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Contents

README

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MBR3060CTP

SMC(Sangdest Microelectronicstronic (Nanjing)) · Schottky Barrier Diodes (SBD) · TO-220AB-3

MBR3060CTP from SMC(Sangdest Microelectronicstronic (Nanjing)), in a TO-220AB-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first Schottky diode leg, rated 15 A average per leg and 60 V VRRM.
2 K passive Common cathode of the center-tap pair, also the base/tab connection; both legs share 60 V reverse rating and 30 A per device.
3 A2 passive Anode of the second Schottky diode leg, rated 15 A average per leg and 60 V VRRM.

Key specifications

Parameter Value
Manufacturer SMC(Sangdest Microelectronicstronic (Nanjing))
Package TO-220AB-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak / DC Blocking Voltage VRRM, VRWM, VR 60 V 1
Average Rectified Forward Current (Per Leg) IF(AV) 15 A 50% duty cycle @Tc=95°C, rectangular wave form 1
Average Rectified Forward Current (Per Device) IF(AV) 30 A 50% duty cycle @Tc=95°C, rectangular wave form 1
Peak One Cycle Non-Repetitive Surge Current (Per Leg) IFSM 200 A 8.3ms, Half Sine pulse, TC = 25 C 1
Forward Voltage Drop (Per Leg) 25C VF1 0.67 0.77 V @ 15A, Pulse, TJ = 25 C 1
Forward Voltage Drop (Per Leg) 125C VF2 0.65 0.67 V @ 15A, Pulse, TJ = 125 C 1
Reverse Current (Per Leg) 25C IR1 0.01 1 mA @VR = rated VR, TJ = 25 C 1
Reverse Current (Per Leg) 125C IR2 1 100 mA @VR = rated VR, TJ = 125 C 1
Junction Capacitance (Per Leg) CT 300 700 pF @VR = 5V, TC = 25 C, fSIG = 1MHz 1
Series Inductance (Per Leg) LS 8 nH Measured lead to lead 5 mm from package body 1
Voltage Rate of Change dv/dt 10000 V/s 1
Junction Temperature TJ -55 150 C 2
Storage Temperature Tstg -55 150 C 2
Typical Thermal Resistance Junction to Case RθJC 3 C/W DC operation 2
Typical Thermal Resistance Case to Heat Sink RθJS 60 C/W DC operation 2

CAD (KiCad official)

  • Symbol: MBR3060CTP
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220AB-3 (KiCad packages3D, STEP)
  • 3D model files: mbr3060ctp-etched.step / mbr3060ctp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbr3060ctp.step / mbr3060ctp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SMC(Sangdest Microelectronicstronic (Nanjing)) datasheet (4 pp, sha256 3d77d17db1f9906e, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF