNTL | power_in | Supplies the internal control circuitry and provides the drive voltage, with a 3.0V to 5.5V control input range and VCNTL kept at or above VIN during power-on and power-off sequencing. |
| 7 | NC | unconnected | No connection. |
| 8 | NC | unconnected | No connection. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCNTL Operating Current | IVCNTL | 0.5 | 1.5 | mA | No Load | 5 | |
| VCNTL Input Current in Shutdown Mode | ISD-VCNTL | 30 | 50 | µA | VREFEN < 0.15V | 5 | |
| VIN Input Current in Shutdown Mode | ISD-VIN | -1 | 1 | µA | VREFEN < 0.15V | 5 | |
| VREFEN Leakage Current | IVREFEN | -1 | 1 | µA | VREFEN = 0.75V | 5 | |
| Output Offset Voltage | VOS | -10 | 0 | 10 | mV | No Load | 5 |
| Load Regulation | VLOAD | -20 | 20 | mV | IOUT = 0A to 1.75A | 5 | |
| Source Current Limit | ILIMIT | 1.75 | A | Source | 5 | ||
| Sink Current Limit | ILIMIT | -1.75 | A | Sink | 5 | ||
| VREFEN Shutdown Threshold Voltage | VIH | 0.4 | V | Output = High | 5 | ||
| VREFEN Shutdown Threshold Voltage | VIL | 0.15 | V | Output = Low | 5 | ||
| VCNTL Shutdown Threshold Voltage | VCNTL-ON | 2.9 | V | Output = High | 5 | ||
| VCNTL Shutdown Threshold Voltage | VCNTL-OFF | 2.2 | V | Output = Low | 5 | ||
| VIN Shutdown Threshold Voltage | VIN-ON | 1.1 | V | Output = High | 5 | ||
| VIN Shutdown Threshold Voltage | VIN-OFF | 0.4 | V | Output = Low | 5 | ||
| VCNTL Control Input Voltage | VCNTL | 3 | 5.5 | V | Note 6: keep VCNTL ≥ VIN in power on and power off sequences | 4 | |
| VIN Power Input Voltage | VIN | 1.2 | 5.5 | V | 4 | ||
| VREFEN Reference Input Voltage | VREFEN | 0.6 | V | Printed maximum is VCNTL-2.2 V (expression, not a number) | 4 | ||
| Operating Junction Temperature Range | TJ | -40 | 125 | °C | 4 | ||
| Operating Ambient Temperature Range | TA | -40 | 85 | °C | 4 | ||
| VIN Power Input Voltage | VIN | -0.3 | 6 | V | 4 | ||
| VCNTL Control Input Voltage | VCNTL | -0.3 | 6 | V | 4 | ||
| VREFEN Reference Input Voltage | VREFEN | -0.3 | 6 | V | 4 | ||
| Storage Temperature | TSTG | 150 | °C | 4 | |||
| Junction Temperature | TJ | 150 | °C | 4 | |||
| Lead Temperature (Soldering, 10 sec) | TLEAD | 260 | °C | Soldering, 10sec | 4 | ||
| ESD Human Body Model | ESD | 2000 | V | Human Body Model | 4 | ||
| ESD Machine Model | ESD | 200 | V | Machine Model | 4 | ||
| Thermal Resistance (Junction to Ambient), SOIC-8 | θJA | 110 | °C/W | Note 5: 2-layer FR-4 board, 2.54cm*2.54cm thermal sink pad, free air | 4 | ||
| Thermal Resistance (Junction to Case), SOIC-8 | θJC | 50 | °C/W | 4 |
CAD (KiCad official)
- Symbol:
AP2303MTR-G1 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
ap2303mtr-g1-etched.step/ap2303mtr-g1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ap2303mtr-g1.step/ap2303mtr-g1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (16 pp, sha256
e465b64782ac605a, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).