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Contents

README

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BZT52-B2V4-QX

Nexperia · Zener Diodes · SOD-123

BZT52-B2V4-QX from Nexperia, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode; the marking bar on the package indicates the cathode.
2 A passive Anode of the two-lead SOD123 Zener diode.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (type B, min) VZ 2.35 V IZ = 5 mA; Tj = 25 °C unless otherwise specified 4
Working voltage (type B, max) VZ 2.45 V IZ = 5 mA; Tj = 25 °C unless otherwise specified 4
Maximum differential resistance rdif 400 Ω IZ = 1 mA; Tj = 25 °C unless otherwise specified 4
Maximum differential resistance rdif 85 Ω IZ = 5 mA; Tj = 25 °C unless otherwise specified 4
Reverse current IR 50 μA VR = 1 V; Tj = 25 °C unless otherwise specified 4
Temperature coefficient (min) SZ -3.5 mV/K IZ = 5 mA; Tj = 25 °C unless otherwise specified 4
Temperature coefficient (max) SZ 0 mV/K IZ = 5 mA; Tj = 25 °C unless otherwise specified 4
Diode capacitance Cd 450 pF f = 1 MHz; VR = 0 V 4
Non-repetitive peak reverse current IZSM 6 A tp = 100 μs; Tamb = 25 °C 4
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 μs; δ ≤ 0.02 4
Forward current IF 250 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 μs; square wave; Tj = 25 °C prior to surge 3
Total power dissipation (standard footprint) Ptot 350 mW Tamb ≤ 25 °C; FR4 PCB, standard footprint 3
Total power dissipation (mounting pad for cathode 1 cm²) Ptot 590 mW FR4 PCB, mounting pad for cathode 1 cm² 3
Junction temperature Tj 150 °C 3
Ambient temperature (min) Tamb -55 °C 3
Ambient temperature (max) Tamb 150 °C 3
Storage temperature (min) Tstg -65 °C 3
Storage temperature (max) Tstg 150 °C 3
Thermal resistance junction to ambient (free air) Rth(j-a) 350 K/W In free air; FR4 PCB, standard footprint 3
Thermal resistance junction to ambient (mounting pad for cathode 1 cm²) Rth(j-a) 210 K/W FR4 PCB, mounting pad for cathode 1 cm² 3
Thermal resistance junction to solder point Rth(j-sp) 55 K/W Soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: BZT52-B2V4-QX
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: bzt52-b2v4-qx-etched.step / bzt52-b2v4-qx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzt52-b2v4-qx.step / bzt52-b2v4-qx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (12 pp, sha256 3b4b96d8d0378fe9, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF