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Contents

README

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MMBZ18VALT1G

onsemi · ESD And Surge Protection (TVS/ESD) · SOT-23

MMBZ18VALT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE 1 passive Cathode of the first Zener junction; with pin 3 (anode) it forms one unidirectional TVS, with a working peak reverse voltage of 14.5 V and a breakdown voltage of 17.10 V to 18.90 V for the MMBZ18VALT1G.
2 CATHODE 2 passive Cathode of the second Zener junction; with pin 3 (anode) it forms the second unidirectional TVS, with the same MMBZ18VALT1G ratings as pin 1.
3 ANODE passive Common anode shared by both Zener junctions, so the package protects two separate lines in one SOT-23 package.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Circuit Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage VBR 17.1 18 18.9 V @ IT = 1.0 mA, TA = 25°C (Note 4); 40 W 5% table 3
Breakdown voltage tolerance (printed 5% tolerance) VBR -5 5 % 40 W, 5% tolerance table 3
Maximum Reverse Leakage Current IR 50 nA @ VRWM = 14.5 V 3
Clamping Voltage VC 25 V @ IPP = 1.6 A (surge per Figure 6, Note 6) 3
Maximum Reverse Peak Pulse Current IPP 1.6 A 3
Working Peak Reverse Voltage VRWM 14.5 V 3
Maximum Temperature Coefficient of VBR 15.3 mV/°C @ IT = 1.0 mA 3
Forward Voltage VF 0.9 V @ IF = 10 mA 3
Peak Power Dissipation Ppk 40 W @ 1.0 ms, TL ≤ 25°C, non-repetitive (Note 1); MMBZ12V thru MMBZ47V group 2
Total Power Dissipation on FR-5 Board PD 225 mW @ TA = 25°C (Note 2) 2
Total Power Dissipation on Alumina Substrate PD 300 mW @ TA = 25°C (Note 3) 2
Thermal Resistance Junction-to-Ambient (FR-5 board) RθJA 556 °C/W FR-5 board (Note 2) 2
Thermal Resistance Junction-to-Ambient (alumina substrate) RθJA 417 °C/W Alumina substrate (Note 3) 2
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 2
Lead Solder Temperature (maximum) TL 260 °C 10 second duration 2

CAD (KiCad official)

  • Symbol: MMBZ18VALT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: mmbz18valt1g-etched.step / mmbz18valt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mmbz18valt1g.step / mmbz18valt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 a000c92c23393615, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF