component
BAW56HDW-13
Public Made by Adomby adom
Diodes Incorporated Switching Diodes, SOT-363. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownBAW56HDW-13
Diodes Incorporated · Switching Diodes · SOT-363
BAW56HDW-13 from Diodes Incorporated, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | C1 | passive | Cathode of the first BAW56 diode circuit (bottom-left in top view); 100 V VRRM, 250 mA continuous forward current. |
| 2 | C1 | passive | Second cathode pin of the first BAW56 circuit (bottom-middle in top view), same C1 node as pin 1 in the internal schematic. |
| 3 | A2 | passive | Anode of the second BAW56 diode circuit (bottom-right in top view); 100 V VRRM, 250 mA continuous forward current. |
| 4 | C2 | passive | Cathode of the second BAW56 diode circuit (top-right in top view). |
| 5 | C2 | passive | Second cathode pin of the second BAW56 circuit (top-middle in top view), same C2 node as pin 4 in the internal schematic. |
| 6 | A1 | passive | Anode of the first BAW56 diode circuit (top-left in top view); 100 V VRRM, 250 mA continuous forward current. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOT-363 |
| Category | Diodes |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | V(BR)R | 100 | V | IR = 2.5µA | 2 | ||
| Forward Voltage | VF | 0.715 | V | IF = 1.0mA | 2 | ||
| Forward Voltage | VF | 0.855 | V | IF = 10mA | 2 | ||
| Forward Voltage | VF | 1 | V | IF = 50mA | 2 | ||
| Forward Voltage | VF | 1.25 | V | IF = 150mA | 2 | ||
| Reverse Current | IR | 0.5 | µA | VR = 80V | 2 | ||
| Reverse Current | IR | 50 | µA | VR = 80V, TJ = +150°C | 2 | ||
| Reverse Current | IR | 30 | µA | VR = 25V, TJ = +150°C | 2 | ||
| Reverse Current | IR | 30 | nA | VR = 25V | 2 | ||
| Total Capacitance | CT | 1.5 | pF | VR = 0, f = 1.0MHz | 2 | ||
| Reverse Recovery Time | tRR | 4 | ns | IF = IR = 10mA, IRR = 0.1 x IR, RL = 100Ω | 2 | ||
| Forward Recovery Voltage | VFR | 1.75 | V | IF = 10mA, tR = 20ns | 2 | ||
| Peak Repetitive Reverse Voltage | VRRM | 100 | V | TA = +25°C | 2 | ||
| Working Peak Reverse Voltage | VRWM | 100 | V | TA = +25°C | 2 | ||
| DC Blocking Voltage | VR | 100 | V | TA = +25°C | 2 | ||
| RMS Reverse Voltage | VR(RMS) | 71 | V | TA = +25°C | 2 | ||
| Forward Continuous Current | IFM | 250 | mA | TA = +25°C, Note 5 | 2 | ||
| Repetitive Peak Forward Current | IFRM | 500 | mA | TA = +25°C | 2 | ||
| Non-Repetitive Peak Forward Surge Current | IFSM | 4 | A | t = 1.0µs, TA = +25°C | 2 | ||
| Non-Repetitive Peak Forward Surge Current | IFSM | 1 | A | t = 1.0ms, TA = +25°C | 2 | ||
| Non-Repetitive Peak Forward Surge Current | IFSM | 0.5 | A | t = 1.0s, TA = +25°C | 2 | ||
| Power Dissipation | PD | 350 | mW | Note 5 (FR-4 PC board, recommended pad layout) | 2 | ||
| Thermal Resistance Junction to Ambient Air | RθJA | 357 | °C/W | Note 5 (FR-4 PC board, recommended pad layout) | 2 | ||
| Thermal Resistance Junction to Solder Point | RθJSP | 255 | °C/W | 2 | |||
| Operating and Storage Temperature Range | TJ, TSTG | -65 | 150 | °C | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead-Free Plating). Solderable per MIL-STD-202, Method 208 | 1 |
CAD (KiCad official)
- Symbol:
BAW56HDW-13 - Footprint:
Package_TO_SOT_SMD:SOT-363_SC-70-6 - 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files:
baw56hdw-13-etched.step/baw56hdw-13-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);baw56hdw-13.step/baw56hdw-13.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (5 pp, sha256
a4f26ee5f0a2eaf7, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).