component
TPS54610PWPR
Public Made by Adomby adom
Texas Instruments DC-DC Converters, HTSSOP-28. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS54610PWPR
Texas Instruments · DC-DC Converters · HTSSOP-28
TPS54610PWPR from Texas Instruments, in a HTSSOP-28. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AGND | power_in | Analog ground, return for compensation network/output divider, slow-start capacitor, VBIAS capacitor, RT resistor, and SYNC pin; connect PowerPAD™ to AGND. |
| 2 | VSENSE | input | Error amplifier inverting input, connect to output voltage through compensation network/output divider. |
| 3 | COMP | output | Error amplifier output, connect frequency compensation network from COMP to VSENSE. |
| 4 | PWRGD | output | Power good open-drain output, high when VSENSE ≥ 90% Vref, otherwise low. |
| 5 | BOOT | power_out | Bootstrap output, 0.022-μF to 0.1-μF low-ESR capacitor connected from BOOT to PH generates floating drive for high-side FET driver. |
| 6 | PH | output | Phase output, junction of internal high-side and low-side power MOSFETs and output inductor. |
| 7 | PH | output | Phase output, junction of internal high-side and low-side power MOSFETs and output inductor. |
| 8 | PH | output | Phase output, junction of internal high-side and low-side power MOSFETs and output inductor. |
| 9 | PH | output | Phase output, junction of internal high-side and low-side power MOSFETs and output inductor. |
| 10 | PH | output | Phase output, junction of internal high-side and low-side power MOSFETs and output inductor. |
| 11 | PH | output | Phase output, junction of internal high-side and low-side power MOSFETs and output inductor. |
| 12 | PH | output | Phase output, junction of internal high-side and low-side power MOSFETs and output inductor. |
| 13 | PH | output | Phase output, junction of internal high-side and low-side power MOSFETs and output inductor. |
| 14 | PH | output | Phase output, junction of internal high-side and low-side power MOSFETs and output inductor. |
| 15 | PGND | power_in | Power ground, high current return for low-side driver and power MOSFET. |
| 16 | PGND | power_in | Power ground, high current return for low-side driver and power MOSFET. |
| 17 | PGND | power_in | Power ground, high current return for low-side driver and power MOSFET. |
| 18 | PGND | power_in | Power ground, high current return for low-side driver and power MOSFET. |
| 19 | PGND | power_in | Power ground, high current return for low-side driver and power MOSFET. |
| 20 | VIN | power_in | Input supply for power MOSFET switches and internal bias regulator, bypass with 10-μF low-ESR ceramic capacitor. |
| 21 | VIN | power_in | Input supply for power MOSFET switches and internal bias regulator, bypass with 10-μF low-ESR ceramic capacitor. |
| 22 | VIN | power_in | Input supply for power MOSFET switches and internal bias regulator, bypass with 10-μF low-ESR ceramic capacitor. |
| 23 | VIN | power_in | Input supply for power MOSFET switches and internal bias regulator, bypass with 10-μF low-ESR ceramic capacitor. |
| 24 | VIN | power_in | Input supply for power MOSFET switches and internal bias regulator, bypass with 10-μF low-ESR ceramic capacitor. |
| 25 | VBIAS | power_out | Internal bias regulator output, bypass with 0.1-μF to 1.0-μF low-ESR ceramic capacitor to AGND. |
| 26 | SS/ENA | bidirectional | Slow-start/enable input/output, provides logic input to enable/disable device operation or capacitor input to externally set start-up time. |
| 27 | SYNC | bidirectional | Synchronization input/output, provides logic input to synchronize to external oscillator or pin select between internally set switching frequencies. |
| 28 | RT | input | Frequency setting resistor input, connect resistor from RT to AGND to set switching frequency. |
| 29 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HTSSOP-28 |
| Category | Power Management (PMIC) |
| Pins | 29 |
CAD (KiCad official)
- Symbol:
TPS54610PWPR - Footprint:
Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm - 3D model: HTSSOP-28 (KiCad packages3D, STEP)
- 3D model files:
tps54610pwpr-etched.step/tps54610pwpr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps54610pwpr.step/tps54610pwpr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (31 pp, sha256
f39922fcd3a04cff, retrieved 2026-09-27, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).