component
SMBJP6KE16A-TP
Public Made by Adomby adom
MCC(Micro Commercial Components) TVS, SMB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSMBJP6KE16A-TP
MCC(Micro Commercial Components) · TVS · SMB
SMBJP6KE16A-TP from MCC(Micro Commercial Components), in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal marked by the color band (positive end) on unidirectional types; SMBJP6KE16A is unidirectional with 13.60V min reverse stand-off voltage and 22.5V max clamping at 27.1A IPP. |
| 2 | Anode | passive | Anode terminal of the unidirectional TVS, with forward voltage of 1.5V max at 1A and 600W peak pulse power dissipation rating. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SMB |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VWM | 13.6 | V | SMBJP6KE16A | 2 | ||
| Breakdown Voltage | V(BR) | 15.2 | 16.8 | V | @IT = 1 mA | 2 | |
| Maximum Clamping Voltage | VC | 22.5 | V | @IPP | 2 | ||
| Peak Pulse Current | IPP | 27.1 | A | 10/1000μs waveform | 2 | ||
| Maximum Reverse Leakage | ID | 1 | μA | @ VWM | 2 | ||
| Maximum Instantaneous Forward Voltage | VF | 1.5 | V | at 1A, unidirectional only | 1 | ||
| Peak Pulse Power Dissipation | PPP | 600 | W | Non-repetitive current pulse, per Fig.3, derated above TA=25°C per Fig.4 | 1 | ||
| Operating Junction Temperature Range | TJ | -65 | 150 | °C | 1 | ||
| Storage Temperature Range | TSTG | -65 | 150 | °C | 1 | ||
| Maximum Soldering Temperature | 260 | °C | 10 Seconds | 1 | |||
| Thermal Resistance Junction to Lead | RθJL | 20 | °C/W | Junction to Lead | 1 | ||
| Thermal Resistance Junction to Case | RθJC | 25 | °C/W | Junction to Case | 1 |
CAD (KiCad official)
- Symbol:
SMBJP6KE16A-TP - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
smbjp6ke16a-tp-etched.step/smbjp6ke16a-tp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smbjp6ke16a-tp.step/smbjp6ke16a-tp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MCC(Micro Commercial Components) datasheet (5 pp, sha256
5588e94db609218f, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).