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Contents

README

markdown

BZX84B3V3LT1G

onsemi · Zener Diodes · SOT-23

BZX84B3V3LT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ANODE passive Zener diode anode, per the STYLE 8 pin assignment in the SOT-23 package drawing and the pinout note in the electrical characteristics tables.
2 NC unconnected No connection; the datasheet lists this pin as 'No Connection' and it should be left unconnected.
3 CATHODE passive Zener diode cathode, indicated by the polarity band on the package, per the STYLE 8 pin assignment.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage VZ 3.23 3.3 3.37 V @ IZT = 5 mA 4
Maximum Zener Impedance ZZT 95 Ω @ IZT = 5 mA 4
Reverse Leakage Current IR 5 µA @ VR = 1 V 4
Maximum Temperature Coefficient of VZ VZ -3.5 0 mV/k @ IZT = 5 mA 4
Maximum Capacitance C 450 pF @ VR = 0, f = 1 MHz 4
Forward Voltage VF 0.9 V @ IF = 10 mA 4
Total Power Dissipation on FR-5 Board PD 250 mW @ TA = 25°C, FR-5 board (Note 1) 2
Derating above 25°C (FR-5 Board) PD 2 mW/°C Derated above 25°C, FR-5 board 2
Thermal Resistance, Junction-to-Ambient (FR-5 Board) RJA 500 °C/W FR-5 board (Note 1) 2
Total Power Dissipation on Alumina Substrate PD 300 mW Alumina substrate (Note 2) @ TA = 25°C 2
Derating above 25°C (Alumina Substrate) PD 2.4 mW/°C Derated above 25°C, alumina substrate (Note 2) 2
Thermal Resistance, Junction-to-Ambient (Alumina Substrate) RJA 417 °C/W Alumina substrate (Note 2) 2
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 2

CAD (KiCad official)

  • Symbol: BZX84B3V3LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bzx84b3v3lt1g-etched.step / bzx84b3v3lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84b3v3lt1g.step / bzx84b3v3lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 998d08e79ff43b40, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF