component
BD9C301FJ-E2
Public Made by Adomby adom
ROHM Semicon DC-DC Converters, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownBD9C301FJ-E2
ROHM Semicon · DC-DC Converters · SOIC-8
BD9C301FJ-E2 from ROHM Semicon, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PGND | power_in | Ground pins for the output stage of the switching regulator. |
| 2 | VIN | power_in | This pin supplies power to the control circuit and the output stage of the switching regulator; connecting a 10 µF and a 0.1 µF ceramic capacitor is recommended. |
| 3 | AGND | power_in | Ground pin for the control circuit. |
| 4 | FB | input | An inverting input node for the gm error amplifier; the output voltage setting resistance is calculated per page 14. |
| 5 | COMP | bidirectional | An input pin for the switch current comparator and an output pin for the gm error amplifier, where a frequency phase compensation component is connected. |
| 6 | EN | input | Pulling this pin low (0.8 V or lower) forces shutdown mode, and pulling it high (2.0 V or higher) enables the device; this pin must be terminated. |
| 7 | SW | output | Switch nodes connected to the drain of the Pch MOSFET and the drain of the Nch MOSFET. |
| 8 | SW | output | Switch node connected to the drain of the Pch MOSFET and the drain of the Nch MOSFET. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | SOIC-8 |
| Category | Power Management ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Circuit Current in Active | IQ_active | 1.5 | 2.5 | mA | VFB= 0.75V, VEN= 5V | 4 | |
| Circuit Current in Standby | IQ_stby | 1 | 10 | μA | VEN = 0V | 4 | |
| FB Pin Voltage | VFB | 0.792 | 0.8 | 0.808 | V | FB-COMP Short (Voltage follower) | 4 |
| FB Input Current | IFB | 0 | 2 | μA | 4 | ||
| Switching Frequency | fOSC | 450 | 500 | 550 | kHz | 4 | |
| High Side FET On Resistance | RONH | 65 | mΩ | VIN= 12V , ISW = -1A | 4 | ||
| Low Side FET On Resistance | RONL | 35 | mΩ | VIN= 12V , ISW = -1A | 4 | ||
| Power MOS Leakage Current | ILSW | 0 | 5 | μA | VIN= 18V , VSW = 18V | 4 | |
| Current Limit | ILIMIT | 3.5 | A | 4 | |||
| Minimum Duty Ratio | Min_duty | 12.5 | % | 4 | |||
| UVLO Threshold | VUVLO | 3.75 | 4 | 4.25 | V | VIN Sweep up | 4 |
| UVLO Hysteresis Voltage | VUVLOHYS | 0.2 | V | 4 | |||
| EN High-Level Input Voltage | VENH | 2 | V | 4 | |||
| EN Low-Level Input Voltage | VENL | 0.8 | V | 4 | |||
| Soft Start Time | TSS | 0.5 | 1 | 2 | msec | 4 | |
| Supply Voltage | VIN | 4.5 | 18 | V | Ta= -40°C to +85°C | 3 | |
| Output Current | IOUT | 3 | A | Ta= -40°C to +85°C | 3 | ||
| Supply Voltage | VIN | 20 | V | Ta = 25C | 3 | ||
| SW Pin Voltage | VSW | 20 | V | Ta = 25C | 3 | ||
| EN Pin Voltage | VEN | 20 | V | Ta = 25C | 3 | ||
| Power Dissipation | Pd | 0.68 | W | When mounted on a 70 mm x 70 mm x 1.6 mm 1-layer glass epoxy board | 3 | ||
| Operating Temperature Range | Topr | -40 | 85 | °C | 3 | ||
| Storage Temperature Range | Tstg | -55 | 150 | °C | 3 | ||
| Maximum Junction Temperature | Tjmax | 150 | °C | 3 | |||
| FB, COMP Pin Voltage | VLVPINS | 7 | V | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | Connect an input capacitor as close as possible to the IC VIN pin on the same plane as the IC. If there is any unused area on the PCB, provide a copper foil plane for the GND node to assist heat d | 12 |
CAD (KiCad official)
- Symbol:
BD9C301FJ-E2 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
bd9c301fj-e2-etched.step/bd9c301fj-e2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bd9c301fj-e2.step/bd9c301fj-e2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (24 pp, sha256
6c2119cb65abec2a, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).