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Contents

README

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SHT41-AD1F-R2

SENSIRION · Global Sourcing Parts · DFN-4(1.5x1.5)

SHT41-AD1F-R2 from SENSIRION, in a DFN-4(1.5x1.5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SDA bidirectional Serial data line of the I2C interface, bidirectional, supporting I2C FM+ per the datasheet features.
2 SCL input Serial clock line of the I2C interface, unidirectional input to the sensor.
3 VDD power_in Supply voltage, operating range 1.08 V to 3.6 V per the datasheet features.
4 VSS power_in Ground reference for the sensor.

Key specifications

Parameter Value
Manufacturer SENSIRION
Package DFN-4(1.5x1.5)
Category Global Sourcing Parts
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD 1.08 3.3 3.6 V 9
Power-up/down level VPOR 0.6 1.08 V Static power supply 9
Slew rate of the supply voltage VDD, slew 20 V/ms Voltage changes on the supply between VDD, min and VDD, max 9
Supply current (heater off), idle state IDD 0.08 1 µA Idle state, At 25 °C 9
Supply current (heater off), idle state IDD 3.4 µA Idle state, At 125 °C 9
Supply current during measurement 320 500 µA Current while sensor is measuring 9
Supply current (heater on), nominal 200 mW IDD 60 100 mA Nomin. heater “200 mW” 9
Supply current (heater on), nominal 110 mW IDD 33 55 mA Nomin. heater “110 mW” 9
Supply current (heater on), nominal 20 mW IDD 6 10 mA Nomin. heater “20 mW” 9
Low level input voltage VIL 0 V 9
Pull up resistor Rp 820 Ω VDD < 1.62 V 9
Pull up resistor Rp 390 Ω VDD ≥ 1.62 V 9
Low level output voltage VOL 0.4 V VDD > 2.0 V, Rpullup > 390 Ω 9
Capacitive bus load Cb 400 pF RP ≤ 820 Ω: fast mode 9
Capacitive bus load Cb 340 pF Rp = 390 Ω, VDD > 1.62 V: fast mode plus 9
Power-up time tPU 0.3 1 ms After hard reset, VDD ≥ VPOR 10
Soft reset time tSR 1 ms After soft reset 10
Measurement duration tMEAS,l 1.3 1.6 ms Low repeatability 10
Measurement duration tMEAS,m 3.7 4.5 ms Med. repeatability 10
Measurement duration tMEAS,h 6.9 8.3 ms High repeatability 10
Heater-on duration tHeater 0.9 1 1.1 s Long pulse 10
Heater-on duration tHeater 0.09 0.1 0.11 s Short pulse 10
Max voltage on any pin -0.3 V Relative to VSS; printed upper limit VDD +0.3 V 10
Operating temperature range -40 125 °C 10
Storage temperature range -40 150 °C 10
ESD HBM 2 kV 10
ESD CDM 500 V 10
Latch up 100 mA JESD78 Class II, 125 °C 10
Recommended normal temperature range 5 60 °C Recommended normal range for best performance 7
Recommended normal humidity range 20 80 %RH Recommended normal range for best performance 7
Specified relative humidity range 0 100 %RH Extended range 4
Specified temperature range -40 125 °C Specified range 6
Maximum heater duty cycle 10 % Heater duty cycle 13
Heater operating ambient temperature 65 °C Heater operated in ambient temperatures below 65 °C 13
Sensor temperature with heater active Tmax 125 °C Base temperature plus heater temperature increase must not exceed Tmax 13
Junction-to-ambient thermal resistance RθJA 297 K/W Heater off, die pad not soldered 16
Junction-to-case thermal resistance RθJC 191 K/W Heater off, die pad not soldered 16
Junction-to-board thermal resistance RθJB 193 K/W Heater off, die pad not soldered 16
Junction-to-board characterization parameter ΨJB 191 K/W Heater off, die pad not soldered 16
Junction-to-top characterization parameter ΨJT 44 K/W Heater off, die pad not soldered 16
Junction-to-ambient thermal resistance RθJA 357 K/W Heater on (200 mW assumed), die pad not soldered 16
Junction-to-case thermal resistance RθJC 257 K/W Heater on (200 mW assumed), die pad not soldered 16
Junction-to-board thermal resistance RθJB 258 K/W Heater on (200 mW assumed), die pad not soldered 16
Junction-to-board characterization parameter ΨJB 254 K/W Heater on (200 mW assumed), die pad not soldered 16
Junction-to-top characterization parameter ΨJT 112 K/W Heater on (200 mW assumed), die pad not soldered 16

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper SHT4x is provided in an open-cavity dual flat no lead (DFN) package. The humidity sensor opening is centered on the top side of the package. The sensor chip is made of silicon, hosted on a copper 14

CAD (KiCad official)

  • Symbol: SHT41-AD1F-R2
  • Footprint: Sensor_Humidity:Sensirion_DFN-4_1.5x1.5mm_P0.8mm_SHT4x_NoCentralPad
  • 3D model: DFN-4(1.5x1.5), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.55 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: sht41-ad1f-r2-etched.step / sht41-ad1f-r2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sht41-ad1f-r2.step / sht41-ad1f-r2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SENSIRION datasheet (22 pp, sha256 6abf277de684fff3, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF