Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

SN74HC112N

XBLW · Flip Flops · DIP-16

SN74HC112N from XBLW, in a DIP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1CP input Clock input for flip-flop 1, edge-triggered on the HIGH-to-LOW transition.
2 1K input Data input K for flip-flop 1.
3 1J input Data input J for flip-flop 1.
4 1S input Set input for flip-flop 1, active LOW.
5 1Q output True flip-flop output of flip-flop 1.
6 1Q output Complement flip-flop output of flip-flop 1.
7 2Q output Complement flip-flop output of flip-flop 2.
8 GND power_in Ground (0 V) reference for the device.
9 2Q output True flip-flop output of flip-flop 2.
10 2S input Set input for flip-flop 2, active LOW.
11 2J input Data input J for flip-flop 2.
12 2K input Data input K for flip-flop 2.
13 2CP input Clock input for flip-flop 2, edge-triggered on the HIGH-to-LOW transition.
14 2R input Reset input for flip-flop 2, active LOW.
15 1R input Reset input for flip-flop 1, active LOW.
16 VCC power_in Supply voltage; the SN74HC112 operates from 2 V to 6 V per the datasheet features list.

Key specifications

Parameter Value
Manufacturer XBLW
Package DIP-16
Category Logic
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
supply voltage VCC -0.5 7 V Tamb=25℃; voltages referenced to Vss 3
ground current IGND -50 mA Tamb=25℃ 3
input clamping current IIK -20 20 mA VI < -0.5V or VI > VCC+0.5V 3
output clamping current IOK -20 20 mA VO < -0.5V or VO > VCC+0.5V 3
output current IO -25 25 mA -0.5V < VO < VCC+0.5V 3
storage temperature Tstg -65 150 ℃ 3
soldering temperature (DIP) TL 245 ℃ 10s, DIP package 3
HIGH-level input voltage VIH 1.5 1.2 V Tamb=-40℃ to +85℃; VCC=2.0V 3
HIGH-level input voltage VIH 3.15 2.4 V Tamb=-40℃ to +85℃; VCC=4.5V 3
HIGH-level input voltage VIH 4.2 3.2 V Tamb=-40℃ to +85℃; VCC=6.0V 3
LOW-level input voltage VIL 0.8 0.5 V Tamb=-40℃ to +85℃; VCC=2.0V 3
LOW-level input voltage VIL 2.1 1.35 V Tamb=-40℃ to +85℃; VCC=4.5V 3
LOW-level input voltage VIL 2.8 1.8 V Tamb=-40℃ to +85℃; VCC=6.0V 3
HIGH-level output voltage VOH 1.9 2 V Tamb=-40℃ to +85℃; VCC=2.0V; IO=-20uA 3
HIGH-level output voltage VOH 4.4 4.5 V Tamb=-40℃ to +85℃; VCC=4.5V; IO=-20uA 3
HIGH-level output voltage VOH 5.9 6 V Tamb=-40℃ to +85℃; VCC=6.0V; IO=-20uA 3
HIGH-level output voltage VOH 3.84 4.32 V Tamb=-40℃ to +85℃; VCC=4.5V; IO=-4.0mA 3
HIGH-level output voltage VOH 5.34 5.81 V Tamb=-40℃ to +85℃; VCC=6.0V; IO=-5.2mA 3
LOW-level output voltage VOL 0 0.1 V Tamb=-40℃ to +85℃; VCC=2.0V; IO=20uA 3
LOW-level output voltage VOL 0.15 0.33 V Tamb=-40℃ to +85℃; VCC=4.5V; IO=4.0mA 3
LOW-level output voltage VOL 0.16 0.33 V Tamb=-40℃ to +85℃; VCC=6.0V; IO=5.2mA 3
input leakage current II -1 1 uA Tamb=-40℃ to +85℃; VCC=6.0V; VI=VCC or GND 3
supply current ICC 80 uA Tamb=-40℃ to +85℃; VCC=6.0V; VI=VCC or GND; IO=0A 3
HIGH-level input voltage VIH 1.5 V Tamb=-40℃ to +125℃; VCC=2.0V 4
HIGH-level input voltage VIH 3.15 V Tamb=-40℃ to +125℃; VCC=4.5V 4
