component
HT5320ARMZ
Public Made by Adomby adom
HTCSEMI Digital To Analog Converters (DAC), MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHT5320ARMZ
HTCSEMI · Digital To Analog Converters (DAC) · MSOP-8
HT5320ARMZ from HTCSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Power supply input, +2.7V to 5.5V; must be shorted to VDD2 (pin 2) on the MSOP-8. |
| 2 | VDD2 | power_in | Second power supply pin, +2.7V to 5.5V; the datasheet note says it must be shorted to VDD (pin 1). |
| 3 | NC | unconnected | No internal connection. |
| 4 | VOUT | output | Analog output voltage from the DAC; the output amplifier has rail-to-rail operation (0V to VDD). |
| 5 | SYNC | input | Active-LOW frame synchronization input; LOW enables the input shift register, the DAC updates after the 16th clock unless SYNC goes HIGH first, which interrupts and ignores the write. |
| 6 | SCLK | input | Serial clock input; data can be transferred at rates up to 30MHz. |
| 7 | DIN | input | Serial data input; data is clocked into the 16-bit input shift register on the falling edge of the serial clock. |
| 8 | GND | power_in | Ground reference point for all circuitry on the part. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HTCSEMI |
| Package | MSOP-8 |
| Category | Data Acquisition |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Relative Accuracy | -8 | 8 | LSB | 3 | |||
| Differential Nonlinearity | DNL | -1 | 1 | LSB | Tested Monotonic by Design | 3 | |
| Zero Code Error | 5 | 20 | mV | All Zeroes Loaded to DAC Register | 3 | ||
| Full-Scale Error | -0.15 | -1.25 | % of FSR | All Ones Loaded to DAC Register | 3 | ||
| Gain Error | -1.25 | 1.25 | % of FSR | 3 | |||
| Output Voltage Range | VOUT | 0 | V | Max printed as VDD | 3 | ||
| Output Voltage Settling Time | 8 | 10 | µs | 1/4 Scale to 3/4 Scale Change (400H to C00H); RL = 2k; 0pF < CL < 200pF | 3 | ||
| Output Voltage Settling Time | 12 | µs | 1/4 Scale to 3/4 Scale Change (400H to C00H); RL = 2k; CL = 500pF | 3 | |||
| Input Current | -1 | 1 | µA | 3 | |||
| Input Low Voltage | VINL | 0.8 | V | VDD = +5V | 3 | ||
| Input Low Voltage | VINL | 0.6 | V | VDD = +3V | 3 | ||
| Input High Voltage | VINH | 2.4 | V | VDD = +5V | 3 | ||
| Input High Voltage | VINH | 2.1 | V | VDD = +3V | 3 | ||
| Supply Voltage | VDD | 2.7 | 5.5 | V | 3 | ||
| Normal Mode Supply Current | IDD | 135 | 200 | µA | VDD = +3.6V to +5.5V; VIH = VDD and VIL = GND; DAC active, excluding load current | 3 | |
| Normal Mode Supply Current | IDD | 115 | 160 | µA | VDD = +2.7V to +3.6V; VIH = VDD and VIL = GND; DAC active, excluding load current | 3 | |
| Power-Down Supply Current (all power-down modes) | IDD | 0.2 | 1 | µA | VDD = +3.6V to +5.5V; VIH = VDD and VIL = GND | 3 | |
| Power-Down Supply Current (all power-down modes) | IDD | 0.05 | 1 | µA | VDD = +2.7V to +3.6V; VIH = VDD and VIL = GND | 3 | |
| Specified Performance Temperature Range | -40 | 105 | °C | 3 | |||
| VDD to GND | VDD | -0.3 | 6 | V | 2 | ||
| Digital Input Voltage to GND | -0.3 | V | Max printed as +VDD + 0.3V | 2 | |||
| VOUT to GND | VOUT | -0.3 | V | Max printed as +VDD + 0.3V | 2 | ||
| Operating Temperature Range | -40 | 105 | °C | 2 | |||
| Storage Temperature Range | -65 | 150 | °C | 2 | |||
| Junction Temperature Range (TJ max) | TJ | 150 | °C | 2 | |||
| Lead Temperature, Soldering Vapor Phase | 215 | °C | Vapor phase, 60s | 2 | |||
| Lead Temperature, Soldering Infrared | 220 | °C | Infrared, 15s | 2 | |||
| JA Thermal Impedance (MSOP) | θJA | 206 | °C/W | MSOP package | 2 | ||
| JC Thermal Impedance (MSOP) | θJC | 44 | °C/W | MSOP package | 2 |
CAD (KiCad official)
- Symbol:
HT5320ARMZ - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
ht5320armz-etched.step/ht5320armz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ht5320armz.step/ht5320armz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HTCSEMI datasheet (15 pp, sha256
26450e87d6873ec2, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).