component
1808CG100J302NT
Public Made by Adomby adom
FH Guangdong Fenghua Advanced Tech Multilayer Ceramic Capacitors MLCC - SMD/SMT, 1808. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdown1808CG100J302NT
FH Guangdong Fenghua Advanced Tech · Multilayer Ceramic Capacitors MLCC - SMD/SMT · 1808
1808CG100J302NT from FH Guangdong Fenghua Advanced Tech, in a 1808. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised capacitor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised capacitor; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | FH Guangdong Fenghua Advanced Tech |
| Package | 1808 |
| Category | Capacitors |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Capacitance tolerance (code J, ±5%) | -5 | 5 | % | Tolerance code J per part-numbering table | 4 | ||
| Temperature coefficient (C0G) | -30 | 0 | 30 | ppm/℃ | Reference temperature 25°C; C0G nominal 0±30ppm/℃ | 5 | |
| Insulation resistance (Class I, C≤10 nF) | Ri | 50000 | MΩ | C≤10 nF; test voltage rated voltage (max 500V), 60±5 s, 25℃±3℃ | 16 | ||
| Operating temperature range (C0G) | -55 | 125 | ℃ | C0G operating temperature range | 5 | ||
| Hand soldering iron tip temperature | 350 | ℃ | Hand soldering; iron power max 20W; tip diameter 1mm recommended | 29 | |||
| Hand soldering time | 3 | s | Hand soldering, 3s at the longest | 29 | |||
| Preheat temperature difference (reflow/wave) | 150 | ℃ | Preheating: difference between soldering temperature and chip surface temperature T≤150℃ | 28 | |||
| Storage temperature | 5 | 40 | ℃ | Storage; recommended temperature below 30℃ | 25 | ||
| Storage relative humidity | 20 | 70 | % | Storage | 25 |
CAD (KiCad official)
- Symbol:
1808CG100J302NT - Footprint:
Capacitor_SMD:C_1808_4520Metric - 3D model: 1808 (KiCad packages3D, STEP)
- 3D model files:
1808cg100j302nt-etched.step/1808cg100j302nt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);1808cg100j302nt.step/1808cg100j302nt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: FH Guangdong Fenghua Advanced Tech datasheet (30 pp, sha256
705023d3be045414, retrieved 2026-10-14, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).