SI8642EC-B-IS1 from SILICON LABS, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VDD1	power_in	Side 1 power supply, operating range 2.5-5.5 V, requiring a 0.1 µF bypass capacitor to GND1.
2	GND1	power_in	Side 1 ground; on narrow-body devices pin 2 must be externally connected to ground.
3	A1	input	Side 1 digital input.
4	A2	input	Side 1 digital input.
5	A3	bidirectional	Side 1 digital input or output (direction depends on the Si864x variant).
6	A4	bidirectional	Side 1 digital input or output (direction depends on the Si864x variant).
7	EN1	input	Side 1 active-high enable (EN1/NC pin; it is an NC only on Si8640/45); can be tied high or left floating to enable.
8	GND1	power_in	Side 1 ground; on narrow-body devices pin 8 must be externally connected to ground.
9	GND2	power_in	Side 2 ground; on narrow-body devices pin 9 must be externally connected to ground.
10	EN2	input	Side 2 active-high enable (EN2/NC pin; it is an NC only on Si8645); output goes Hi-Z when low.
11	B4	bidirectional	Side 2 digital input or output (direction depends on the Si864x variant).
12	B3	bidirectional	Side 2 digital input or output (direction depends on the Si864x variant).
13	B2	output	Side 2 digital output.
14	B1	output	Side 2 digital output.
15	GND2	power_in	Side 2 ground; on narrow-body devices pin 15 must be externally connected to ground.
16	VDD2	power_in	Side 2 power supply, operating range 2.5-5.5 V, requiring a 0.1 µF bypass capacitor to GND2.

Key specifications

Parameter	Value
Manufacturer	SILICON LABS
Package	SOIC-16
Category	Interface ICs
Pins	16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Junction Operating Temperature	TJ			150	°C		12
Ambient Operating Temperature	TA	-40	25	125	°C		12
Supply Voltage VDD1	VDD1	2.375		5.5	V		12
Supply Voltage VDD2	VDD2	2.375		5.5	V		12
Storage Temperature	TSTG	-65		150	°C		27
Operating Temperature	TA	-40		125	°C		27
Junction Temperature	TJ			150	°C		27
Supply Voltage	VDD1, VDD2	-0.5		7	V		27
Input Voltage	VI	-0.5			V	max printed as VDD + 0.5	27
Output Voltage	VO	-0.5			V	max printed as VDD + 0.5	27
Output Current Drive Channel	IO			10	mA		27
Lead Solder Temperature (10 s)				260	°C	10 s	27
Maximum Isolation (Input to Output) WB SOIC-16				6500	VRMS	1 sec, WB SOIC-16	27
IC Junction-to-Air Thermal Resistance	θJA		100		°C/W	WB SOIC-16	26
VDD Undervoltage Threshold rising	VDDUV+	1.95	2.24	2.375	V	VDD1, VDD2 rising	12
VDD Undervoltage Threshold falling	VDDUV-	1.88	2.16	2.325	V	VDD1, VDD2 falling	12
VDD Undervoltage Hysteresis	VDDHYS	50	70	95	mV		12
Positive-Going Input Threshold	VT+	1.4	1.67	1.9	V	All inputs rising	12
Negative-Going Input Threshold	VT-	1	1.23	1.4	V	All inputs falling	12
Input Hysteresis	VHYS	0.38	0.44	0.5	V		12
High Level Input Voltage	VIH	2			V		12
Low Level Input Voltage	VIL			0.8	V		12
High Level Output Voltage	VOH		4.8		V	loh = -4 mA; min printed as VDD1, VDD2, 0.4	12
Low Level Output Voltage	VOL		0.2	0.4	V	lol = 4 mA	12
Input Leakage Current Si864xxA/B/C/D	IL	-10		10	µA		12
DC Supply Current VDD1 (VI = 1 Ex)	IDD1		1.8	2.9	mA	Si8642Ex, DC, VI = 1(Ex)	13
DC Supply Current VDD2 (VI = 1 Ex)	IDD2		1.8	2.9	mA	Si8642Ex, DC, VI = 1(Ex)	13
DC Supply Current VDD1 (VI = 0 Ex)	IDD1		4.4	6.6	mA	Si8642Ex, DC, VI = 0(Ex)	13
DC Supply Current VDD2 (VI = 0 Ex)	IDD2		4.4	6.6	mA	Si8642Ex, DC, VI = 0(Ex)	13
1 Mbps Supply Current VDD1/VDD2	IDD		3.3	4.6	mA	Si8642Ex, 500 kHz square wave, CI = 15 pF	13
10 Mbps Supply Current VDD1/VDD2	IDD		3.9	5.4	mA	Si8642Ex, 5 MHz square wave, CI = 15 pF	13
100 Mbps Supply Current VDD1/VDD2	IDD		11	14.3	mA	Si8642Ex, 50 MHz square wave, CI = 15 pF	14
Maximum Data Rate		0		150	Mbps	Si864xBx, Ex	14
Minimum Pulse Width				5	ns	Si864xBx, Ex	14
Propagation Delay	tPHL, tPLH	5	8	13	ns	See Figure 4.2	14
Pulse Width Distortion /tPLH, tPHL/	PWD		0.2	4.5	ns	See Figure 4.2	14
Propagation Delay Skew	tPSK(P-P)		2	4.5	ns		14
Channel-Channel Skew	tPSK		0.4	2.5	ns		14
Output Rise Time	tr		2.5	4	ns	CL = 15 pF	14
Output Fall Time	tf		2.5	4	ns	CL = 15 pF	14
Common Mode Transient Immunity Si86xxxA/B/C/D	CMTI	35	50		kV/µs	VI = VDD or 0 V, VCM = 1500 V	14
Enable to Data Valid	ten1		6	11	ns	See Figure 4.1	14
Enable to Data Tri-State	ten2		8	12	ns	See Figure 4.1	14
Input power loss to valid default output	tSD		8	12	ns	See Figure 3.1	15
Start-up Time	tSU		15	40	µs		15
Propagation Delay (2.5 V ±5% supply)	tPHL, tPLH	5	8	14	ns	VDD1 = VDD2 = 2.5 V ±5%; See Figure 4.2	22
Capacitance (Input-Output)	CIO		2		pF	f = 1 MHz	24
Input Capacitance	CI		4		pF		24
Maximum Working Insulation Voltage WB SOIC-16	VIORM		1200		Vpeak	WB SOIC-16	25
Transient Overvoltage WB SOIC-16	VIOTM		6000		Vpeak	t = 60 sec	25
Output Impedance	ZO		50		Ω		12
Enable Input Current Si864xxA/B/C/D	IENH, IENL		2		µA	VENx = VIH or VIL	12

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	abs		Package Outline (16-Pin Wide Body SOIC) silabs.com / Building a more connected world. Rev. 2.15 / 29	29

CAD (KiCad official)

Symbol: SI8642EC-B-IS1
Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
3D model: SOIC-16 (KiCad packages3D, STEP)
3D model files: si8642ec-b-is1-etched.step / si8642ec-b-is1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); si8642ec-b-is1.step / si8642ec-b-is1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: SILICON LABS datasheet (44 pp, sha256 2425141c8d33cf85, retrieved 2026-10-30, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

SI8642EC-B-IS1

Verified SI8642EC-B-IS1

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README