HIGH-level input voltage VIH 4.2 V Tamb=-40℃ to +125℃; VCC=6.0V 4
LOW-level input voltage VIL 0.5 V Tamb=-40℃ to +125℃; VCC=2.0V 4
LOW-level input voltage VIL 1.35 V Tamb=-40℃ to +125℃; VCC=4.5V 4
LOW-level input voltage VIL 1.8 V Tamb=-40℃ to +125℃; VCC=6.0V 4
HIGH-level output voltage VOH 1.9 V Tamb=-40℃ to +125℃; VCC=2.0V; IO=-20uA 4
HIGH-level output voltage VOH 4.4 V Tamb=-40℃ to +125℃; VCC=4.5V; IO=-20uA 4
HIGH-level output voltage VOH 5.9 V Tamb=-40℃ to +125℃; VCC=6.0V; IO=-20uA 4
HIGH-level output voltage VOH 3.7 V Tamb=-40℃ to +125℃; VCC=4.5V; IO=-4.0mA 4
HIGH-level output voltage VOH 5.2 V Tamb=-40℃ to +125℃; VCC=6.0V; IO=-5.2mA 4
LOW-level output voltage VOL 0.1 V Tamb=-40℃ to +125℃; VCC=2.0V; IO=20uA 4
LOW-level output voltage VOL 0.4 V Tamb=-40℃ to +125℃; VCC=4.5V; IO=4.0mA 4
input leakage current II -1 1 uA Tamb=-40℃ to +125℃; VCC=6.0V; VI=VCC or GND 4
supply current ICC 160 uA Tamb=-40℃ to +125℃; VCC=6.0V; VI=VCC or GND; IO=0A 4
nCP to nQ propagation delay tPLH, tPHL 55 220 ns Tamb=-40℃ to +85℃; VCC=2.0V; CL=50pF; see Figure 5 5
nCP to nQ propagation delay tPLH, tPHL 20 44 ns Tamb=-40℃ to +85℃; VCC=4.5V; CL=50pF; see Figure 5 5
nCP to nQ propagation delay tPLH, tPHL 16 37 ns Tamb=-40℃ to +85℃; VCC=6.0V; CL=50pF; see Figure 5 5
nS to nQ propagation delay tPLH, tPHL 18 39 ns Tamb=-40℃ to +85℃; VCC=4.5V; CL=50pF; see Figure 6 5
transition time tTHL, tTLH 7 19 ns Tamb=-40℃ to +85℃; VCC=4.5V; CL=50pF; see Figure 5 5
nCP HIGH or LOW pulse width tw 20 8 ns Tamb=-40℃ to +85℃; VCC=4.5V; CL=50pF; see Figure 5 5
nJ and nK to nCP set-up time tsu 20 7 ns Tamb=-40℃ to +85℃; VCC=4.5V; CL=50pF; see Figure 5 5
nJ and nK to nCP hold time th 0 -4 ns Tamb=-40℃ to +85℃; VCC=4.5V; CL=50pF; see Figure 5 5
maximum frequency fmax 24 60 MHz Tamb=-40℃ to +85℃; VCC=4.5V; CL=50pF; see Figure 5 5
maximum frequency fmax 28 71 MHz Tamb=-40℃ to +85℃; VCC=6.0V; CL=50pF; see Figure 5 6
nCP to nQ propagation delay tPLH, tPHL 265 ns Tamb=-40℃ to +125℃; VCC=2.0V; CL=50pF; see Figure 3 6
nCP to nQ propagation delay tPLH, tPHL 53 ns Tamb=-40℃ to +125℃; VCC=4.5V; CL=50pF; see Figure 3 6
nCP to nQ propagation delay tPLH, tPHL 45 ns Tamb=-40℃ to +125℃; VCC=6.0V; CL=50pF; see Figure 3 6
nJ and nK to nCP set-up time tsu 120 ns Tamb=-40℃ to +125℃; VCC=2.0V; CL=50pF; see Figure 3 7
nJ and nK to nCP set-up time tsu 24 ns Tamb=-40℃ to +125℃; VCC=4.5V; CL=50pF; see Figure 3 7
maximum frequency fmax 20 MHZ Tamb=-40℃ to +125℃; VCC=4.5V; CL=50pF; see Figure 3 7
maximum frequency fmax 24 NHZ Tamb=-40℃ to +125℃; VCC=6.0V; CL=50pF; see Figure 3 7

CAD (KiCad official)

  • Symbol: SN74HC112N
  • Footprint: Package_DIP:DIP-16_W7.62mm
  • 3D model: DIP-16 (KiCad packages3D, STEP)
  • 3D model files: sn74hc112n-etched.step / sn74hc112n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74hc112n.step / sn74hc112n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XBLW datasheet (14 pp, sha256 566b4af3aceaa0c1, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF