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MCP3008-I
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Microchip Tech Analog To Digital Converters (ADC), SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMCP3008-I
Microchip Tech · Analog To Digital Converters (ADC) · SOIC-16
MCP3008-I from Microchip Tech, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CH0 | input | Analog input channel 0; can be programmed as a single-ended input or as the IN+ or IN- channel of a pseudo-differential pair. |
| 2 | CH1 | input | Analog input channel 1; can be programmed as a single-ended input or as the IN+ or IN- channel of a pseudo-differential pair. |
| 3 | CH2 | input | Analog input channel 2; can be programmed as a single-ended input or as the IN+ or IN- channel of a pseudo-differential pair. |
| 4 | CH3 | input | Analog input channel 3; can be programmed as a single-ended input or as the IN+ or IN- channel of a pseudo-differential pair. |
| 5 | CH4 | input | Analog input channel 4, available on the MCP3008 only; can be programmed as a single-ended input or as part of a pseudo-differential pair. |
| 6 | CH5 | input | Analog input channel 5, available on the MCP3008 only; can be programmed as a single-ended input or as part of a pseudo-differential pair. |
| 7 | CH6 | input | Analog input channel 6, available on the MCP3008 only; can be programmed as a single-ended input or as part of a pseudo-differential pair. |
| 8 | CH7 | input | Analog input channel 7, available on the MCP3008 only; can be programmed as a single-ended input or as part of a pseudo-differential pair. |
| 9 | DGND | power_in | Digital ground connection to the internal digital circuitry. |
| 10 | CS/SHDN | input | Chip Select/Shutdown: pulled low to initiate communication; must be pulled high between conversions, which ends a conversion and puts the device in low-power standby. |
| 11 | DIN | input | SPI serial data input used to load channel configuration data into the device. |
| 12 | DOUT | output | SPI serial data output used to shift out the A/D conversion results; data changes on the falling edge of each clock. |
| 13 | CLK | input | SPI serial clock used to initiate a conversion and to clock out each bit of the conversion; clock speed constraints apply per Section 6.2. |
| 14 | AGND | power_in | Analog ground connection to the internal analog circuitry. |
| 15 | VREF | power_in | Reference voltage input for the A/D converter. |
| 16 | VDD | power_in | Power supply, +2.7V to 5.5V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | SOIC-16 |
| Category | Data Acquisition |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Conversion Time | tCONV | 10 | clock cycles | 3 | |||
| Throughput Rate | fSAMPLE | 200 | ksps | VDD = VREF = 5V | 3 | ||
| Throughput Rate | fSAMPLE | 75 | ksps | VDD = VREF = 2.7V | 3 | ||
| Integral Nonlinearity | INL | -1 | 0.5 | 1 | LSB | 3 | |
| Differential Nonlinearity | DNL | -1 | 0.25 | 1 | LSB | No missing codes over temperature | 3 |
| Offset Error | -1.5 | 1.5 | LSB | 3 | |||
| Gain Error | -1 | 1 | LSB | 3 | |||
| Reference Input Voltage Range | VREF | 0.25 | V | Note 2 | 3 | ||
| Current Drain (reference) | 100 | 150 | µA | CS = VDD = 5V | 3 | ||
| Current Drain (reference, standby) | 0.001 | 3 | µA | CS = VDD = 5V | 3 | ||
| Leakage Current | -1 | 0.001 | 1 | µA | 4 | ||
| High Level Output Voltage | VOH | 4.1 | V | IOH = -1 mA, VDD = 4.5V | 4 | ||
| Low Level Output Voltage | VOL | 0.4 | V | IOL = 1 mA, VDD = 4.5V | 4 | ||
| Input Leakage Current | ILI | -10 | 10 | µA | VIN = VSS or VDD | 4 | |
| Output Leakage Current | ILO | -10 | 10 | µA | VOUT = VSS or VDD | 4 | |
| Pin Capacitance (All Inputs/Outputs) | CIN, COUT | 10 | pF | VDD = 5.0V (Note 1), TA = 25°C, f = 1 MHz | 4 | ||
| Clock Frequency | fCLK | 3.6 | MHz | VDD = 5V (Note 3) | 4 | ||
| Clock Frequency | fCLK | 1.35 | MHz | VDD = 2.7V (Note 3) | 4 | ||
| Clock High Time | tHI | 125 | ns | 4 | |||
| Clock Low Time | tLO | 125 | ns | 4 | |||
| CS Fall To First Rising CLK Edge | tSUCS | 100 | ns | 4 | |||
| CS Fall To Falling CLK Edge | tCSD | 0 | ns | 4 | |||
| Data Input Setup Time | tSU | 50 | ns | 4 | |||
| Data Input Hold Time | tHD | 50 | ns | 4 | |||
| CLK Fall To Output Data Valid | tDO | 125 | ns | VDD = 5V, See Figure 1-2 | 4 | ||
| CLK Fall To Output Data Valid | tDO | 200 | ns | VDD = 2.7V, See Figure 1-2 | 4 | ||
| CLK Fall To Output Enable | tEN | 125 | ns | VDD = 5V, See Figure 1-2 | 4 | ||
| CLK Fall To Output Enable | tEN | 200 | ns | VDD = 2.7V, See Figure 1-2 | 4 | ||
| CS Rise To Output Disable | tDIS | 100 | ns | See Test Circuits, Figure 1-2 | 4 | ||
| CS Disable Time | tCSH | 270 | ns | 4 | |||
| DOUT Rise Time | tR | 100 | ns | See Test Circuits, Figure 1-2 (Note 1) | 4 | ||
| DOUT Fall Time | tF | 100 | ns | See Test Circuits, Figure 1-2 (Note 1) | 4 | ||
| Operating Voltage | VDD | 2.7 | 5.5 | V | 5 | ||
| Operating Current | IDD | 425 | 550 | µA | VDD = VREF = 5V, DOUT unloaded | 5 | |
| Standby Current | IDDS | 0.005 | 2 | µA | CS = VDD = 5.0V | 5 | |
| Specified Temperature Range | TA | -40 | 85 | °C | 5 | ||
| Operating Temperature Range | TA | -40 | 85 | °C | 5 | ||
| Storage Temperature Range | TA | -65 | 150 | °C | 5 | ||
| Thermal Resistance, 16L-SOIC | θJA | 90 | °C/W | 5 | |||
| All Inputs and Outputs w.r.t. VSS | -0.6 | V | 3 | ||||
| Storage Temperature | -65 | 150 | °C | 3 | |||
| Ambient Temperature with Power Applied | -65 | 150 | °C | 3 | |||
| Soldering Temperature of Leads | 300 | °C | 10 seconds | 3 | |||
| ESD Protection On All Pins (HBM) | 4 | kV | HBM, all pins | 3 |
CAD (KiCad official)
- Symbol:
MCP3008-I - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
mcp3008-i-etched.step/mcp3008-i-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);mcp3008-i.step/mcp3008-i.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (40 pp, sha256
e6c2231de727395f, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).